74FST3244DT

74FST3244_06 ONSEMI | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 7

Technical content

Features

• RON /C0116 4 /C0087 Typical
• Less Than 0.25 ns−Max Delay Through Switch
• Nearly Zero Standby Current
• No Circuit Bounce
• Control Inputs are TTL/CMOS Compatible
• Pin−For−Pin Compatible with QS3244, FST3244, CBT3244
• All Popular Packages: QSOP−20, TSSOP−20, SOIC−20
• All Devices in Package TSSOP are Inherently Pb−Free* OE1 1A1 2B1 1A2 2B2 2B3 1A0 VCC 2A3 1B2 2A2 1B1 1B0 OE2

Figure 1. 20−Lead Pinout Reference Manual, SOLDERRM/D.

Description

OE1, OE2 1A, 2A TSSOP−20 DT SUFFIX CASE 948E QSOP−20 QS SUFFIX CASE 492A SOIC−20 DW SUFFIX CASE 751D MARKING DIAGRAMS Pin Bus Switch Enables Bus A 1B, 2B Bus B FST3244 AWLYYWW 20 20 FST 3244 ALYW A = Assembly Location L, WL = Wafer Lot Y = Year W, WW = Work Week FST3244 AWLYWW See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

http://onsemi.com

http://onsemi.com OE1 OE3 Figure 2. Logic Diagram Device Order Number Package Shipping† 74FST3244DW SOIC−20 55 Units / Rail 74FST3244DWR2 SOIC−20 1000 Units / Tape & Reel 74FST3244DT TSSOP−20* (Pb−Free)

75 Units / Rail

74FST3244DTR2 TSSOP−20* (Pb−Free)

2500 Units / Tape & Reel

74FST3244QS QSOP−20 55 Units / Rail 74FST3244QSR QSOP−20 2500 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free.

http://onsemi.com MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage /C00420.5 to /C00417.0 V VI DC Input Voltage /C00420.5 to /C00417.0 V VO DC Output Voltage /C00420.5 to /C00417.0 V IIK DC Input Diode Current V I /C0116 GND /C004250 mA IOK DC Output Diode Current V O /C0116 GND /C004250 mA IO DC Output Sink Current 128 mA ICC DC Supply Current per Supply Pin /C0036100 mA IGND DC Ground Current per Ground Pin /C0036100 mA TSTG Storage Temperature Range /C004265 to /C0041150 /C0095C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 /C0095C TJ Junction Temperature Under Bias /C0041150 /C0095C /C0113JA Thermal Resistance (Note 1) SOIC TSSOP QSOP 128 200 /C0095C/W MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) /C01172000 /C0117200 V ILatchup Latchup Performance Above V CC and Below GND at 85/C0095C (Note 4) /C0036500 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above t he Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm −by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22 −A114−A. 3. Tested to EIA/JESD22 −A115−A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC Supply Voltage Operating, Data Retention Only 4.0 5.5 V VI Input Voltage (Note ) 0 5.5 V VO Output Voltage (HIGH or LOW State) 0 VCC V TA Operating Free−Air Temperature /C004240 /C004185 /C0095C /C0068t//C0068V Input Transition Rise or Fall Rate Switch Control Input Switch I/O DC ns/V 5. Unused control inputs may not be left open. All control inputs must be tied to a high or low logic input voltage level.

http://onsemi.com DC ELECTRICAL CHARACTERISTICS VCC TA = /C004240/C0095C to /C004185/C0095C Symbol Parameter Conditions (V) Min Typ* Max Unit VIK Clamp Diode Resistance IIN = /C004218mA 4.5 /C00421.2 V VIH High−Level Input Voltage 4.0 to 5.5 2.0 V VIL Low−Level Input Voltage 4.0 to 5.5 0.8 V II Input Leakage Current 0 /C0118 VIN /C0118 5.5 V 5.5 /C00361.0 /C0109A IOZ OFF−STATE Leakage Current 0 /C0118 A, B /C0118 VCC 5.5 /C00361.0 /C0109A RON Switch On Resistance (Note 6) VIN = 0 V, IIN = 64 mA 4.5 4 7 /C0087 VIN = 0 V, IIN = 30 mA 4.5 4 7 VIN = 2.4 V, IIN = 15 mA 4.5 8 15 VIN = 2.4 V, IIN = 15 mA 4.0 11 20 ICC Quiescent Supply Current VIN = VCC or GND, IOUT = 0 5.5 3 /C0109A /C0068ICC Increase In ICC per Input One input at 3.4 V, Other inputs at VCC or GND 5.5 2.5 mA *Typical values are at VCC = 5.0 V and TA = 25/C0095C. 6. Measured by the voltage drop between A and B pins at the indicated current through the switch. On resistance is determined by the lower of the voltages on the two (A or B) pins. AC ELECTRICAL CHARACTERISTICS Limits TA = /C004240/C0095C to /C004185/C0095C VCC = 4.5 to 5.5 V VCC = 4.0 V Symbol Parameter Conditions Figures Min Max Min Max Unit tPHL, tPLH Prop Delay Bus to Bus (Note 7) VI = OPEN 3 and 4 0.25 0.25 ns tPZH, tPZL Output Enable Time VI = 7 V for tPZL VI = OPEN for tPZH 3 and 4 1.0 5.6 6.1 ns tPHZ, tPLZ Output Disable Time VI = 7 V for tPLZ VI = OPEN for tPHZ 3 and 4 1.5 6.2 5.6 ns 7. This parameter is guaranteed by design but is not tested. The bus switch contributes no propagation delay other than the RC delay of the typical On resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedan ce). CAPACITANCE (Note 8) Symbol Parameter Conditions Typ Max Unit CIN Control Pin Input Capacitance VCC = 5.0 V 3 pF CI/O Input/Output Capacitance VCC, OE = 5.0 V 5 pF 8. T A = /C004125/C0095C, f = 1 MHz, Capacitance is characterized but not tested.

http://onsemi.com PACKAGE DIMENSIONS SOIC−20 DW SUFFIX CASE 751D−05 ISSUE G B20X H10X C L 18X A1 A SEATING PLANE /C0113 h X 45/C0095 E D M0.25 MB M0.25 SA SBT e T B A DIM MIN MAX MILLIMETERS A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 12.65 12.95 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 /C0113 0 7 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. /C0095/C0095 TSSOP−20 DT SUFFIX CASE 948E−02 ISSUE B DIM A MIN MAX MIN MAX INCHES 6.60 0.260 MILLIMETERS B 4.30 4.50 0.169 0.177 C 1.20 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0 8 0 8 /C0095/C0095/C0095/C0095 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ 11 0 1120 PIN 1 IDENT A B −T− 0.100 (0.004) C D G H SECTION N−N K JJ 1 N N M F −W− SEATING PLANE −V− −U− SUM0.10 (0.004) V ST 20X REFK L L/22X SU0.15 (0.006) T DETAIL E 0.25 (0.010) DETAIL E 6.40 0.252 SU0.15 (0.006) T

http://onsemi.com PACKAGE DIMENSIONS QSOP−20 QS SUFFIX CASE 492A−01 ISSUE O MIN MILLIMETERS G R −B− −A− L M0.25 (0.010) T U −T− SEATING PLANE K D20 PLC M0.25 (0.010) T BAS S V N M F 8 PL DETAIL E DETAIL E H x 45/C0095 RAD. MOLD PIN DIM MAX MINMAX INCHES A 8.56 8.740.337 0.344 B 3.81 3.990.150 0.157 C 1.55 1.730.061 0.068 D 0.20 0.310.008 0.012 F 0.41 0.890.016 0.035 G 0.64 BSC0.025 BSC H 0.20 0.460.008 0.018 J 0.249 0.1910.0098 0.0075 K 0.10 0.250.004 0.010 L 5.84 6.200.230 0.244 M 0 8 0 N 0 7 0 7 P 1.32 1.580.052 0.062 Q 0.89 DIA0.035 DIA R 0.89 1.140.035 0.045 U 0.89 1.140.035 0.045 V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. THE BOTTOM PACKAGE SHALL BE BIGGER THAN THE TOP PACKAGE BY 4 MILS (NOTE: LEAD SIDE ONLY). BOTTOM PACKAGE DIMENSION SHALL FOLLOW THE DIMENSION STATED IN THIS DRAWING. 4. PLASTIC DIMENSIONS DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 6 MILS PER SIDE. 5. BOTTOM EJECTOR PIN WILL INCLUDE THE COUNTRY OF ORIGIN (COO) AND MOLD CAVITY I.D. /C0095/C0095/C0095 /C00950 8 0 /C0095/C0095/C0095 8 /C0095 /C0095/C0095/C0095/C0095 MARK Q P 0.013 X 0.005 DP. MAX RAD. 0.005−0.010 TYP J ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 74FST3244/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative