74FST3400_06 ONSEMI | Alldatasheet

Document overview

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  • PDF pages: 8

Technical content

Features

  • RON /C0116 4 /C0087 Typical
  • Less Than 0.25 ns−Max Delay Through Switch
  • Nearly Zero Standby Current
  • No Circuit Bounce
  • Control Inputs are TTL/CMOS Compatible
  • Pin−For−Pin Compatible With QS3400, FST3400, CBT3400
  • All Popular Packages: SOIC−24, TSSOP−24, QSOP−24
  • All Devices in Package TSSOP are Inherently Pb−Free*

Figure 1. 24−Lead Pinout Reference Manual, SOLDERRM/D.

Description

Bus Enable Input (Active LOW) Ax, Bx, Cx, Dx Bus A, Bus B, Bus C, Bus D BX0 Bus Exchange (Bit 0) BX1 Bus Exchange (Bit 1) BX2 Bus Exchange (Bit 2) BX3 Bus Exchange (Bit 3) NC No Connect GND Ground VCC Power See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

http://onsemi.com

http://onsemi.com Figure 2. Logic Diagram Device Package Shipping† 74FST3400DW SOIC−24 30 Units / Rail 74FST3400DWR2 SOIC−24 1000 / Tape & Reel 74FST3400DT TSSOP−24* (Pb−Free)

62 Units / Rail

74FST3400DTR2 TSSOP−24* (Pb−Free) 2500 / Tape & Reel 74FST3400QS QSOP−24 55 Units / Rail 74FST3400QSR QSOP−24 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free.

http://onsemi.com MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage /C00420.5 to /C00417.0 V VI DC Input Voltage /C00420.5 to /C00417.0 V VO DC Output Voltage /C00420.5 to /C00417.0 V IIK DC Input Diode Current V I /C0116 GND /C004250 mA IOK DC Output Diode Current V O /C0116 GND /C004250 mA IO DC Output Sink Current 128 mA ICC DC Supply Current per Supply Pin /C0036100 mA IGND DC Ground Current per Ground Pin /C0036100 mA TSTG Storage Temperature Range /C004265 to /C0041150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias /C0041150 °C /C0113JA Thermal Resistance SOIC TSSOP QSOP 125 170 200 °C/W MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in VESD ESD Withstand Voltage Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) /C01172000 /C0117200 N/A V ILatchup Latchup Performance Above V CC and Below GND at 85°C (Note 4) /C0036500 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above t he Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Tested to EIA/JESD22−A114−A. 2. Tested to EIA/JESD22−A115−A. 3. Tested to JESD22−C101−A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC Supply Voltage Operating, Data Retention Only 4.0 5.5 V VI Input Voltage (Note 5) 0 5.5 V VO Output Voltage (HIGH or LOW State) 0 5.5 V TA Operating Free−Air Temperature /C004240 /C004185 °C /C0068t//C0068V Input Transition Rise or Fall Rate Switch Control Input Switch I/O V CC = 5.0 V /C0036 0.5 V 0 DC ns/V 5. Unused control inputs may not be left open. All control inputs must be tied to a high or low logic input voltage level.

http://onsemi.com DC ELECTRICAL CHARACTERISTICS Symbol Parameter Conditions VCC (V) TA = /C004240/C0053C to /C004185/C0053C UnitMin Typ* Max VIK Clamp Diode Resistance IIN = /C004218mA 4.5 /C00421.2 V VIH High−Level Input Voltage 4.0 to 5.5 2.0 V VIL Low−Level Input Voltage 4.0 to 5.5 0.8 V II Input Leakage Current 0 /C0118 VIN /C0118 5.5 V 5.5 /C00361.0 /C0109A IOZ OFF−STATE Leakage Current 0 /C0118 A, B /C0118 VCC 5.5 /C00361.0 /C0109A RON Switch On Resistance (Note 6) VIN = 0 V, IIN = 64 mA 4.5 4 7 /C0087 VIN = 0 V, IIN = 30 mA 4.5 4 7 VIN = 2.4 V, IIN = 15 mA 4.5 8 15 VIN = 2.4 V, IIN = 15 mA 4.0 11 20 ICC Quiescent Supply Current VIN = VCC or GND, IOUT = 0 5.5 3 /C0109A /C0068ICC Increase In ICC per Input One input at 3.4 V, Other inputs at VCC or GND 5.5 2.5 mA *Typical values are at VCC = 5.0 V and TA = 25°C. 6. Measured by the voltage drop between A and B pins at the indicated current through the switch. On resistance is determined by the lower of the voltages on the two (A or B) pins. AC ELECTRICAL CHARACTERISTICS Symbol Parameter Conditions TA = /C004240/C0053C to /C004185/C0053C CL = 50 pF, RU = RD = 500 /C0087 Unit VCC = 4.5−5.5 V VCC = 4.0 V Min Max Min Max tPHL, tPLH Prop Delay Bus to Bus (Note 7) VI = OPEN 0.25 0.25 ns Prop Delay, BXn to An, Bn, Cn or Dn 1.0 5.3 6.0 tPZH, tPZL Output Enable Time, BXn to An, Bn, Cn or Dn VI = 7 V for tPZL 1.0 5.8 6.5 ns Output Enable Time, IOE to An, Bn, Cn or Dn VI = OPEN for tPZH 1.0 5.8 6.5 tPHZ, tPLZ Output Disable Time, BXn to An, Bn, Cn or Dn VI = 7 V for tPLZ 1.0 5.3 6.2 ns Output Disable Time, IOE to An, Bn, Cn or Dn VI = OPEN for tPHZ 1.0 5.3 6.2 7. This parameter is guaranteed by design but is not tested. The bus switch contributes no propagation delay other than the RC delay of the typical On resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance). CAPACITANCE (Note 8) Symbol Parameter Conditions Typ Max Unit CIN Control Pin Input Capacitance VCC = 5.0 V 6 pF CI/O Port Input/Output Capacitance VCC, OE = 5.0 V 13 pF 8. T A = /C004125°C, f = 1 MHz, Capacitance is characterized but not tested.

http://onsemi.com PACKAGE DIMENSIONS SOIC−24 D SUFFIX CASE 751E−04 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− −B− P12X D24X 1324 M0.010 (0.25) B M SAM0.010 (0.25) B ST −T− G22X SEATING PLANE K C R X 45 /C0095 M F J DIM MIN MAX MIN MAX INCHESMILLIMETERS A 15.25 15.54 0.601 0.612 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.41 0.90 0.016 0.035 G 1.27 BSC 0.050 BSC J 0.23 0.32 0.009 0.013 K 0.13 0.29 0.005 0.011 M 0 8 0 8 P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029 /C0095/C0095/C0095/C0095

http://onsemi.com PACKAGE DIMENSIONS TSSOP−24 DT SUFFIX CASE 948H−01 ISSUE A DIM MIN MAX MIN MAX INCHESMILLIMETERS A 7.70 7.90 0.303 0.311 B 4.30 4.50 0.169 0.177 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0 8 0 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. /C0095/C0095/C0095/C0095 SU0.15 (0.006) T 2X L/2 SUM0.10 (0.004) V ST L −U− SEATING PLANE 0.10 (0.004) −T− ÇÇÇ ÇÇÇ ÇÇÇ SECTION N−N DETAIL E J K ÉÉ ÉÉ DETAIL E F M −W− 0.25 (0.010) 1324 121 PIN 1 IDENT. HG A D C B SU0.15 (0.006) T −V− 24X REFK N N

http://onsemi.com PACKAGE DIMENSIONS QSOP−24 QS SUFFIX CASE 492B−01 ISSUE O MIN MILLIMETERS G R −B− −A− L M0.25 (0.010) T U −T− SEATING PLANE K D24 PLC M0.25 (0.010) T BAS S V N M F 8 PL DETAIL E DETAIL E H x 45/C0095 RAD. MOLD PIN DIM MAX MINMAX INCHES A 8.56 8.740.337 0.344 B 3.81 3.990.150 0.157 C 1.55 1.730.061 0.068 D 0.20 0.310.008 0.012 F 0.41 0.890.016 0.035 G 0.64 BSC0.025 BSC H 0.20 0.460.008 0.018 J 0.249 0.1910.0098 0.0075 K 0.10 0.250.004 0.010 L 5.84 6.200.230 0.244 M 0 8 0 N 0 7 0 7 P 0.69 0.940.027 0.037 Q 0.89 DIA0.035 DIA R 0.89 1.140.035 0.045 U 0.89 1.140.035 0.045 V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. THE BOTTOM PACKAGE SHALL BE BIGGER THAN THE TOP PACKAGE BY 4 MILS (NOTE: LEAD SIDE ONLY). BOTTOM PACKAGE DIMENSION SHALL FOLLOW THE DIMENSION STATED IN THIS DRAWING. 4. PLASTIC DIMENSIONS DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 6 MILS PER SIDE. 5. BOTTOM EJECTOR PIN WILL INCLUDE THE COUNTRY OF ORIGIN (COO) AND MOLD CAVITY I.D./C0095/C0095/C0095 /C00950 8 0 /C0095/C0095/C0095 8 /C0095 /C0095/C0095/C0095/C0095 MARK Q P 0.013 X 0.005 DP. MAX RAD. 0.005−0.010 TYP J ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 74FST3400/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative