IDT74FST163233 RENESAS | Alldatasheet
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INDUSTRIAL TEMPERATURE RANGE IDT74FST163233 16-BIT 2:1 MUX/DEMUX SWITCH OCTOBER 2008INDUSTRIAL TEMPERATURE RANGE © 2002 Integrated Device Technology, Inc. DSC-5517/3 FEATURES:
- Bus switches provide zero delay paths Low switch on-resistance TTL-compatible input and output levels ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) Hot insertion capability Very low power dissipation Available in SSOP and TSSOP packages FUNCTIONAL BLOCK DIAGRAM IDT74FST16323316-BIT 2:1 MUX/DEMUX SWITCH DESCRIPTION: The FST163233 belongs to IDT's family of Bus switches. Bus switch devices perform the function of connecting or isolating two ports without providing any inherent current sink or source capability. Thus they generate little or no noise of their own while providing a low resistance path for an external driver. These devices connect input and output ports through an n-channel FET. When the gate-to-source junction of this FET is adequately forward-biased the device conducts and the resistance be- tween input and output ports is small. Without adequate bias on the gate- to-source junction of the FET, the FET is turned off, therefore with no V CC applied, the device has hot insertion capability. The low on-resistance and simplicity of the connection between input and output ports reduces the delay in this path to close to zero. The FST163233 provides three 16-bit TTL-compatible ports that sup- port 2:1 multiplexing. The SEL0,1 and TEST0,1 pins provide switch enable and mux select control as shown below. The A port can be connected to port 1B or port 2B or both ports 1B and 2B. SEL0 One of 16 Channels TEST0 0A 1-8 2B 1-8 1B 1-8 SEL1 TEST1 1A 9-16 2B 9-16 1B 9-16 One of 16 Channels
INDUSTRIAL TEMPERATURE RANGE IDT74FST163233 16-BIT 2:1 MUX/DEMUX SWITCH SSOP/ TSSOP TOP VIEW PIN CONFIGURATION Symbol Description Max Unit VTERM(2) Terminal Voltage with Respect to GND –0.5 to +7 V TSTG Storage Temperature –65 to +150 ° C IOUT Maximum Continuous Channel Current 128 mA ABSOLUTE MAXIMUM RATINGS(1) NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. Vcc, Control, and Switch terminals. Pin Names I/O Description A, 1B, 2B I/O Buses A, 1B, 2B SEL0, 1 I Control Pins for MUX and Switch Enable Functions TEST0, 1 PIN DESCRIPTION Symbol Parameter Conditions(2) Typ. Unit CIN Control Input Capacitance 6 pF CI/O Switch Input/Output A Port Switch Off 17 pF Capacitance B Port Switch Off 12 CAPACITANCE(1) NOTES: 1. Capacitance is characterized but not tested. 2. T A = 25°C, f = 1MHz, V IN = 0V, V OUT = 0V. NOTE: 1. H = HIGH Voltage Level L = LOW Voltage Level X = DOn't Care FUNCTION TABLE(1) SEL0 TEST 0 Description L L 0A to 1B H L 0A to 2B X H 0A to 1B and 0A to 2B SEL1 TEST 1 Description L L 1A to 1B H L 1A to 2B X H 1A to 1B and 1A to 2B 1B2 2B2 0A3 1B4 2B4 0A5 1B6 2B6 0A2 1B3 2B3 0A4 1B5 0A6 1B7 1B1 2B1 1B8 11 2B8 2B7 0A8 VCC 1A9 1B10 GND 2B10 1A11 1B12 2B12 1A13 1B9 2B9 1A10 1B11 2B11 1A12 1B13 2B13 GND VCC 2B14 23 1A15 1A14 1B15 2B16 1B16 2B15 1A16 TEST0 27 28TEST1 SEL0 SEL1 0A1 2B5
INDUSTRIAL TEMPERATURE RANGE IDT74FST163233 16-BIT 2:1 MUX/DEMUX SWITCH Symbol Parameter Test Conditions (1) Min. Typ. (2) Max. Unit VIH Control Input HIGH Voltage Guaranteed Logic HIGH for Control Inputs 2 — — V VIL Control Input LOW Voltage Guaranteed Logic LOW for Control Inputs — — 0.8 V IIH Control Input HIGH Current V CC = Max. VI = VCC —— ±1µ A IIL Control Input LOW Current VI = GND — — ±1 IOZH Current During VCC = Max., V O = 0 to 5V — — ±1µ A IOZL Bus Switch Disconnect — — ±1 VIK Clamp Diode Voltage VCC = Min., IIN = –18mA — –0.7 –1.2 V IOFF Switch Power Off Leakage V CC = 0V, VIN or VO ≤ 5.5V — — ±1µ A ICC Quiescent Power Supply Current V CC = Max., V IN = GND or V CC — 0.1 3 µ A DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE Following Conditions Apply Unless Otherwise Specified: Industrial: TA = –40°C to +85°C, VCC = 5.0V ± 10% BUS SWITCH IMPEDANCE OVER OPERATING RANGE Following Conditions Apply Unless Otherwise Specified: Industrial: T A = -40°C to +85°C, VCC = 5.0V ±10% Symbol Parameter Test Conditions Min. Typ. (1) Max. Unit RON Switch On Resistance(2) Vcc = Min., V IN = 0V, I ON = 12mA — 5 7 Ω Vcc = Min., V IN = 2.4V, I ON = 8mA — 10 15 IOS Short Circuit Current, A to B(3) A(B) = 0V, B(A) = Vcc 100 — — mA NOTES: 1. Typical values are at Vcc = 5.0V, +25°C ambient. 2. The voltage drop between the indicated ports divided by the current through the switch. 3. Not more than one output should be shorted at one time. Duration of the test should not exceed one second.
INDUSTRIAL TEMPERATURE RANGE IDT74FST163233 16-BIT 2:1 MUX/DEMUX SWITCH Symbol Parameter Test Conditions(1) Min. Typ.(2) Max. Unit ΔICC Quiescent Power Supply Current V CC = Max. — 0.5 1.5 mA TTL Inputs HIGH V IN = 3.4V(3) ICCD Dynamic Power Supply V CC = Max. V IN = VCC — 3 0 4 0 µA/ Current(4,5) One Select Pin Toggling V IN = GND MHz/ 50% Duty Cycle Select ICCD Dynamic Power Supply V CC = Max. V IN = VCC — 120 160 µ A / Current(4,5) One Test Pin Toggling V IN = GND MHz/ 50% Duty Cycle Test IC Total Power Supply Current(6) VCC = Max. V IN = VCC — 0.3 0.4 mA One Select Pin Toggling V IN = GND fi = 10MHz V IN = VCC — 0.6 1.2 50% Duty Cycle V IN = 3.4V VCC = Max. V IN = VCC — 0.6 0.8 Two Select Pins Toggling V IN = GND fi = 10MHz V IN = VCC — 1.1 2.3 50% Duty Cycle V IN = 3.4V POWER SUPPLY CHARACTERISTICS NOTES: 1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable dev ice type. T A = –40°C to +85°C 2. Typical values are at V CC = 5.0V, +25°C ambient. 4. This parameter represents the current required to switch the internal capacitance of the control inputs at the specified freq uency. Switch inputs generate no significant power supply currents as they transition. This parameter is not directly testable, but i s derived for use in Total Power Supply Calculations. 5. C PD = I CCD/VCC CPD = Power Dissipation Capacitance 6. I C = IQUIESCENT + IINPUTS + IDYNAMIC IC = I CC + ΔICC DHNT + I CCD (fiN) ICC = Quiescent Current ΔICC = Power Supply Current for a TTL High Input (V IN = 3.4V) DH = Duty Cycle for TTL Inputs High NT = Number of TTL Inputs at D H ICCD = Dynamic Current Caused by an Input Transition Pair (HLH or LHL) fi = Control Input Frequency N = Number of Control Inputs Toggling at f i
INDUSTRIAL TEMPERATURE RANGE IDT74FST163233 16-BIT 2:1 MUX/DEMUX SWITCH SWITCHING CHARACTERISTICS OVER OPERATING RANGE Following Conditions Apply Unless Otherwise Specified: Industrial: TA = -40°C to +85°C, VCC = 5.0V ± 10% VCC = 5V ± 10% V CC = 4V tPLH Data Propagation Delay — — 0.25 — 0.25 ns tPHL A to B, B to A (2) tBX Switch Multiplex Delay 1.5 — 6.5 — 7 ns SEL to A tPZH Switch CONNECT Delay 1.5 — 6.5 — 7 ns tPZL SEL, TEST to B tPHZ Switch DISCONNECT Delay 1.5 — 7 — 7 ns tPLZ SEL, TEST to B |QCI| Charge Injection During Switch DISCONNECT — 1.5 — — — pC TEST to A or B(3) |QDCI| Differential Charge Injection During Multiplexer Switching — 0.5 — — — pC SEL to A or B(3) NOTES: 1. See test circuits and waveforms. 2. The bus switch contributes no Propagation Delay other than the RC Delay of the load interacting with the RC of the switch. |QCI| is the charge injection for a single switch DISCONNECT and applies to either single switches or multiplexers. |QDCI| is the charge injection for a multiplexer as the multiplexed port switches from one path to another. Charge injection is reduced because the injection from the DISCONNECT of the first path is compensated by the CONNECT of the second path.
INDUSTRIAL TEMPERATURE RANGE IDT74FST163233 16-BIT 2:1 MUX/DEMUX SWITCH D.U.T. VCC
1 MHz
CL = 50pF VOUTSwitch Out Enable/Select Switch In Switch In (MUX) (1) Pulse Generator R T D.U.T. VCC VIN C L VOUT 50pF 500Ω 500Ω 7.0V 1.5V 1.5V 1.5V 1.5V DATA INPUT TIMING INPUT ASYNCHRONOUS CONTROL SYNCHRONOUS CONTROL tSU tH tREM tSU tH HIGH-LOW-HIGH PULSE LOW-HIGH-LOW PULSE tW 1.5V 1.5V SAME PHASE INPUT TRANSITION 1.5V 1.5V VOH tPLH OUTPUT OPPOSITE PHASE INPUT TRANSITION 1.5V tPLH tPHL tPHL VOL CONTROL INPUT 1.5V 3.5V OUTPUT NORMALLY LOW OUTPUT NORMALLY HIGH SWITCH CLOSED SWITCH OPEN VOL 0.3V 0.3V tPLZtPZL tPZH tPHZ 3.5V 1.5V 1.5V ENABLE DISABLE VOH (2) (3) TEST CIRCUITS AND WAVEFORMS Propagation Delay Test Circuits for All Outputs Enable and Disable Times Set-up, Hold, and Release Times Pulse Width NOTES: 1. Diagram shown for input Control Enable-LOW and input Control Disable-HIGH. 2. Pulse Generator for All Pulses: Rate ≤ 1.0MHz; t F ≤ 2.5ns; t R ≤ 2.5ns. Test Switch Open Drain Disable Low Closed Enable Low All Other Tests Open SWITCH POSITION DEFINITIONS: C L = Load capacitance: includes jig and probe capacitance. RT = Termination resistance: should be equal to Z OUT of the Pulse Generator. Charge Injection NOTES: 1. Select is used with multiplexers for measuring IQ DCII during multiplexer select. During all other tests Enable is used. 2. Used with multiplexers to measure IQ DCII only. 3. Charge Injection = ΔVOUT CL, with Enable toggling for IQCII or Select toggling for IQDCII. ΔVOUT is the change in V OUT and is measured with a 10M Ω probe.
INDUSTRIAL TEMPERATURE RANGE IDT74FST163233 16-BIT 2:1 MUX/DEMUX SWITCH
ORDERING INFORMATION
Temp. Range XXX Device Type X Package 74 –40°C to +85°C PV PA PAG 233 Shrink Small Outline Package Thin Shrink Small Outline Package TSSOP - Green 16-Bit 2:1 Mux/Demux Switch FST Family XXX
163 Double-Density Bus Switch
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