54F64DM NSC | Alldatasheet
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54F/74F64 4-2-3-2-Input AND-OR-Invert Gate November 1994 54F/74F64 4-2-3-2-Input AND-OR-Invert Gate General Description This device contains gates configured to perform a 4-2-3-2 input AND-OR-INVERT function. Commercial Military Package Package DescriptionNumber 74F64PC N14A 14-Lead (0.300 × Wide) Molded Dual-In-Line 54F64DM (Note 2) J14A 14-Lead Ceramic Dual-In-Line 74F64SC (Note 1) M14A 14-Lead (0.150 × Wide) Molded Small Outline, JEDEC 54F64FM (Note 2) W14B 14-Lead Cerpack 54F64LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C Note 1: Devices also available in 13 × reel. Use suffix e SCX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Logic Symbol IEEE/IEC TL/F/9467–3 Connection Diagrams Pin Assignment for DIP, SOIC and Flatpak TL/F/9467–2 Pin Assignment for LCC TL/F/9467–1 Unit Loading/Fan Out 54F/74F Pin Names Description U.L. Input I IH/IIL HIGH/LOW Output I OH/IOL An,B n,C n,D n Inputs 1.0/1.0 20 mA/b0.6 mA O Output 50/33.3 b1 mA/20 mA TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.
Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b65§Ct o a150§C Ambient Temperature under Bias b55§Ct o a125§C Junction Temperature under Bias b55§Ct o a175§C Plastic b55§Ct o a150§C VCC Pin Potential to Ground Pin b0.5V to a7.0V Input Voltage (Note 2) b0.5V to a7.0V Input Current (Note 2) b30 mA to a5.0 mA Voltage Applied to Output in HIGH State (with V CC e 0V) Standard Output b0.5V to V CC TRI-STATEÉ Output b0.5V to a5.5V Current Applied to Output in LOW State (Max) twice the rated I OL (mA) Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Recommended Operating Conditions Free Air Ambient Temperature Military b55§Ct o a125§C Commercial 0 §Ct o a70§C Supply Voltage Military a4.5V to a5.5V Commercial a4.5V to a5.5V Symbol Parameter 54F/74F Units V CC Conditions Min Typ Max VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal VCD Input Clamp Diode Voltage b1.2 V Min I IN eb 18 mA VOH Output HIGH 54F 10% V CC 2.5 I OH eb 1m A Voltage 74F 10% V CC 2.5 V Min I OH eb 1m A 74F 5% V CC 2.7 I OH eb 1m A VOL Output LOW 54F 10% V CC 0.5 V Min IOL e 20 mA Voltage 74F 10% V CC 0.5 I OL e 20 mA IIH Input HIGH 54F 20.0 mA Max VIN e 2.7V Current 74F 5.0 IBVI Input HIGH Current 54F 100 mA Max VIN e 7.0V Breakdown Test 74F 7.0 ICEX Output High 54F 250 mA Max VOUT e VCC Leakage Current 74F 50 VID Input Leakage 74F 4.75 V 0.0 IID e 1.9 mA Test All Other Pins Grounded IOD Output Leakage 74F 3.75 mA 0.0 VIOD e 150 mV Circuit Current All Other Pins Grounded IIL Input LOW Current b0.6 mA Max V IN e 0.5V IOS Output Short-Circuit Current b60 b150 mA Max V OUT e 0V ICCH Power Supply Current 1.9 2.8 mA Max V O e HIGH ICCL Power Supply Current 3.1 4.7 mA Max V O e LOW
TA ea 25§C TA,V CC e Mil T A,V CC e ComSymbol Parameter V CC ea 5.0V CL e 50 pF C L e 50 pF Units CL e 50 pF Min Typ Max Min Max Min Max
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 64 S C X Temperature Range Family Special Variations 74F e Commercial QB e Military grade device with 54F e Military environmental and burn-in processingDevice Type X e Devices shipped in 13 × reel Package Code Temperature RangeP e Plastic DIP C e Commercial (0 §Ct o a70§C)D e Ceramic DIP M e Military ( b55§Ct o a125§C)F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC
Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) 14-Lead Ceramic Dual-In-Line Package (D)
Physical Dimensions inches (millimeters) (Continued) 14-Lead (0.150 × Wide) Molded Small Outline, JEDEC (S) 14-Lead (0.300 × Wide) Molded Dual-In-Line Package (P)
54F/74F64 4-2-3-2-Input AND-OR-Invert Gate Physical Dimensions inches (millimeters) (Continued) 14-Lead Ceramic Flatpak (F) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.
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