74FCT162374TPVCTG4

CY74FCT162374T TI1 | Alldatasheet

Document overview

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Technical content

Features

• Ioff supports partial-power-down mode operation
• Edge-rate control circuitry for significantly improved noise characteristics
• Typical output skew < 250 ps
• ESD > 2000V
• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch) packages
• Industrial temperature range of−40˚C to +85˚C CC = 5V± 10% CY74FCT16374T Features:
• 64 mA sink current, 32 mA source current
• Typical VOLP (ground bounce) <1.0V at VCC = 5V, TA = 25˚C CY74FCT162374T Features:
• Balanced 24 mA output drivers
• Reduced system switching noise
• Typical V OLP (ground bounce) <0.6V at VCC = 5V, TA = 25˚C Functional Description CY74FCT16374T and CY74FCT162374T are 16-bit D-type registers designed for use as buffered registers in high-speed, low power bus applications. These devices can be used as two independent 8-bit registers or as a single 16-bit register by connecting the output Enable (OE) and Clock (CLK) inputs. Flow-through pinout and small shrink packaging aid in simplifying board layout. This device is fully specified for partial-power-down applications using I off. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The CY74FCT16374T is ideally suited for driving high-capacitance loads and low-impedance backplanes. The CY74FCT162374T has 24-mA balanced output drivers with current limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The CY74FCT162374T is ideal for driving transmission lines. Logic Block Diagrams Pin Configuration D C 1OE FCT162374-1 1CLK 1D 1 1O 1 TO 7 OTHER CHANNELS D C 2OE FCT162374-2 2CLK 2D 1 2O 1 FCT162374-3 GND 1OE SSOP/TSSOP Top View 1O 1 1O 2 1O 3 1O 4 1D 1 1D 2 1D 3 1D 4 1CLK GND GND VCC 1O 7 1O 8 1O 5 1O 6 1D 5 1D 6 1D 7 1D 8 VCC GND GND 2O 3 2O 4 2O 1 2O 2 2D 1 2D 2 2D 3 2D 4 GND GND VCC 2O 7 2O 8 2O 5 2O 6 2D 5 2D 6 2D 7 2D 8 VCC GND 2OE 2CLK TO 7 OTHER CHANNELS

Maximum Ratings [2, 3] (Above which the useful life may be impaired. For user guidelines, not tested.) Ambient Temperature with DC Output Current (per MIL-STD-883, Method 3015) Function Table[1] Inputs Outputs FunctionD CLK OE O X L H Z High-Z X H H Z L L L Load RegisterH L H L H Z H H Z Pin Description Name Description D Data Inputs CLK Clock Inputs OE Three-State Output Enable Inputs (Active LOW) O Three-State Outputs Operating Range Range Ambient Temperature VCC Industrial −40°C to +85°C 5V ± 10% Electrical CharacteristicsOver the Operating Range Parameter Description Test Conditions Min. Typ.[4] Max. Unit VIH Input HIGH Voltage 2.0 V VIL Input LOW Voltage 0.8 V VH Input Hysteresis[5] 100 mV VIK Input Clamp Diode Voltage VCC =Min., IIN=−18 mA −0.7 −1.2 V IIH Input HIGH Current VCC =Max., VI=V CC ±1 µA IIL Input LOW Current VCC =Max., VI=GND ±1 µA IOZH High Impedance Output Current (Three-State Output pins) VCC =Max., VOUT =2.7V ±1 µA IOZL High Impedance Output Current (Three-State Output pins) VCC =Max., VOUT =0.5V ±1 µA IOS Short Circuit Current[6] VCC =Max., VOUT =GND −80 −140 −200 mA IO Output Drive Current[6] VCC =Max., VOUT =2.5V −50 −180 mA IOFF Power-Off Disable VCC =0V, VOUT ≤4.5V[7] ±1 µA Output Drive Characteristics for CY74FCT16374T Parameter Description Test Conditions Min. Typ.[4] Max. Unit VOH Output HIGH Voltage VCC =Min., IOH =−3 mA 2.5 3.5 V VCC =Min., IOH =−15 mA 2.4 3.5 V VCC =Min., IOH =−32 mA 2.0 3.0 V VOL Output LOW Voltage VCC =Min., IOL =64 mA 0.2 0.55 V Notes: 2. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-airtemperature range. 3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground. 4. Typical values are at VCC = 5.0V, TA= +25˚C ambient. 5. This parameter is specified but not tested. 6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, I OS tests should be performed last. 7. Tested at +25˚C.

Output Drive Characteristics for CY74FCT162374T Parameter Description Test Conditions Min. Typ.[4] Max. Unit IODL Output LOW Current[6] VCC =5V, VIN=V IH or VIL, VOUT =1.5V 60 115 150 mA IODH Output HIGH Current[6] VCC =5V, VIN=V IH or VIL, VOUT =1.5V −60 −115 −150 mA VOH Output HIGH Voltage VCC =Min., IOH =−24 mA 2.4 3.3 V VOL Output LOW Voltage VCC =Min., IOL =24 mA 0.3 0.55 V Capacitance[5](TA = +25˚C, f = 1.0 MHz) Parameter Description Test Conditions Typ.[4] Max. Unit C IN Input Capacitance VIN = 0V 4.5 6.0 pF C OUT Output Capacitance VOUT = 0V 5.5 8.0 pF Power Supply Characteristics Parameter Description Test Conditions Typ.[4] Max. Unit ICC Quiescent Power Supply CurrentVCC =Max. VIN≤0.2V, VIN≥VCC −0.2V 5 500 µA ∆ICC Quiescent Power Supply Current (TTL inputs HIGH) VCC =Max. VIN=3.4V[8] 0.5 1.5 mA ICCD Dynamic Power Supply Current [9] VCC =Max., One Input Toggling, 50% Duty Cycle, Outputs Open, OE=GND VIN=V CC or VIN=GND 60 100 µA/ MHz IC Total Power Supply Current[10] VCC =Max., f0=10 MHz, f1=5 MHz, 50% Duty Cycle, Outputs Open, One Bit Toggling, OE=GND VIN=V CC or VIN=GND 0.6 1.5 mA VIN=3.4V or VIN=GND 1.1 3.0 mA VCC =Max., f0=10 MHz, f1=2.5 MHz, 50% Duty Cycle, Outputs Open, Sixteen Bits Toggling, OE=GND VIN=V CC or VIN=GND 3.0 5.5[11] mA VIN=3.4V or VIN=GND 7.5 19.0[11] mA Note: 8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND. 9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. 10. IC =I QUIESCENT + IINPUTS + IDYNAMIC IC =I CC +∆ICC D H N T+ICCD (f0/2 + f1N 1) ICC = Quiescent Current with CMOS input levels ∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) D H = Duty Cycle for TTL inputs HIGH N T = Number of TTL inputs at DH ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N 1 = Number of inputs changing at f1 All currents are in milliamps and all frequencies are in megahertz. 11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.

Switching CharacteristicsOver the Operating Range[12] CY74FCT16374T CY74FCT162374T CY74FCT16374AT CY74FCT162374AT Fig. tPLH tPHL Propagation Delay CLK to O 2.0 10.0 2.0 6.5 ns 1, 5 tPZH tPZL Output Enable Time 1.5 12.5 1.5 6.5 ns 1, 7, 8 tPHZ tPLZ Output Disable Time 1.5 8.0 1.5 5.5 ns 1, 7, 8 tSU Set-Up Time HIGH or LOW, D to CLK 2.0 2.0 ns 4 tH Hold Time HIGH or LOW, D to CLK 1.5 1.5 ns 4 tW CLK Pulse Width HIGH or LOW 5.0 5.0 ns 5 tSK(O) Output Skew[14] 0.5 0.5 ns CY74FCT16374CT CY74FCT162374CT Fig. No.[13]Parameter Description Min. Max. Unit tPLH tPHL Propagation Delay CLK to O 2.0 5.2 ns 1, 5 tPZH tPZL Output Enable Time 1.5 5.5 ns 1, 7, 8 tPHZ tPLZ Output Disable Time 1.5 5.0 ns 1, 7, 8 tSU Set-Up Time HIGH or LOW, D to CLK 2.0 ns 4 tH Hold Time HIGH or LOW, D to CLK 1.5 ns 4 tW CLK Pulse Width HIGH or LOW 3.3 ns 5 tSK(O) Output Skew[14] 0.5 ns Notes: 12. Minimum limits are specified but not tested on Propagation Delays. 13. See “Parameter Measurement Information” in the General Information section. 14. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.

(ns) Ordering Code Package Name Package Type Operating Range

5.2 CY74FCT16374CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial

CY74FCT16374CTPVC/PVCT O48 48-Lead (300-Mil) SSOP

6.5 CY74FCT16374ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial

CY74FCT16374ATPVC/PVCT O48 48-Lead (300-Mil) SSOP

10.0 CY74FCT16374TPVC/PVCT O48 48-Lead (300-Mil) SSOP Industrial

(ns) Ordering Code Package Name Package Type Operating Range 5.2 74FCT162374CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT162374CTPVC O48 48-Lead (300-Mil) SSOP 74FCT162374CTPVCT O48 48-Lead (300-Mil) SSOP 6.5 74FCT162374ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial CY74FCT162374ATPVC O48 48-Lead (300-Mil) SSOP 74FCT162374ATPVCT O48 48-Lead (300-Mil) SSOP

10.0 CY74FCT162374TPVC/PVCT O48 48-Lead (300-Mil) SSOP Industrial

48-Lead Shrunk Small Outline PackageO48 48-Lead Thin Shrunk Small Outline PackageZ48

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) 74FCT162374ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI 74FCT162374ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI 74FCT162374TPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374TPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162374ATPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162374CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162374ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT162374ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT162374TPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374ATPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Addendum-Page 1

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) no Sb/Br) CY74FCT16374CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT16374ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT16374ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT16374ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT16374TPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Addendum-Page 2

to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Addendum-Page 3

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74FCT162374ATPACT TSSOP DGG 48 2000 346.0 346.0 41.0 74FCT162374ATPVCT SSOP DL 48 1000 346.0 346.0 49.0 74FCT162374CTPACT TSSOP DGG 48 2000 346.0 346.0 41.0 74FCT162374CTPVCT SSOP DL 48 1000 346.0 346.0 49.0 CY74FCT162374TPVCT SSOP DL 48 1000 346.0 346.0 49.0 CY74FCT16374ATPACT TSSOP DGG 48 2000 346.0 346.0 41.0 CY74FCT16374ATPVCT SSOP DL 48 1000 346.0 346.0 49.0 CY74FCT16374CTPACT TSSOP DGG 48 2000 346.0 346.0 41.0 CY74FCT16374CTPVCT SSOP DL 48 1000 346.0 346.0 49.0 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 Pack Materials-Page 2

MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040078/F 12/97

48 PINS SHOWN

0,25 0,15 NOM Gage Plane 6,00 6,20 8,30 7,90 0,75 0,50 Seating Plane 0,27 0,17 A 1,20 MAX M0,08 0,10 0,50 0°–8° 14,10 13,90 48DIM A MAX A MIN PINS ** 12,40 12,60 17,10 16,90 0,15 0,05 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040048/E 12/01 0.730 (18,54) 0.720 (18,29) 4828 0.370 (9,40) (9,65) 0.380 Gage Plane DIM 0.420 (10,67) 0.395 (10,03) A MIN A MAX 0.010 (0,25) PINS ** 0.630 (16,00) (15,75) 0.620 0.010 (0,25) Seating Plane 0.020 (0,51) 0.040 (1,02) 0.008 (0,203) 0.0135 (0,343) 0.008 (0,20) MIN A 0.110 (2,79) MAX 0.299 (7,59) 0.291 (7,39) 0.004 (0,10) M0.005 (0,13) 0.025 (0,635) 0°–/C02578° 0.005 (0,13) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). D. Falls within JEDEC MO-118

www.ti.com 23-Aug-2012 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 74FCT162374ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374ATPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI 74FCT162374CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI 74FCT162374ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI 74FCT162374TPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374TPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

www.ti.com 23-Aug-2012 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CY74FCT162374ATPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162374CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162374ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT162374ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT162374TPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374ATPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT16374ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT16374ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT16374ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT16374TPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374ATPVCTG4 ACTIVE SSOP DL 48 TBD Call TI Call TI FCT162374CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

www.ti.com 23-Aug-2012 Addendum-Page 3 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) FCT162374CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74FCT162374ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0 74FCT162374CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0 74FCT162374CTPVCT SSOP DL 48 1000 367.0 367.0 55.0 CY74FCT162374TPVCT SSOP DL 48 1000 367.0 367.0 55.0 CY74FCT16374ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0 CY74FCT16374ATPVCT SSOP DL 48 1000 367.0 367.0 55.0 CY74FCT16374CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0 CY74FCT16374CTPVCT SSOP DL 48 1000 367.0 367.0 55.0 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 Pack Materials-Page 2

MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040048/E 12/01 0.730 (18,54) 0.720 (18,29) 4828 0.370 (9,40) (9,65) 0.380 Gage Plane DIM 0.420 (10,67) 0.395 (10,03) A MIN A MAX 0.010 (0,25) PINS ** 0.630 (16,00) (15,75) 0.620 0.010 (0,25) Seating Plane 0.020 (0,51) 0.040 (1,02) 0.008 (0,203) 0.0135 (0,343) 0.008 (0,20) MIN A 0.110 (2,79) MAX 0.299 (7,59) 0.291 (7,39) 0.004 (0,10) M0.005 (0,13) 0.025 (0,635) 0°–/C02578° 0.005 (0,13) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). D. Falls within JEDEC MO-118

MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040078/F 12/97 0,25 0,15 NOM Gage Plane 6,00 6,20 8,30 7,90 0,75 0,50 Seating Plane 0,27 0,17 A 1,20 MAX M0,08 0,10 0,50 0°–8° 14,10 13,90 48DIM A MAX A MIN PINS ** 12,40 12,60 17,10 16,90 0,15 0,05 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

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