74LCX07 ONSEMI | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 13

Technical content

To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. Is Now Part of ON Semiconductor and the ON Semiconductor logo are trademarks of Semico nductor Components Industries, LLC dba ON Semiconductor or its subsid iaries in the United States and/or other countries. ON Semiconductor ow ns the rights to a number to make changes without further notice to any products herein. ON Semicon ductor makes no warranty, representation or guarantee regarding the s uitability of its products for any particular purpose, nor does ON Semico nductor assume any liability arising out of the application or use of any product or circuit, and specifica lly disclaims any and all liability, including without limitation spe cial, consequential or incidental damages. Buyer is responsible for i ts products and applications using ON Semiconductor products, including compliance with all laws, regul ations and safety requirements or standards, regardless of any suppor t or applications information provided by ON Semiconductor. “Typica l” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in diffe rent applications and actual performance may vary over time. All operat ing parameters, including “Typicals” must be validated for each custo mer application by customer’s technical experts. ON Semiconductor does not convey any license und er its patent rights nor the rights of others. ON Semiconductor products a re not designed, intended, or authorized for use as a critical compone nt in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classifica tion in a foreign jurisdiction or any devices intended for implantation i n the human body. Should Buyer purchase or use ON Semiconductor products fo r any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semico nductor and its officers, employees, subsidiaries, affiliates, and di stributors harmless against all claims, costs, damages, and expense s, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associa ted with such unintended or unauthorized use, even if such claim alleges th at ON Semiconductor was negligent regarding the design or manufacture o f the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literatu re is subject to all applicable copyright laws and is not for resale in any manne r.

74LCX07 — Low Voltage Hex Buffer with Open Drain Outputs ©1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX07 Rev. 1.11.1 74LCX07 Low Voltage Hex Buffer with Open Drain Outputs

Features

2.3V to 5.5V V CC specifications provided 2.9ns t PD max. (V CC 3.3V), 10µA I CC max. Power down high impedance inputs and outputs +24mA output drive (V CC 3.0V) Latch-up performance exceeds JEDEC 78 conditions ESD performance: – Human body model 2000V – Machine model 200V Leadless DQFN package General Description The LCX07 contains six buffers. The inputs tolerate volt- ages up to 7V allowing the interface of 5V systems to 3V systems. The outputs of the LCX07 are open drain and can be connected to other open drain outputs to implement active HIGH wire AND or active LOW wire OR functions. The 74LCX07 is fabricated with advanced CMOS tech- nology to achieve high speed operation while maintain- ing CMOS low power dissipation.

Ordering Information

Note: 1. DQFN package available in Tape and Reel only. Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. Order Number Package Number Package Description 74LCX07M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow 74LCX07SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LCX07BQX (1) MLP14A 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm 74LCX07MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Implements proprietary noise/EMI reduction circuitry December 2013

©1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX07 Rev. 1.11.1 2 74LCX07 — Low Voltage Hex Buffer with Open Drain Outputs Connection Diagram Pin Assignments for SOIC, SOP, and TSSOP Pad Assignments for DQFN (Top Through View) Pin Description Logic Symbol IEEE/IEC Pin Names Description A n Inputs O n Outputs (Bottom View) DAP No Connect Note: DAP (Die Attach Pad)

©1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX07 — Low Voltage Hex Buffer with Open Drain Outputs Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Note: 2. I O Absolute Maximum Rating must be observed. Recommended Operating Conditions (3) The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Note: 3. Unused inputs must be held HIGH or LOW. They may not float. Symbol Parameter Rating V CC Supply Voltage –0.5V to +7.0V V I DC Input Voltage –0.5V to +7.0V V O DC Output Voltage, Output in HIGH or LOW State (2) –0.5V to +7.0V I IK DC Input Diode Current, V I GND –50mA I OK DC Output Diode Current V O GND –50mA V O V CC +50mA I O DC Output Current ±50mA I CC DC Supply Current per Supply Pin ±100mA I GND DC Ground Current per Ground Pin ±100mA T STG Storage Temperature –65°C to +150°C Symbol Parameter Min. Max. Units V CC Supply Voltage Operating 2.0 5.5 V Data Retention 1.5 5.5 V I Input Voltage 0 5.5 V V O Output Voltage 0 5.5 V I OL Output Current V CC 4.5V–5.5V +32 mA V CC 3.0V–3.6V +24 V CC 2.7V–3.0V +12 V CC 2.3V–2.7V +8 T A Free-Air Operating Temperature –40 85 °C t V Input Edge Rate, V IN 0.8V–2.0V, V CC 3.0V 0 10 ns V 74LCX07 Rev. 1.11.1 3

©1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX07 — Low Voltage Hex Buffer with Open Drain Outputs Symbol Parameter V CC (V) Conditions T A –40°C to +85°C UnitsMin. Max. V IH HIGH Level Input Voltage 2.3–2.7 1.7 V 2.7–3.6 2.0 4.5–5.5 0.7 x V CC V IL LOW Level Input Voltage 2.3–2.7 0.7 V 2.7–3.6 0.8 4.5–5.5 0.3 x V CC V OL LOW Level Output Voltage 2.3–5.5 I OL 100µA 0.2 V 2.3 I OL 8mA 0.6 2.7 I OL 12mA 0.4 3.0 I OL 16mA 0.4 3.0 I OL 24mA 0.55 4.5 I OL 32mA 0.55 I I Input Leakage Current 2.3–5.5 0 V I 5.5V ±5.0 µA I OFF Power-Off Leakage Current 0 V I or V O 5.5V 10 µA I CC Quiescent Supply Current 2.3–5.5 V I V CC or GND 10 µA 2.3–5.5 3.6V V I 5.5V ±10 I CC Increase in I CC per Input 2.3–3.6 V IH V CC – 0.6V 500 µA 4.5–5.5 1 mA I OHZ Off State Current 2–5.5 V O 5.5V 10 µA Symbol Parameter T A –40°C to +85°C, R L 500 Ω Units V CC = 5.0V ± 0.5V, CL= 50pF VCC = 3.3V ± 0.3V, CL= 50pF VCC = 2.7V, CL= 50pF VCC = 2.5V ± 0.2V, CL= 30pF Min. Max. Min. Max. Min Max Min Max tPZL, tPLZ Propagation Delay Time 74LCX07 Rev. 1.11.1 4

©1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX07 — Low Voltage Hex Buffer with Open Drain Outputs Dynamic Switching Characteristics Capacitance Symbol Parameter V CC (V) Conditions TA = 25°C UnitTypical VOLP Quiet Output Dynamic Peak VOL 3.3 C L = 50pF , VIH = 3.3V, VIL = 0V 0.9 V 2.5 C L = 30pF , VIH = 2.5V, VIL = 0V 0.7 VOLV Quiet Output Dynamic Valley VOL 3.3 C L = 50pF , VIH = 3.3V, VIL = 0V –0.8 V 2.5 C L = 30pF , VIH = 2.5V, VIL = 0V –0.6 Symbol Parameter Conditions Typical Units CIN Input Capacitance V CC = Open, VI = 0V or VCC 7p F COUT Output Capacitance V CC = 3.3V, VI = 0V or VCC 8p F CPD Power Dissipation Capacitance V CC = 3.3V, VI = 0V or VCC, f = 10MHz 25 pF 74LCX07 Rev. 1.11.1 5

©1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX07 — Low Voltage Hex Buffer with Open Drain Outputs Tape and Reel Specification Tape Format for DQFN Tape Dimensions inches (millimeters) Reel Dimensions inches (millimeters) Package Designator Tape Section Number of Cavities Cavity Status Cover Tape Status BQX Leader (Start End) 125 (Typ.) Empty Sealed Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typ.) Empty Sealed Tape Size A B C D N W1 W2 74LCX07 Rev. 1.11.1 7

NOTES: A. CONFORMS TO JEDEC REGISTRATION MO-153, VARIATION AB, REF NOTE 6 B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND TIE BAR EXTRUSIONS D. DIMENSIONING AND TOLERANCES PER ANSI Y14.5M, 2009. E. LANDPATTERN STANDARD: SOP65P640X110-14M. F. DRAWING FILE NAME: MKT-MTC14rev7. 0.43TYP

0.2 C B A

A B 3.2 6.4 PIN#1 IDENT

1.2 MAX

0.1 C ALL LEAD TIPS C 0.65 0.30 0.19

0.13 A B C

0.90+0.15 -0.10 0.20 0.09 SEE DETAIL A ƒ723 %27720 GAGE PLANE 0.25 SEATING PLANE

0.09 MIN

1.00 DETAIL A RECOMMENDED LAND PATTERN 6.10 0.65 1.65 0.45

1.70 5.60 1.27 0.65 1.50 1.25

1.75 MAX

0.25 0.10 C 4.00 3.80 8.75 8.50 6.00 (0.33) 0.51 0.35 7.62 1.27 1PIN #1 IDENT. A B 0.25 0.19 A 0.50 0.25 x 45 R0.10 R0.10 (1.04) 0.36 0.90 0.50 DETAIL A SCALE 16 : 1 GAGE PLANE SEATING PLANE TOP VIEW FRONT VIEW SIDE VIEW 1 7 LAND PATTERN RECOMMENDATION NOTES: A. CONFORMS TO JEDEC MS-012, VARIATION AB, ISSUE C B. ALL DIMENSIONS ARE IN MILLIMETERS C. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR BURRS D. LAND PATTERN STANDARD: SOIC127P600X145-14M E. CONFORMS TO ASME Y14.5M, 2009 D. DRAWING FILENAME: MKT-M14Arev14 0.10 C

0.25 M C B A

B. DIMENSIONS ARE IN MILLIMETERS. A. CONFORMS TO JEDEC REGISTRATION MO-241, VARIATION AA TOP VIEW BOTTOM VIEW RECOMMENDED LAND PATTERN A B SIDE VIEW PIN #1 IDENT 3.00 2.50 0.50 0.50 2.00 1.00 MAX 1.70 MAX 3.50 MAX

1.40 MAX

2.20 MAX

4.00 MAX

0.50 TYP 0.24 TYP (0.90)

0.50 TYP

0.05 C 0.05 C 0.08 C 0.10 C SEATING PLANE C

0.10 C A B

0.05 C PIN #1 QUADRANT C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009. D. LAND PATTERN RECOMMENDATION IS EXISTING INDUSTRY LAND PATTERN. E. DRAWING FILENAME: MKT-MLP14Arev2. (14X) (14X)

www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries i n the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . A listing of ON Semiconductor’s product/patent ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the right s of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative  Semiconductor Components Industries, LLC