74F366 FAIRCHILD | Alldatasheet

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■ 3-STATE buffer outputs sink 64 mA ■ High-speed ■ Bus-oriented ■ High impedance npn base inputs for reduced loading Ordering Code: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Connection Diagrams 74F366 74F368 Order Number Package Number Package Description 74F366SC M16A 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 Narrow 74F366PC N16E 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide 74F368SC M16A 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 Narrow 74F368SJ M16D 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F368PC N16E 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide

www.fairchildsemi.com 2 74F366•74F368 Logic Symbols IEEE/IEC 74F366 IEEE/IEC 74F368 Unit Loading/Fan Out Function Tables 74F366 74F368 Pin Names Description U.L. Input IIH/IIL HIGH/LOW Output IOH /IOL OE 1, OE2 Output Enable Input (Active LOW) 1.0/0.033 20 µA/−20 µA In Input 1.0/0.033 20 µA/−20 µA O n, On Outputs 600/106.6 (80) −12 mA/64 mA (48 mA) Inputs Output OE 1 OE 2 IO LL L H LL H L XH X Z HX X Z Inputs Output OE IO LL H LH L HX Z L = LOW Voltage Level X = Immaterial H = HIGH Voltage Level Z = High Impedance

3 www.fairchildsemi.com 74F366•74F368 Absolute Maximum Ratings(Note 1) Recommended Operating Conditions Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Storage Temperature −65°C to +150°C Ambient Temperature under Bias −55°C to +125°C Junction Temperature under Bias −55°C to +150°C VCC Pin Potential to Ground Pin −0.5V to +7.0V Input Voltage (Note 2) −0.5V to +7.0V Input Current (Note 2) −30 mA to +5.0 mA Voltage Applied to Output in HIGH State (with VCC = 0V) Standard Output −0.5V to VCC 3-STATE Output −0.5V to +5.5V Current Applied to Output in LOW State (Max) twice the rated I OL (mA) Free Air Ambient Temperature 0 °C to +70°C Supply Voltage +4.5V to +5.5V Symbol Parameter Min Typ Max Units VCC Conditions VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal VCD Input Clamp Diode Voltage −1.2 V Min I IN = −18 mA VOH Output HIGH 10% V CC 2.0 V Min I OH = −15 mA Voltage VOL Output LOW 10% V CC 0.55 V Min I OL = 64 mA Voltage IIH Input HIGH Current 20 µAM a x V IN = 2.7V IBVI Input HIGH Current 100 µAM a x V IN = 7.0V Breakdown Test IIL Input LOW Current −20 µAM a x V IN = 0.5V IOZH Output Leakage Current 50 µAM a x V OUT = 2.7V IOZL Output Leakage Current −50 µAM a x V OUT = 0.5V IOS Output Short-Circuit Current −100 −225 mA Max V OUT = 0V ICEX Output HIGH Leakage Current 250 µAM a x V OUT = VCC IZZ Bus Drainage Test 500 µA0 . 0 V V OUT = 5.25V ICCH Power Supply Current 20 25 mA Max V O = HIGH ICCL Power Supply Current 49 62 mA Max V O = LOW ICCZ Power Supply Current 35 48 mA Max V O = HIGH Z Symbol Parameter TA = +25°CT A = 0°C to +70°C Units VCC = +5.0V C L = 50 pF C L = 50 pF C L = 50 pF Min Typ Max Min Max ns ns ns ns

www.fairchildsemi.com 4 74F366•74F368 Physical Dimensions inches (millimeters) unless otherwise noted 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 Narrow Package Number M16A 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M16D

5 www.fairchildsemi.com 74F366•74F368 Hex Inverter Buffer with 3-STATE Outputs Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide Package Number N16E Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea- sonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support device or system whose failure to perform can be rea- sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com