74F545SC

54F545DM NSC | Alldatasheet

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Technical content

Features

Y 8-bit bidirectional data flow reduces system package count Y TRI-STATE inputs/outputs for interfacing with bus-ori- ented systems Y 24 mA (20 mA Mil) and 64 mA (48 mA Mil) bus drive capability on A and B ports, respectively Y Transmit/Receive and Output Enable simplify control logic Y Guaranteed 4000V minimum ESD protection Y Pin for Pin compatible with Intel 8286 Commercial Military Package Package DescriptionNumber 74F545PC N20A 20-Lead (0.300 × Wide) Molded Dual-In-Line 54F545DM (Note 2) J20A 20-Lead Ceramic Dual-In-Line 74F545SC (Note 1) M20B 20-Lead (0.300 × Wide) Molded Small Outline, JEDEC 74F545SJ (Note 1) M20D 20-Lead (0.300 × Wide) Molded Small Outline, EIAJ 54F545FM (Note 2) W20A 20-Lead Cerpack 54F545LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C Note 1: Devices also available in 13 × reel. Use suffix e SCX and SJX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Logic Symbols TL/F/9556–3 IEEE/IEC TL/F/9556–5 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.

DIP, SOIC and Flatpak TL/F/9556–1 Pin Assignment for LCC TL/F/9556–2 Truth Table Inputs Outputs OE T/R L L Bus B Data to Bus A L H Bus A Data to Bus B H X High Z H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial Z e High Impedance Unit Loading/Fan Out 54F/74F Pin Names Description U.L. Input I IH/IIL HIGH/LOW Output I OH/IOL OE Output Enable Input (Active LOW) 1.0/2.0 20 mA/b1.2 mA T/R Transmit/Receive Input 1.0/2.0 20 mA/b1.2 mA A0 –A7 Side A TRI-STATE Inputs or 3.5/1.083 70 mA/b650 mA TRI-STATE Outputs 150/40 (33.3) b3 mA/24 mA (20 mA) B0 –B7 Side B TRI-STATE Inputs or 3.5/1.083 70 mA/b650 mA TRI-STATE Outputs 600/106.6 (80) b12 mA/64 mA (48 mA)

Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b65§Ct o a150§C Ambient Temperature under Bias b55§Ct o a125§C Junction Temperature under Bias b55§Ct o a175§C Plastic b55§Ct o a150§C VCC Pin Potential to Ground Pin b0.5V to a7.0V Input Voltage (Note 2) b0.5V to a7.0V Input Current (Note 2) b30 mA to a5.0 mA Voltage Applied to Output in HIGH State (with V CC e 0V) Standard Output b0.5V to V CC TRI-STATE Output b0.5V to a5.5V Current Applied to Output in LOW State (Max) twice the rated I OL (mA) ESD Last Passing Voltage (Min) 4000V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Recommended Operating Conditions Free Air Ambient Temperature Military b55§Ct o a125§C Commercial 0 §Ct o a70§C Supply Voltage Military a4.5V to a5.5V Commercial a4.5V to a5.5V Symbol Parameter 54F/74F Units V CC Conditions Min Typ Max VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal VCD Input Clamp Diode Voltage b1.2 V Min I IN eb 18 mA (OE , T/R ) VOH Output HIGH 54F 10% V CC 2.5 I OH eb 1m A( A n) Voltage 54F 10% V CC 2.4 I OH eb 3m A( A n) 54F 10% V CC 2.0 I OH eb 12 mA (B n) 74F 10% V CC 2.5 V Min IOH eb 1m A( A n) 74F 10% V CC 2.4 I OH eb 3m A( A n) 74F 10% V CC 2.0 I OH eb 15 mA (B n) 74F 5% V CC 2.7 I OH eb 1m A( A n) 74F 5% V CC 2.7 I OH eb 3m A( A n) VOL Output LOW 54F 10% V CC 0.5 I OL e 20 mA (A n) Voltage 54F 10% V CC 0.55 V Min IOL e 48 mA (B n) 74F 10% V CC 0.5 I OL e 24 mA (A n) 74F 10% V CC 0.55 I OL e 64 mA (B n) IIH Input HIGH 54F 20.0 mA Max VIN e 2.7V (OE , T/R ) Current 74F 5.0 IBVI Input HIGH Current 54F 100 mA Max VIN e 7.0V (OE , T/R ) Breakdown Test 74F 7.0 IBVIT Input HIGH Current 54F 1.0 mA Max VIN e 5.5V (A n,B n) Breakdown (I/O) 74F 0.5 ICEX Output HIGH 54F 250 mA Max VOUT e VCC Leakage Current 74F 50 VID Input Leakage 74F 4.75 V 0.0 IID e 1.9 mA Test All Other Pins Grounded IOD Output Leakage 74F 3.75 mA 0.0 VIOD e 150 mV Circuit Current All Other Pins Grounded IIL Input LOW Current b1.2 mA Max V IN e 0.5V (OE , T/R ) IIH a IOZH Output Leakage Current 70 mA Max V OUT e 2.7V (A n,B n) IIL a IOZL Output Leakage Current b650 mA Max V OUT e 0.5V (A n,B n) IOS Output Short-Circuit Current b60 b150 mA Max VOUT e 0V (A n) b100 b225 V OUT e 0V (B n)

Symbol Parameter 54F/74F Units V CC Conditions Min Typ Max IZZ Bus Drainage Test 500 mA 0.0V V OUT e 5.25V ICCH Power Supply Current 70 90 mA Max V O e HIGH ICCL Power Supply Current 95 120 mA Max V O e LOW ICCZ Power Supply Current 85 110 mA Max V O e HIGH Z 74F 54F 74F TA ea 25§C TA,V CC e Mil T A,V CC e ComSymbol Parameter V CC ea 5.0V CL e 50 pF C L e 50 pF Units CL e 50 pF Min Typ Max Min Max Min Max Logic Diagram TL/F/9556–4 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

Ordering Information

The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 545 S C X Temperature Range Family Special Variations 74F e Commercial QB e Military grade device with 54F e Military environmental and burn-in processingDevice Type X e Devices shipped in 13 × reel Package Code Temperature RangeP e Plastic DIP C e Commercial (0 §Ct o a70§C)D e Ceramic DIP M e Military ( b55§Ct o a125§C)F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ

Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) 20-Lead Ceramic Dual-In-Line Package (D)

Physical Dimensions inches (millimeters) (Continued) 20-Lead (0.300 × Wide) Molded Small Outline Package, JEDEC (S) 20-Lead (0.300 × Wide) Molded Small Outline Package, EIAJ

Physical Dimensions inches (millimeters) (Continued) 20-Lead (0.300 × Wide) Molded Dual-In-Line Package (P)

54F/74F545 Octal Bidirectional Transceiver with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) 20-Lead Ceramic Flatpak (F) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.

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a49) 0-180-530 85 86 13th Floor, Straight Block, Tel: 81-043-299-2309 Arlington, TX 76017 Email: cnjwge @ tevm2.nsc.com Ocean Centre, 5 Canton Rd. Fax: 81-043-299-2408 Tel: 1(800) 272-9959 Deutsch Tel: ( a49) 0-180-530 85 85 Tsimshatsui, Kowloon Fax: 1(800) 737-7018 English Tel: ( a49) 0-180-532 78 32 Hong Kong Fran3ais Tel: ( a49) 0-180-532 93 58 Tel: (852) 2737-1600 Italiano Tel: ( a49) 0-180-534 16 80 Fax: (852) 2736-9960 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.