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www.onsemi.com Figure 3. Logic Diagram

ORDERING INFORMATION

Device Order Number Package Shipping† 74FST3257DR2G SOIC−16 (Pb−Free) 2500 Units / Tape & Reel NLV74FST3257DR2G* 74FST3257DTR2G TSSOP−16 (Pb−Free)

2500 Units / Tape & Reel

(Pb−Free)

3000 Units / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.

www.onsemi.com MAXIMUM RATINGS Symbol Parameter Value Units VCC DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 to +7.0 V VO DC Output Voltage −0.5 to +7.0 V IIK DC Input Diode Current VI /C0116 GND −50 mA IOK DC Output Diode Current VO /C0116 GND −50 mA IO DC Output Sink Current 128 mA ICC DC Supply Current per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 /C0095C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 /C0095C TJ Junction Temperature Under Bias +150 /C0095C /C0113JA Thermal Resistance SOIC TSSOP QFN 125 170 N/A /C0095C/W MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in VESD ESD Withstand Voltage Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) /C01172000 /C0117200 N/A V ILatchup Latchup Performance Above VCC and Below GND at 85/C0095C (Note 4) ±500 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Tested to EIA/JESD22−A114−A. 2. Tested to EIA/JESD22−A115−A. 3. Tested to JESD22−C101−A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Units VCC Supply Voltage Operating, Data Retention Only 4.0 5.5 V VI Input Voltage (Note 5) 0 5.5 V VO Output Voltage (HIGH or LOW State) 0 5.5 V TA Operating Free−Air Temperature −40 +85 /C0095C /C0068t//C0068V Input Transition Rise or Fall Rate Switch Control Input Switch I/O V CC = 5.0 V ± 0.5 V 0 DC ns/V 5. Unused control inputs may not be left open. All control inputs must be tied to a high or low logic input voltage level.

www.onsemi.com DC ELECTRICAL CHARACTERISTICS VCC TA = −40/C0095C to +85/C0095C Symbol Parameter Conditions (V) Min Typ* Max Units VIK Clamp Diode Voltage IIN = −18 mA 4.5 −1.2 V VIH High−Level Input Voltage 4.0 to 5.5 2.0 V VIL Low−Level Input Voltage 4.0 to 5.5 0.8 V II Input Leakage Current 0 ≤ VIN ≤ 5.5 V 5.5 ±1.0 /C0109A IOZ Off−State Leakage Current 0 ≤ A, B ≤ VCC 5.5 ±1.0 /C0109A RON Switch On Resistance (Note 6) VIN = 0 V, IIN = 64 mA 4.5 4 7 /C0087 VIN = 0 V, IIN = 30 mA 4.5 4 7 VIN = 2.4 V, IIN = 15 mA 4.5 8 15 VIN = 2.4 V, IIN = 15 mA 4.0 11 20 ICC Quiescent Supply Current VIN = VCC or GND, IOUT = 0 5.5 3 /C0109A /C0068ICC Increase In ICC per Input One input at 3.4 V, Other inputs at VCC or GND 5.5 2.5 mA *Typical values are at VCC = 5.0 V and TA = 25/C0095C. 6. Measured by the voltage drop between A and B pins at the indicated current through the switch. On resistance is determined by the lower of the voltages on the two (A or B) pins. AC ELECTRICAL CHARACTERISTICS TA = −40/C0095C to +85/C0095C CL = 50 pF, RU = RD = 500 /C0087 VCC = 4.5−5.5 V VCC = 4.0 V Symbol Parameter Conditions Min Max Min Max Units tPHL, tPLH Prop Delay Bus to Bus (Note 7) VI = OPEN 0.25 0.25 ns Prop Delay, Select to Bus A 1.0 4.7 5.2 tPZH, tPZL Output Enable Time, Select to Bus B VI = 7 V for tPZL 1.0 5.2 5.7 ns Output Enable Time, IOE to Bus A, B VI = OPEN for tPZH 1.0 5.1 5.6 tPHZ, tPLZ Output Disable Time, Select to Bus B VI = 7 V for tPLZ 1.0 5.2 5.5 ns Output Disable Time, IOE to Bus A, B VI = OPEN for tPHZ 1.0 5.5 5.5 7. This parameter is guaranteed by design but is not tested. The bus switch contributes no propagation delay other than the RC delay of the typical On resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance). CAPACITANCE (Note 8) Symbol Parameter Conditions Typ Max Units CIN Control Pin Input Capacitance VCC = 5.0 V 3 pF CI/O A Port Input/Output Capacitance VCC, OE = 5.0 V 7 pF CI/O B Port Input/Output Capacitance VCC, OE = 5.0 V 5 pF 8. T A = /C004125/C0095C, f = 1 MHz, Capacitance is characterized but not tested.

www.onsemi.com PACKAGE DIMENSIONS SOIC−16 D SUFFIX CASE 751B−05 ISSUE K 6.40 16X 0.58 16X 1.12 1.27 DIMENSIONS: MILLIMETERS PITCH SOLDERING FOOTPRINT NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 16 9 SEATING PLANE F JM R X 45/C0095 G

8 PLP−B−

−A− M0.25 (0.010) B S −T− D K C 16 PL SBM0.25 (0.010) A ST DIM MIN MAX MIN MAX INCHESMILLIMETERS A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019 /C0095/C0095/C0095/C0095

www.onsemi.com PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX CASE 948F ISSUE B 7.06 16X 0.36 16X 1.26 0.65 DIMENSIONS: MILLIMETERS PITCH SOLDERING FOOTPRINT ÇÇÇ ÇÇÇ DIM MIN MAX MIN MAX INCHESMILLIMETERS A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.18 0.28 0.007 0.011 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0 8 0 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. /C0095/C0095/C0095/C0095 SECTION N−N SEATING PLANE IDENT. PIN 1 1 8 16 9 DETAIL E J B C D A K H G ÉÉÉ ÉÉÉ DETAIL E F M L 2X L/2 −U− SU0.15 (0.006) T SU0.15 (0.006) T SUM0.10 (0.004) V ST 0.10 (0.004) −T− −V− −W− 0.25 (0.010) 16X REFK N N

www.onsemi.com PACKAGE DIMENSIONS QFN16 MN SUFFIX CASE 485AW ISSUE O *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 2.80 3.80 1.10 0.50 0.60 16X 0.30 16X DIMENSIONS: MILLIMETERS 2.10 PITCH PACKAGE OUTLINE ÉÉÉ ÉÉÉ ÉÉÉ DIM MIN MAX MILLIMETERS A A1 0.00 0.05 b 0.20 0.30 D 2.50 BSC D2 0.85 1.15 E 3.50 BSC e 0.50 BSC K 0.20 --- NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.

0.20 REF

b L PIN ONE D E B A C0.15 C0.15 e 16X 16X 0.10 C 0.05 C A B NOTE 3 A 16X K (A3) SEATING PLANE C0.08 C0.10 0.80 1.00 L 0.35 0.45 1.85 2.15 DETAIL A L ALTERNATE TERMINAL CONSTRUCTIONS L ÇÇÇÉÉÉ ÉÉÉ DETAIL B MOLD CMPDEXPOSED Cu ALTERNATE CONSTRUCTIONSDETAIL B REFERENCE TOP VIEW SIDE VIEW NOTE 4 C

0.15 C A B

L1 --- 0.15 74FST3257/D ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries i n the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . A listing of ON Semiconductor’s product/patent ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the right s of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative