74HC00 ONSEMI | Alldatasheet

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Technical content

Features

  • /C0259Output Drive Capability: 10 LSTTL Loads
  • /C0259Outputs Directly Interface to CMOS, NMOS and TTL
  • /C0259Operating V oltage Range: 2.0 to 6.0 V
  • /C0259Low Input Current: 1.0 /C0109A
  • /C0259High Noise Immunity Characteristic of CMOS Devices
  • /C0259In Compliance With the JEDEC Standard No. 7A Requirements
  • /C0259ESD Performance: HBM /C0062 2000 V; Machine Model /C0062 200 V
  • /C0259Chip Complexity: 32 FETs or 8 Equivalent Gates
  • /C0259These are Pb-Free Devices 3 Y1 1A1 PIN 14 = VCC PIN 7 = GND LOGIC DIAGRAM 2B1 6 Y2 4A2 5B2 8 Y3 9A3 10B3 11 Y4 12A4 13B4 Y = AB Pinout: 14-Lead Packages (Top View) 1314 12 11 10 9 8 21 34567 VCC B4 A4 Y4 B3 A3 Y3 A1 B1 Y1 A2 B2 Y2 GND MARKING DIAGRAMS HC00 = Device Code A = Assembly Location WL or L = Wafer Lot Y = Year WW or W = Work Week G or /C0071= Pb-Free Package L L H H L H L H FUNCTION TABLE Inputs Output AB H H H L Y See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

http://onsemi.com TSSOP-14 DT SUFFIX CASE 948G SOIC-14 D SUFFIX CASE 751A HC00G AWLYWW HC ALYW/C0258/C0071 /C0071 (Note: Microdot may be in either location)

http://onsemi.com ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) – 0.5 to + 7.0 V Vin DC Input Voltage (Referenced to GND) – 0.5 to VCC + 0.5 V Vout DC Output Voltage (Referenced to GND) – 0.5 to VCC + 0.5 V Iin DC Input Current, per Pin ±20 mA Iout DC Output Current, per Pin ±25 mA ICC DC Supply Current, VCC and GND Pins ±50 mA PD Power Dissipation in Still Air, SOIC Package† 500 450 mW Tstg Storage Temperature – 65 to + 150 /C0095C TL Lead Temperature, 1 mm from Case for 10 s SOIC or TSSOP Package 260 /C0095C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above t he Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. †Derating — SOIC Package: – 7 mW/ /C0095C from 65/C0095 to 125/C0095C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High- Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC DC Supply Voltage (Referenced to GND) 2.0 6.0 V Vin, Vout DC Input Voltage, Output Voltage (Referenced to GND)

0 VCC V

TA Operating Temperature, All Package Types – 55 + 125 /C0095C tr, tf Input Rise and Fall Time V CC = 2.0 V /C0261(Figure 1) V CC = 4.5 V VCC = 6.0 V 1000 500 400 ns Device Package Shipping† 74HC00DR2G SOIC-14 (Pb-Free) 2500/Tape & Reel 74HC00DTR2G TSSOP-14* †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free. /C0261This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, V in and Vout should be constrained to the range GND /C0118 (Vin or Vout) /C0118 VCC. /C0261Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V CC). Unused outputs must be left open.

http://onsemi.com DC CHARACTERISTICS (Voltages Referenced to GND) VCC (V) Guaranteed Limit Symbol Parameter Condition -55 to 25 °C ≤85°C ≤125°C Unit VIH Minimum High-Level Input Voltage Vout = 0.1V or VCC -0.1V |Iout| ≤ 20/C0109A 2.0 3.0 4.5 6.0 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 V VIL Maximum Low-Level Input Voltage Vout = 0.1V or VCC - 0.1V |Iout| ≤ 20/C0109A 2.0 3.0 4.5 6.0 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 V VOH Minimum High-Level Output Voltage Vin = VIH or VIL |Iout| ≤ 20/C0109A 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V Vin =VIH or VIL |Iout| ≤ 2.4mA |Iout| ≤ 4.0mA |Iout| ≤ 5.2mA 3.0 4.5 6.0 2.48 3.98 5.48 2.34 3.84 5.34 2.20 3.70 5.20 VOL Maximum Low-Level Output Voltage Vin = VIH or VIL |Iout| ≤ 20/C0109A 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V Vin = VIH or VIL |Iout| ≤ 2.4mA |Iout| ≤ 4.0mA |Iout| ≤ 5.2mA 3.0 4.5 6.0 0.26 0.26 0.26 0.33 0.33 0.33 0.40 0.40 0.40 Iin Maximum Input Leakage Current Vin = VCC or GND 6.0 ±0.1 ±1.0 ±1.0 /C0109A ICC Maximum Quiescent Supply Current (per Package) Vin = VCC or GND Iout = 0/C0109A 6.0 2.0 20 40 /C0109A NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High- Speed CMOS Data Book (DL129/D). AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns) VCC (V) Guaranteed Limit Symbol Parameter -55 to 25 °C ≤85°C ≤125°C Unit tPLH, tPHL Maximum Propagation Delay, Input A or B to Output Y (Figures 1 and 2) 2.0 3.0 4.5 6.0 110 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figures 1 and 2) 2.0 3.0 4.5 6.0 110 ns Cin Maximum Input Capacitance 10 10 10 pF NOTE: For propagation delays with loads other than 50 pF, and info rmation on typical parametric values, see Chapter 2 of the ON Semiconductor High- Speed CMOS Data Book (DL129/D). CPD Power Dissipation Capacitance (Per Buffer)* Typical @ 25°C, VCC = 5.0 V, VEE = 0 V pF22 * Used to determine the no- load dynamic power consumption: P D = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the ON Semiconductor High- Speed CMOS Data Book (DL129/D).

http://onsemi.com PACKAGE DIMENSIONS SOIC-14 CASE 751A-03 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. -A- -B- G P 7 PL 14 8 M0.25 (0.010) B M SBM0.25 (0.010) A ST -T- FR X 45 SEATING PLANE D 14 PL K C JM /C0095 DIM MIN MAX MIN MAX INCHESMILLIMETERS A 8.55 8.75 0.337 0.344 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.228 0.244 R 0.25 0.50 0.010 0.019 /C0095/C0095/C0095/C0095 7.04 14X 0.58 14X 1.52 1.27 DIMENSIONS: MILLIMETERS PITCH SOLDERING FOOTPRINT* *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com PACKAGE DIMENSIONS TSSOP-14 CASE 948G-01 ISSUE B DIM MIN MAX MIN MAX INCHESMILLIMETERS A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0 8 0 8 NOTES: /C0261/C02591. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. /C0261/C02592. CONTROLLING DIMENSION: MILLIMETER. /C0261/C02593. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. /C0261/C02594. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. /C0261/C02595. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. /C0261/C02596. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. /C0261/C02597. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. /C0095/C0095/C0095/C0095 SU0.15 (0.006) T 2X L/2 SUM0.10 (0.004) V ST L -U- SEATING PLANE 0.10 (0.004) -T- ÇÇÇ ÇÇÇ SECTION N-N DETAIL E J J1 K ÉÉÉ ÉÉÉ DETAIL E F M -W- 0.25 (0.010) 814 PIN 1 IDENT. HG A D C B SU0.15 (0.006) T -V- 14X REFK N N 7.06 14X 0.36 14X 1.26 0.65 DIMENSIONS: MILLIMETERS PITCH SOLDERING FOOTPRINT* *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

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