54F646 NSC | Alldatasheet

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Technical content

Features

Y Independent registers for A and B buses Y Multiplexed real-time and stored data Y ’F648 has inverting data paths Y ’F646/’F646B have non-inverting data paths Y ’F646B is a faster version of the ’F646 Y TRI-STATE outputs Y 300 mil slim DIP Y Guaranteed 4000V minimum ESD protection Commercial Military Package Package DescriptionNumber 74F646SPC N24C 24-Lead (0.300 × Wide) Molded Dual-In-Line 54F646DM (Note 2) J24F 24-Lead (0.300 ×Wide) Ceramic Dual-In-Line 74F646SC (Note 1) M24B 24-Lead (0.300 × Wide) Molded Small Outline, JEDEC 74F646MSA (Note 1) MSA24 24-Lead Molded Shrink Small Outline, EIAJ, Type II 54F646FM (Note 2) W24C 24-Lead Cerpack 54F646LM (Note 2) E28A 28-Lead Ceramic Leadless Chip Carrier, Type C 74F646BSPC N24C 24-Lead (0.300 × Wide) Molded Dual-In-Line 74F646BSC (Note 1) M24B 24-Lead (0.300 × Wide) Molded Small Outline, JEDEC 74F648SPC N24C 24-Lead (0.300 × Wide) Molded Dual-In-Line 54F648SDM (Note 2) J24F 24-Lead (0.300 × Wide) Ceramic Dual-In-Line 74F648SC (Note 1) M24B 24-Lead (0.300 × Wide) Molded Small Outline, JEDEC 54F648FM (Note 2) W24C 24-Lead Cerpack 54F648LM (Note 2) E28A 24-Lead Ceramic Leadless Chip Carrier, Type C Note 1: Devices also available in 13 × reel. Use suffix e SCX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Logic Symbols ’F646/’F646B TL/F/9580–1 ’F648 TL/F/9580–7 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.

Logic Symbols (Continued) IEEE/IEC ’F646/’F646B TL/F/9580–4 IEEE/IEC ’F648 TL/F/9580–9 Connection Diagrams Pin Assignment for DIP, SOIC and Flatpak ’F646/’F646B TL/F/9580–2 Pin Assignment for LCC ’F646/’F646B TL/F/9580–3 Pin Assignment for DIP, SOIC and Flatpak ’F648 TL/F/9580–8 Pin Assignment for LCC ’F648 TL/F/9580–10

Pin Names Description U.L. Input I IH/IIL HIGH/LOW Output I OH/IOL A0 –A7 Data Register A Inputs/ 3.5/1.083 70 mA/b650 mA TRI-STATE Outputs 600/106.6 (80) b12 mA/64 mA (48 mA) B0 –B7 Data Register B Inputs/ 3.5/1.083 70 mA/b650 mA TRI-STATE Outputs 600/106.6 (80) b12 mA/64 mA (48 mA) CPAB, CPBA Clock Pulse Inputs 1.0/1.0 20 mA/b0.6 mA SAB, SBA Select Inputs 1.0/1.0 20 mA/b0.6 mA G Output Enable Input 1.0/1.0 20 mA/b0.6 mA DIR Direction Control Input 1.0/1.0 20 mA/b0.6 mA Function Table Inputs Data I/O * Function G DIR CPAB CPBA SAB SBA A 0 –A7 B0 –B7 H X H or L H or L X X Isolation HX L X X X Input Input Clock A n Data into A Register HX X L X X Clock B n Data into B Register LH X X L X A n to B nÐReal Time (Transparent Mode) LH L XL X Input Output Clock A n Data into A Register L H H or L X H X A Register to B n (Stored Mode) LH L X H X Clock A n Data into A Register and Output to B n LL X X X L B n to A nÐReal Time (Transparent Mode) LL X L XL Output Input Clock B n Data into B Register L L X H or L X H B Register to A n (Stored Mode) LL X L X H Clock B n Data into B Register and Output to A n *The data output functions may be enabled or disabled by various signals at the G and DIR Inputs. Data input functions are always enabled; i.e., data at the bus pins will be stored on every LOW-to-HIGH transition of the clock inputs. H e HIGH Voltage Level L e LOW Voltage Level X e Irrelevant L e LOW-to-HIGH Transition

Logic Diagrams (Continued) ’F646/’F646B TL/F/9580–5 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

Logic Diagrams (Continued) ’F648 TL/F/9580–6 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b65§Ct o a150§C Ambient Temperature under Bias b55§Ct o a125§C Junction Temperature under Bias b55§Ct o a175§C Plastic b55§Ct o a150§C VCC Pin Potential to Ground Pin b0.5V to a7.0V Input Voltage (Note 2) b0.5V to a7.0V Input Current (Note 2) b30 mA to a5.0 mA Voltage Applied to Output in HIGH State (with V CC e 0V) Standard Output b0.5V to V CC TRI-STATE Output b0.5V to a5.5V Current Applied to Output in LOW State (Max) twice the rated I OL (mA) ESD Last Passing Voltage (Min) 4000V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Recommended Operating Conditions Free Air Ambient Temperature Military b55§Ct o a125§C Commercial 0 §Ct o a70§C Supply Voltage Military a4.5V to a5.5V Commercial a4.5V to a5.5V Symbol Parameter 54F/74F Units V CC Conditions Min Typ Max VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal VCD Input Clamp Diode Voltage b1.2 V Min I IN eb 18 mA (Non I/O Pins) VOH Output HIGH 54F 10% V CC 2.0 V Min IOH eb 12 mA (A n,B n) Voltage 74F 10% V CC 2.0 I OH eb 15 mA (A n,B n) VOL Output LOW 54F 10% V CC 0.55 V Min IOL e 48 mA (A n,B n) Voltage 74F 10% V CC 0.55 I OL e 64 mA (A n,B n) IIH Input HIGH 54F 20.0 mA Max VIN e 2.7V (Non I/O Pins) Current 74F 5.0 IBVI Input HIGH Current 54F 100 mA Max VIN e 7.0V (Non I/O Pins) Breakdown Test 74F 7.0 IBVIT Input HIGH Current 54F 1.0 mA Max VIN e 5.5V (A n,B n) Breakdown (I/O) 74F 0.5 ICEX Output HIGH 54F 250 mA Max VOUT e VCC Leakage Current 74F 50 VID Input Leakage 74F 4.75 V 0.0 IID e 1.9 mA Test All Other Pins Grounded IOD Output Leakage 74F 3.75 mA 0.0 VIOD e 150 mV Circuit Current All Other Pins Grounded IIL Input LOW Current b0.6 mA Max V IN e 0.5V (Non I/O Pins) IIH a IOZH Output Leakage Current 70 mA Max V OUT e 2.7V (A n,B n) IIL a IOZL Output Leakage Current b650 mA Max V OUT e 0.5V (A n,B n) IOS Output Short-Circuit Current b100 b225 mA Max V OUT e 0V IZZ Bus Drainage Test 500 mA 0.0V V OUT e 5.25V ICCH Power Supply Current 135 mA Max V O e HIGH ICCL Power Supply Current 150 mA Max V O e LOW ICCZ Power Supply Current 150 mA Max V O e HIGH Z

’F646/’F648 74F 54F 74F TA ea 25§C TA,V CC e Mil T A,V CC e ComSymbol Parameter V CC ea 5.0V CL e 50 pF C L e 50 pF Units CL e 50 pF Min Max Min Max Min Max fmax Maximum Clock Frequency 90 75 90 MHz ’F646/’F648 AC Operating Requirements 74F 54F 74F Symbol Parameter TA ea 25§C TA,V CC e Mil T A,V CC e Com UnitsVCC ea 5.0V Min Max Min Max Min Max

’F646B 74F 54F 74F TA ea 25§C TA,V CC e Mil T A,V CC e ComSymbol Parameter V CC ea 5.0V CL e 50 pF C L e 50 pF Units CL e 50 pF Min Max Min Max Min Max fmax Maximum Clock Frequency 165 150 MHz ’F646B AC Operating Requirements 74F 54F 74F Symbol Parameter TA ea 25§C TA,V CC e Mil T A,V CC e Com UnitsVCC ea 5.0V Min Max Min Max Min Max ts(H) Setup Time, HIGH or LOW 5.0 4.0 nsts(L) Bus to Clock 5.0 4.0 th(H) Hold Time, HIGH or LOW 1.5 1.5 nsth(L) Bus to Clock 1.5 1.5 tw(H) Clock Pulse Width 5.0 5.0 nstw(L) HIGH or LOW 5.0 5.0

Ordering Information

The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 646/646B/648 S C X Temperature Range Family Special Variations 74F e Commercial QB e Military grade device with 54F e Military environmental and burn-in processingDevice Type X e Devices shipped in 13 × reel Package Code Temperature RangeSP e Slim Plastic DIP C e CommercialSD e Slim Ceramic DIP (0§Ct o a70§C)S e Small Outline (SOIC) M e MilitaryMSA e Shrink Small Outline SOIC EIAJ Type II (M646 only) (b55§Ct o a125§C)L e Leadless Chip Carrier F e Flatpak

Physical Dimensions inches (millimeters) 28-Lead Ceramic Leadless Chip Carrier, Type C 24-Lead (0.300 × Wide) Ceramic Dual-In-Line Package (SD)

Physical Dimensions inches (millimeters) (Continued) 24-Lead (0.300 × Wide) Molded Small Outline Package, JEDEC (S)

Physical Dimensions inches (millimeters) (Continued) 24-Lead Molded Shrink Small Outline Package, EIAJ, Type II 24-Lead (0.300 × Wide) Molded Dual-In-Line Package (SP)

54F/74F646 # 74F646B # 54F/74F648 Octal Transceiver/Register with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) 24-Lead Cerpack LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor National Semiconductores National Semiconductor Corporation GmbH Japan Ltd. Hong Kong Ltd. Do Brazil Ltda. (Australia) Pty, Ltd. 2900 Semiconductor Drive Livry-Gargan-Str. 10 Sumitomo Chemical 13th Floor, Straight Block, Rue Deputado Lacorda Franco Building 16 P.O. Box 58090 D-82256 F 4urstenfeldbruck Engineering Center Ocean Centre, 5 Canton Rd. 120-3A Business Park Drive Santa Clara, CA 95052-8090 Germany Bldg. 7F Tsimshatsui, Kowloon Sao Paulo-SP Monash Business Park Tel: 1(800) 272-9959 Tel: (81-41) 35-0 1-7-1, Nakase, Mihama-Ku Hong Kong Brazil 05418-000 Nottinghill, Melbourne TWX: (910) 339-9240 Telex: 527649 Chiba-City, Tel: (852) 2737-1600 Tel: (55-11) 212-5066 Victoria 3168 Australia Fax: (81-41) 35-1 Ciba Prefecture 261 Fax: (852) 2736-9960 Telex: 391-1131931 NSBR BR Tel: (3) 558-9999 Tel: (043) 299-2300 Fax: (55-11) 212-1181 Fax: (3) 558-9998 Fax: (043) 299-2500 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.