Logic IC

74FCT16245TPVCG4

Texas Instruments

16-Bit Transceivers

Manufacturer: Texas Instruments

Document: 17 Pages / 317Kb

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CY74FCT16245T_01 TI | Alldatasheet

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Technical content

Features

Ioff supports partial-power-down mode operation
Edge-rate control circuitry for signiﬁcantly improved noise characteristics
Typical output skew < 250 ps
ESD > 2000V
TSSOP (19.6-mil pitch) and SSOP (25-mil pitch) packages
Industrial temperature range of –40˚C to +85˚C
VCC = 5V± 10% CY74FCT16245T Features:
64 mA sink current, 32 mA source current
Typical VOLP (ground bounce)<1.0V at VCC = 5V, TA = 25˚C CY74FCT162245T Features:
Balanced output drivers: 24 mA
Reduced system switching noise
Typical VOLP (ground bounce) <0.6V at VCC = 5V, TA = 25˚C CY74FCT162H245T Features:
Bus hold on data inputs
Eliminates the need for external pull-up or pull-down resistors Functional Description These 16-bit transceivers are designed for use in bidirectional synchronous communication between two buses, where high speed and low power are required. With the exception of the CY74FCT16245T, these devices can be operated either as two independent octals or a single 16-bit transceiver. Direction of data ﬂow is controlled by (DIR), the Output Enable ( OE) transfers data when LOW and isolates the buses when HIGH. This device is fully speciﬁed for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backﬂow through the device when it is powered down. The CY74FCT16245T is ideally suited for driving high-capacitance loads and low-impedance backplanes. The CY74FCT162245T has 24-mA balanced output drivers with current limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for mini- mal undershoot and reduced ground bounce. The CY74FCT162245T is ideal for driving transmission lines. The CY74FCT162H245T is a 24-mA balanced output part that has bus hold on the data inputs. The device retains the input’s last state whenever the input goes to high impedance. This eliminates the need for pull-up/down resistors and prevents ﬂoating inputs. GND Logic Block Diagrams CY74FCT16245T,CY74FCT162245T, CY74FCT162H245T PinConfiguration 1DIR SSOP/TSSOP Top View 1B1 1B2 1B3 1B4 1A1 1A2 1A3 1A4 1OE GND GND VCC 1B7 1B8 1B5 1B6 1A5 1A6 1A7 1A8 VCC GND GND 2B3 2B4 2B1 2B2 2A1 2A2 2A3 2A4 GND GND VCC 2B7 2B8 2B5 2B6 2A5 2A6 2A7 2A8 VCC GND 2DIR 2OE FCT16245–1 1A1 1A2 1A3 1A4 1A5 1A6 1A7 1OE 1B1 1B2 1B3 1B4 1B5 1B6 1B7 1DIR 1A8 1B8 FCT16245–2 2A1 2A2 2A3 2A4 2A5 2A6 2A7 2OE 2B1 2B2 2B3 2B4 2B5 2B6 2B7 2DIR 2A8 2B8 FCT16245–3 16245T 162245T 162H245T

Maximum Ratings [3, 4] (Above which the useful life may be impaired. For user guidelines, not tested.) Ambient Temperature with DC Output Current (per MIL-STD-883, Method 3015) Notes: 1. On CY74FCT162H245T these pins have bus hold. 3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-airtemperature range. 4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either V CC or ground. Pin Description Name Description OE Three-State Output Enable Inputs (Active LOW) DIR Direction Control A Inputs or Three-State Outputs[1] B Inputs or Three-State Outputs[1] Function Table[2] Inputs OutputsOE DIR L L Bus B Data to Bus A L H Bus A Data to Bus B H X High Z State Operating Range Range Ambient Temperature VCC Industrial –40°C to +85°C 5V ± 10% Electrical CharacteristicsOver the Operating Range Parameter Description Test Conditions Min. Typ.[5] Max. Unit VIH Input HIGH Voltage 2.0 V VIL Input LOW Voltage 0.8 V VH Input Hysteresis[6] 100 mV VIK Input Clamp Diode Voltage VCC =Min., IIN=–18 mA –0.7 –1.2 V IIH Input HIGH Current Standard VCC =Max., VI=V CC ±1 µA Bus Hold ±100 IIL Input LOW Current Standard VCC =Max., VI=GND ±1 µA Bus Hold ±100 µA IBBH IBBL Bus Hold Sustain Current on Bus Hold Input[7] VCC =Min. VI=2.0V –50 µA VI=0.8V +50 IBHHO IBHLO Bus Hold Overdrive Current on Bus Hold Input[7]VCC =Max., VI=1.5V TBD mA IOZH High Impedance Output Current (Three-State Output pins) VCC =Max., VOUT =2.7V ±1 µA IOZL High Impedance Output Current (Three-State Output pins) VCC =Max., VOUT =0.5V ±1 µA IOS Short Circuit Current[8] VCC =Max., VOUT =GND –80 –140 –200 mA IO Output Drive Current[8] VCC =Max., VOUT =2.5V –50 –180 mA IOFF Power-Off Disable VCC =0V, VOUT ≤4.5V[9] ±1 µA

Output Drive Characteristics for CY74FCT16245T Parameter Description Test Conditions Min. Typ.[5] Max. Unit VOH Output HIGH Voltage VCC =Min., IOH =–3 mA 2.5 3.5 V VCC =Min., IOH =–15 mA 2.4 3.5 V VCC =Min., IOH =–32 mA 2.0 3.0 V VOL Output LOW Voltage VCC =Min., IOL =64 mA 0.2 0.55 V Output Drive Characteristics for CY74FCT162245T, CY74FCT162H245T Parameter Description Test Conditions Min. Typ.[5] Max. Unit IODL Output LOW Current[8] VCC =5V, VIN=V IH or VIL, VOUT =1.5V 60 115 150 mA IODH Output HIGH Current[8] VCC =5V, VIN=V IH or VIL, VOUT =1.5V –60 –115 –150 mA VOH Output HIGH Voltage VCC =Min., IOH =–24 mA 2.4 3.3 V VOL Output LOW Voltage VCC =Min., IOL =24 mA 0.3 0.55 V Notes: 5. Typical values are at VCC =5.0V, TA=+25˚C ambient. 6. This parameter is speciﬁed but not tested. 7. Pins with bus hold are described in Pin Description. 8. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reﬂect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, I OS tests should be performed last. 9. Tested at +25˚C. Capacitance[6](TA = +25˚C, f = 1.0 MHz) Parameter Description Test Conditions Typ.[5] Max. Unit C IN Input Capacitance VIN = 0V 4.5 6.0 pF C OUT Output Capacitance VOUT = 0V 5.5 8.0 pF

Power Supply Characteristics Parameter Description Test Conditions Typ.[5] Max. Unit ICC Quiescent Power Supply CurrentVCC =Max. VIN<0.2V, VIN>V CC -0.2V 5 500 µA ∆ICC Quiescent Power Supply Current (TTL inputs HIGH) VCC =Max. VIN=3.4V[10] 0.5 1.5 mA ICCD Dynamic Power Supply Current [11] VCC =Max., One Input Toggling, 50% Duty Cycle, Outputs Open, OE=DIR=GND VIN=V CC or VIN=GND 60 100 µA/MHz IC Total Power Supply Current[12] VCC =Max., f1=10 MHz, 50% Duty Cycle, Outputs Open, One Bit Toggling, OE=DIR=GND VIN=V CC or VIN=GND 0.6 1.5 mA VIN=3.4V or VIN=GND 0.9 2.3 mA VCC =Max., f1=2.5 MHz, 50% Duty Cycle, Outputs Open, Sixteen Bits Toggling, OE=DIR=GND VIN=V CC or VIN=GND 2.4 4.5[13] mA VIN=3.4V or VIN=GND 6.4 16.5[13] mA Notes: 10. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND. 11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. 12. IC =I QUIESCENT + IINPUTS + IDYNAMIC IC =I CC +∆ICC D H N T+ICCD (f0/2 + f1N 1) ICC = Quiescent Current with CMOS input levels ∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) D H = Duty Cycle for TTL inputs HIGH N T = Number of TTL inputs at DH ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N 1 = Number of inputs changing at f1 All currents are in milliamps and all frequencies are in megahertz. 13. Values for these conditions are examples of the ICC formula. These limits are speciﬁed but not tested.

Switching CharacteristicsOver the Operating Range[14]

Description

74FCT162H245AT Fig. tPLH tPHL Propagation Delay Data to Output A to B, B to A 1.5 7.0 1.5 4.5 ns 1, 3 tPZH tPZL Output Enable Time OE to A or B 1.5 9.5 1.5 6.2 ns 1, 7, 8 tPHZ tPLZ Output Disable Time OE to A or B 1.5 7.5 1.5 5.0 ns 1, 7, 8 tPZH tPZL Output Enable Time DIR to A or B 1.5 9.5 1.5 6.2 ns 1, 7, 8 tPHZ tPLZ Output Disable Time DIR to A or B 1.5 7.5 1.5 5.0 ns 1, 7, 8 tSK(O) Output Skew[16] 0.5 0.5 ns — 74FCT162H245CT Fig. No.[15]Parameter Min. Max. Unit tPLH tPHL Propagation Delay Data to Output A to B, B to A 1.5 4.1 ns 1, 3 tPZH tPZL Output Enable Time OE to A or B 1.5 5.8 ns 1, 7, 8 tPHZ tPLZ Output Disable Time OE to A or B 1.5 4.8 ns 1, 7, 8 tPZH tPZL Output Enable Time DIR to A or B 1.5 5.8 ns 1, 7, 8 tPHZ tPLZ Output Disable Time DIR to A or B 1.5 4.8 ns 1, 7, 8 tSK(O) Output Skew[16] 0.5 ns — Note: 14. Minimum limits are speciﬁed but not tested on Propagation Delays. 15. See “Parameter Measurement Information” in the General Information section. 16. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design. Speed (ns) Ordering Code Package Name Package Type Operating Range

4.1 CY74FCT16245CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial

CY74FCT16245CTPVC/PVCT O48 48-Lead (300-Mil) SSOP

4.5 CY74FCT16245ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial

CY74FCT16245ATPVC/PVCT O48 48-Lead (300-Mil) SSOP

7.0 CY74FCT16245TPACT Z48 48-Lead (240-Mil) TSSOP Industrial

CY74FCT16245TPVC/PVCT O48 48-Lead (300-Mil) SSOP

(ns) Ordering Code Package Name Package Type Operating Range

4.1 CY74FCT162245CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial

CY74FCT162245CTPVC O48 48-Lead (300-Mil) SSOP 74FCT162245CTPVCT O48 48-Lead (300-Mil) SSOP 4.5 74FCT162245ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT162245ATPVC O48 48-Lead (300-Mil) SSOP 74FCT162245ATPVCT O48 48-Lead (300-Mil) SSOP

7.0 CY74FCT162245TPACT Z48 48-Lead (240-Mil) TSSOP Industrial

CY74FCT162245TPVC/PVCT O48 48-Lead (300-Mil) SSOP Speed (ns) Ordering Code Package Name Package Type Operating Range 4.1 74FCT162H245CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT162H245CTPVC O48 48-Lead (300-Mil) SSOP 74FCT162H245CTPVCT O48 48-Lead (300-Mil) SSOP 4.5 74FCT162H245ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT162H245ATPVC O48 48-Lead (300-Mil) SSOP 74FCT162H245ATPVCT O48 48-Lead (300-Mil) SSOP

48-Lead Shrunk Small Outline PackageO48

48-Lead Thin Shrunk Small Outline PackageZ48

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) 74FCT162245ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162245ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162245ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162245CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162245CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162245CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162245ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI 74FCT162245ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI 74FCT162245TPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162245TPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162245TPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162245TPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16245ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16245ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16245ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16245ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16245CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16245CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16245CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16245CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16245TPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16245TPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16245TPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16245TPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162H245ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162H245ATPVC ACTIVE SSOP DL 48 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 Addendum-Page 1

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) no Sb/Br) 74FCT162H245ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162H245CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162H245CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162H245CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162H245ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI 74FCT162H245ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI 74FCT162H245ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI 74FCT162H245ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT162245ATPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162245CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162245ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT162245ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT162245TPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162245TPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162245TPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16245ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16245ATPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16245ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16245CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16245CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16245CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16245ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT16245ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT16245ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT16245ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT16245TPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16245TPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16245TPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162245ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 Addendum-Page 2

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) FCT162245ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162245ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162245CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162245CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162245CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162H245ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162H245ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162H245ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162H245ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162H245CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162H245CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162H245CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162H245CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 Addendum-Page 3

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 Addendum-Page 4

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74FCT162245ATPACT TSSOP DGG 48 2000 346.0 346.0 41.0 74FCT162245ATPVCT SSOP DL 48 1000 346.0 346.0 49.0 74FCT162245CTPACT TSSOP DGG 48 2000 346.0 346.0 41.0 74FCT162245CTPVCT SSOP DL 48 1000 346.0 346.0 49.0 74FCT162H245ATPACT TSSOP DGG 48 2000 346.0 346.0 41.0 74FCT162H245ATPVCT SSOP DL 48 1000 346.0 346.0 49.0 74FCT162H245CTPACT TSSOP DGG 48 2000 346.0 346.0 41.0 74FCT162H245CTPVCT SSOP DL 48 1000 346.0 346.0 49.0 CY74FCT162245TPACT TSSOP DGG 48 2000 346.0 346.0 41.0 CY74FCT162245TPVCT SSOP DL 48 1000 346.0 346.0 49.0 CY74FCT16245ATPACT TSSOP DGG 48 2000 346.0 346.0 41.0 CY74FCT16245ATPVCT SSOP DL 48 1000 346.0 346.0 49.0 CY74FCT16245CTPACT TSSOP DGG 48 2000 346.0 346.0 41.0 CY74FCT16245CTPVCT SSOP DL 48 1000 346.0 346.0 49.0 CY74FCT16245TPACT TSSOP DGG 48 2000 346.0 346.0 41.0 CY74FCT16245TPVCT SSOP DL 48 1000 346.0 346.0 49.0 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 Pack Materials-Page 2

MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040078/F 12/97

48 PINS SHOWN

0,25 0,15 NOM Gage Plane 6,00 6,20 8,30 7,90 0,75 0,50 Seating Plane 0,27 0,17 A 1,20 MAX M0,08 0,10 0,50 0°–8° 14,10 13,90 48DIM A MAX A MIN PINS ** 12,40 12,60 17,10 16,90 0,15 0,05 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040048/E 12/01 0.730 (18,54) 0.720 (18,29) 4828 0.370 (9,40) (9,65) 0.380 Gage Plane DIM 0.420 (10,67) 0.395 (10,03) A MIN A MAX 0.010 (0,25) PINS ** 0.630 (16,00) (15,75) 0.620 0.010 (0,25) Seating Plane 0.020 (0,51) 0.040 (1,02) 0.008 (0,203) 0.0135 (0,343) 0.008 (0,20) MIN A 0.110 (2,79) MAX 0.299 (7,59) 0.291 (7,39) 0.004 (0,10) M0.005 (0,13) 0.025 (0,635) 0°–/C02578° 0.005 (0,13) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). D. Falls within JEDEC MO-118

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