74LCX07MX

74LCX07MX FAIRCHILD | Alldatasheet

Document overview

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Technical content

Features

2.3V to 5.5V V CC specifications provided 2.9ns t PD max. (V CC 3.3V), 10µA I CC max. Power down high impedance inputs and outputs +24mA output drive (V CC 3.0V) Latch-up performance exceeds JEDEC 78 conditions ESD performance: – Human body model 2000V – Machine model 200V Leadless DQFN package General Description The LCX07 contains six buffers. The inputs tolerate volt- ages up to 7V allowing the interface of 5V systems to 3V systems. The outputs of the LCX07 are open drain and can be connected to other open drain outputs to implement active HIGH wire AND or active LOW wire OR functions. The 74LCX07 is fabricated with advanced CMOS tech- nology to achieve high speed operation while maintain- ing CMOS low power dissipation.

Ordering Information

Note: 1. DQFN package available in Tape and Reel only. Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. Order Number Package Number Package Description 74LCX07M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow 74LCX07SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LCX07BQX (1) MLP14A 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm 74LCX07MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Implements proprietary noise/EMI reduction circuitry

©1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX07 Rev. 1.11.0 2 74LCX07 — Low Voltage Hex Buffer with Open Drain Outputs Connection Diagram Pin Assignments for SOIC, SOP, and TSSOP Pad Assignments for DQFN (Top Through View) Pin Description Logic Symbol IEEE/IEC Pin Names Description A n Inputs O n Outputs

©1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX07 Rev. 1.11.0 3 74LCX07 — Low Voltage Hex Buffer with Open Drain Outputs Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Note: 2. I O Absolute Maximum Rating must be observed. Recommended Operating Conditions (3) The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Note: 3. Unused inputs must be held HIGH or LOW. They may not float. Symbol Parameter Rating V CC Supply Voltage –0.5V to +7.0V V I DC Input Voltage –0.5V to +7.0V V O DC Output Voltage, Output in HIGH or LOW State (2) –0.5V to +7.0V I IK DC Input Diode Current, V I GND –50mA I OK DC Output Diode Current V O GND –50mA V O V CC +50mA I O DC Output Current ±50mA I CC DC Supply Current per Supply Pin ±100mA I GND DC Ground Current per Ground Pin ±100mA T STG Storage Temperature –65°C to +150°C Symbol Parameter Min. Max. Units V CC Supply Voltage Operating 2.0 5.5 V Data Retention 1.5 5.5 V I Input Voltage 0 5.5 V V O Output Voltage 0 5.5 V I OL Output Current V CC 4.5V–5.5V +32 mA V CC 3.0V–3.6V +24 V CC 2.7V–3.0V +12 V CC 2.3V–2.7V +8 T A Free-Air Operating Temperature –40 85 °C t V Input Edge Rate, V IN 0.8V–2.0V, V CC 3.0V 0 10 ns V

©1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX07 Rev. 1.11.0 4 74LCX07 — Low Voltage Hex Buffer with Open Drain Outputs Symbol Parameter V CC (V) Conditions T A –40°C to +85°C UnitsMin. Max. V IH HIGH Level Input Voltage 2.3–2.7 1.7 V 2.7–3.6 2.0 4.5–5.5 0.7 x V CC V IL LOW Level Input Voltage 2.3–2.7 0.7 V 2.7–3.6 0.8 4.5–5.5 0.3 x V CC V OL LOW Level Output Voltage 2.3–5.5 I OL 100µA 0.2 V 2.3 I OL 8mA 0.6 2.7 I OL 12mA 0.4 3.0 I OL 16mA 0.4 3.0 I OL 24mA 0.55 4.5 I OL 32mA 0.55 I I Input Leakage Current 2.3–5.5 0 V I 5.5V ±5.0 µA I OFF Power-Off Leakage Current 0 V I or V O 5.5V 10 µA I CC Quiescent Supply Current 2.3–5.5 V I V CC or GND 10 µA 2.3–5.5 3.6V V I 5.5V ±10 I CC Increase in I CC per Input 2.3–3.6 V IH V CC – 0.6V 500 µA 4.5–5.5 1 mA I OHZ Off State Current 2–5.5 V O 5.5V 10 µA Symbol Parameter T A –40°C to +85°C, R L 500 Ω Units V CC = 5.0V ± 0.5V, CL= 50pF VCC = 3.3V ± 0.3V, CL= 50pF VCC = 2.7V, CL= 50pF VCC = 2.5V ± 0.2V, CL= 30pF Min. Max. Min. Max. Min Max Min Max tPZL, tPLZ Propagation Delay Time

©1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX07 Rev. 1.11.0 5 74LCX07 — Low Voltage Hex Buffer with Open Drain Outputs Dynamic Switching Characteristics Capacitance Symbol Parameter V CC (V) Conditions TA = 25°C UnitTypical VOLP Quiet Output Dynamic Peak VOL 3.3 C L = 50pF , VIH = 3.3V, VIL = 0V 0.9 V 2.5 C L = 30pF , VIH = 2.5V, VIL = 0V 0.7 VOLV Quiet Output Dynamic Valley VOL 3.3 C L = 50pF , VIH = 3.3V, VIL = 0V –0.8 V 2.5 C L = 30pF , VIH = 2.5V, VIL = 0V –0.6 Symbol Parameter Conditions Typical Units CIN Input Capacitance V CC = Open, VI = 0V or VCC 7p F COUT Output Capacitance V CC = 3.3V, VI = 0V or VCC 8p F CPD Power Dissipation Capacitance V CC = 3.3V, VI = 0V or VCC, f = 10MHz 25 pF

©1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX07 Rev. 1.11.0 7 74LCX07 — Low Voltage Hex Buffer with Open Drain Outputs Tape and Reel Specification Tape Format for DQFN Tape Dimensions inches (millimeters) Reel Dimensions inches (millimeters) Package Designator Tape Section Number of Cavities Cavity Status Cover Tape Status BQX Leader (Start End) 125 (Typ.) Empty Sealed Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typ.) Empty Sealed Tape Size A B C D N W1 W2

Figure 3. 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow specifically the warranty therein, which covers Fairchild products. B) ALL DIMENSIONS ARE IN MILLIMETERS.

1.75 MAX

Figure 4. 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide specifically the warranty therein, which covers Fairchild products.

Figure 5. 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm specifically the warranty therein, which covers Fairchild products.

Figure 6. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide specifically the warranty therein, which covers Fairchild products.

0.43 TYP

©1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX07 Rev. 1.11.0 12 TRADEMARKS Thef ollowing includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. ACEx® Build it Now™ CorePLUS™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK EZSWITCH™ * Fairchild® Fairchild Semiconductor® FACT Quiet Series™ FACT® FAST® FastvCore™ FlashWriter®* FPS™ FRFET Global Power Resource SM Green FPS™ Green FPS™e-Series™ GTO™ i-Lo™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ Motion-SPM™ OPTOLOGIC OPTOPLANAR® PDP-SPM™ Power220® POWEREDGE® Power-SPM™ PowerTrench® Programmable Active Droop™ QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ SMART START™ SPM STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™ -6 SuperSOT™ -8 SupreMOS™ SyncFET™ The Power Franchise® TinyBoost™ TinyBuck™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ µSerDes™ UHC Ultra FRFET™ UniFET™ VCX™ *E Z S W ITCH™ and FlashWriter ® are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHERDOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I33 74LCX07 — Low Voltage Hex Buffer with Open Drain Outputs