74F525 NSC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 10

Technical content

Features

Y Digitally programmed monostable Y Variable system frequency generator Y Digital filter variable sampling rate Y 16-bit data path Y External trigger Y Extremely accurate one shot w/pulse widths from 50 ns to 3.27 ms @CP e 40 MHz Commercial Package Package DescriptionNumber 74F525QC (Note 1) V28A 28-Lead Molded Plastic Leaded Chip Carrier 74F525SC (Note 1) M28B 28-Lead (0.300 × Wide) Molded Small Outline, JEDEC 74F525PC N28B 28-Lead (0.600 × Wide) Molded Dual-In-Line Package Note 1: Devices also available in 13 × reel. Use suffix e SCX and QCX. Connection Diagrams Pin Assignment DIP and SOIC TL/F/9547–2 Pin Assignment for PCC TL/F/9547–3 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.

Absolute Maximum Ratings (Note 1) Storage Temperature b65§Ct o a150§C Ambient Temperature under Bias b55§Ct o a125§C Junction Temperature under Bias b55§Ct o a175§C Plastic b55§Ct o a150§C VCC Pin Potential to Ground Pin b0.5V to a7.0V Input Voltage (Note 2) b0.5V to a7.0V Input Current (Note 2) b30 mA to a5.0 mA Voltage Applied to Output in HIGH State (with V CC e 0V) Standard Output b0.5V to V CC TRI-STATEÉ Output b0.5V to a5.5V Current Applied to Output in LOW State (Max) twice the rated I OL (mA) Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Recommended Operating Conditions Free Air Ambient Temperature Commercial 0 §Ct o a70§C Supply Voltage Commercial a4.5V to a5.5V Symbol Parameter 74F Units V CC Conditions Min Typ Max VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal VCD Input Clamp Diode Voltage b1.2 V Min I IN eb 18 mA VOH Output HIGH 74F 10% V CC 2.5 V Min IOH eb 1m A Voltage 74F 5% V CC 2.7 I OH eb 1m A VOL Output LOW 74F 10% V CC 0.5 V Min IOL e 20 mA Voltage IIH Input HIGH 74F 5.0 mA Max VIN e 2.7V Current IBVI Input HIGH Current 74F 7.0 mA Max VIN e 7.0V Breakdown Test ICEX Output HIGH 74F 50 mA Max VOUT e VCC Leakage Current VID Input Leakage 74F 4.75 V 0.0 IID e 1.9 mA Test All Other Pins Grounded IOD Output Leakage 74F 3.75 mA 0.0 VIOD e 150 mV Circuit Current All Other Pins Grounded IIL Input LOW Current b0.6 mA Max VIN e 0.5V (D0–D15) b1.2 V IN e 0.5V (CP, XTR) IOS Output Short-Circuit Current b60 b150 mA Max V OUT e 0V ICCH Power Supply Current 106 160 mA Max V O e HIGH ICCL Power Supply Current 106 160 mA Max V O e LOW

TA ea 25§C TA,V CC e ComSymbol Parameter V CC ea 5.0V CL e 50 pF Units CL e 50 pF Min Typ Max Min Max fmax Maximum Clock Frequency 50 60 40 MHz AC Operating Requirements 74F 74F Symbol Parameter TA ea 25§C TA,V CC e Com UnitsVCC ea 5.0V Min Max Min Max ts(H) Setup Time, HIGH or LOW 2.0 2.5 nsts(L) D n to WE 4.0 4.5 th(H) Hold Time, HIGH or LOW 0 0 nsth(L) D n to WE 2.0 2.5 ts(H) Setup Time, HIGH or LOW 9.0 10.0 nsts(L) D n to CP 10.5 12.0 th(H) Hold Time, HIGH or LOW 0 0 nsth(L) D n to CP 0 0 ts(H) Setup Time, HIGH or LOW 7.0 8.0 nsts(L) XTR to CP 8.0 9.0 th(H) Hold Time, HIGH or LOW 00 n sXTR to CP ts(H) Setup Time, HIGH or LOW 33.5 35.5 nsts(L) Mode to CP 33.5 35.5 tw(H) XTR Pulse Width, HIGH 11.5 13.0 ns tw(L) MR Pulse Width, LOW 7.0 8.0 ns tw(L) WE Pulse Width, LOW 4.5 5.0 ns tw(H) CP Pulse Width 3.5 4.0 nstw(L) HIGH or LOW 9.5 10.5 trec Recovery Time 5.0 6.0 nsMR to CP trec Recovery Time 30.0 32.0 nsMode to CP

Ordering Information

The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 525 S C X Temperature Range Family Special Variations 74F e Commercial X e Devices shipped in 13 × reel Device Type Temperature Range C e Commercial (0 §Ct o a70§C)Package Code Q ePlastic Chip Carrier (PCC) S eSmall Outline (SOIC) P ePlastic DIP

Physical Dimensions inches (millimeters) 28-Lead (0.300 × Wide) Molded Small Outline Package, JEDEC (S) 28-Lead (0.600 × Wide) Molded Dual-In-Line Package, (P)

74F525 Programmable Counter Physical Dimensions inches (millimeters) (Continued) 28-Lead Molded Plastic Leaded Chip Carrier (Q) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.

1111 West Bardin Road Fax: (

a49) 0-180-530 85 86 13th Floor, Straight Block, Tel: 81-043-299-2309 Arlington, TX 76017 Email: cnjwge @ tevm2.nsc.com Ocean Centre, 5 Canton Rd. Fax: 81-043-299-2408 Tel: 1(800) 272-9959 Deutsch Tel: ( a49) 0-180-530 85 85 Tsimshatsui, Kowloon Fax: 1(800) 737-7018 English Tel: ( a49) 0-180-532 78 32 Hong Kong Fran3ais Tel: ( a49) 0-180-532 93 58 Tel: (852) 2737-1600 Italiano Tel: ( a49) 0-180-534 16 80 Fax: (852) 2736-9960 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.