54F365 NSC | Alldatasheet

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Features

Y TRI-STATE buffer outputs Y Outputs sink 64 mA Y Bus-oriented Commercial Military Package Package DescriptionNumber 74F365PC N16E 16-Lead (0.300 × Wide) Molded Dual-In-Line 54F365DM (Note 2) J16A 16-Lead Ceramic Dual-In-Line 74F365SC (Note 1) M16A 16-Lead (0.150 × Wide) Molded Small Outline, JEDEC 54F365FM (Note 2) W16A 16-Lead Cerpack 54F365LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C Note 1: Devices also available in 13 × reel. Use suffix e SCX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Logic Symbol Connection Diagrams IEEE/IEC TL/F/9522–4 Pin Assignment for DIP, SOIC and Flatpak TL/F/9522–1 Pin Assignment for LCC TL/F/9522–2 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.

Pin Names Description U.L. Input I IH/IIL HIGH/LOW Output I OH/IOL OE1,O E 2 Output Enable Input 1.0/0.033 20 mA/20 mA (Active LOW) In Inputs 1.0/0.033 20 mA/20 mA On Outputs 600/106.6 (80) b12 mA/64 mA (48 mA) Function Table Inputs Output OE1 OE2 IO LL LL LL HH XH X Z HX X Z L e LOW Voltage Level H e HIGH Voltage Level X e Immaterial Z e High Impedance

Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b65§Ct o a150§C Ambient Temperature under Bias b55§Ct o a125§C Junction Temperature under Bias b55§Ct o a175§C Plastic b55§Ct o a150§C VCC Pin Potential to Ground Pin b0.5V to a7.0V Input Voltage (Note 2) b0.5V to a7.0V Input Current (Note 2) b30 mA to a5.0 mA Voltage Applied to Output in HIGH State (with V CC e 0V) Standard Output b0.5V to V CC TRI-STATE Output b0.5V to a5.5V Current Applied to Output in LOW State (Max) twice the rated I OL (mA) Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Recommended Operating Conditions Free Air Ambient Temperature Military b55§Ct o a125§C Commercial 0 §Ct o a70§C Supply Voltage Military a4.5V to a5.5V Commercial a4.5V to a5.5V Symbol Parameter 54F/74F Units V CC Conditions Min Typ Max VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal VCD Input Clamp Diode Voltage b1.2 V Min I IN eb 18 mA VOH Output HIGH 54F 10% V CC 2.4 I OH eb 3m A Voltage 54F 10% V CC 2.0 I OH eb 12 mA 74F 10% V CC 2.4 V Min I OH eb 3m A 74F 10% V CC 2.0 I OH eb 15 mA 74F 5% V CC 2.7 I OH eb 3m A VOL Output LOW 54F 10% V CC 0.55 V Min IOL e 48 mA Voltage 74F 10% V CC 0.55 I OL e 64 mA IIH Input HIGH Current 20 mA Max V IN e 2.7V IBVI Input HIGH Current 100 mA 0.0 VIN e 7.0V Breakdown Test IIL Input LOW Current b20 mA Max V IN e 0.5V IOZH Output Leakage Current 50 mA Max V OUT e 2.7V IOZL Output Leakage Current b50 mA Max V OUT e 0.5V IOS Output Short-Circuit Current b100 b225 mA Max V OUT e 0V ICEX Output HIGH Leakage Current 250 mA Max V OUT e VCC IZZ Bus Drainage Test 500 mA 0.0V V OUT e 5.25V ICCH Power Supply Current 25 35 mA Max V O e HIGH ICCL Power Supply Current 44 62 mA Max V O e LOW ICCZ Power Supply Current 35 48 mA Max V O e HIGH Z

TA ea 25§C TA,V CC e Mil T A,V CC e ComSymbol Parameter V CC ea 5.0V CL e 50 pF C L e 50 pF Units CL e 50 pF Min Typ Max Min Max Min Max

Ordering Information

The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 365 S C X Temperature Range Family Special Variations 74FeCommercial QB e Military grade device with 54FeMilitary environmental and burn-in processingDevice Type X e Devices shipped in 13 × reels Package Code Temperature RangeP e Plastic DIP CeCommercial (0 §Ct o a70§C)D e Ceramic DIP MeMilitary ( b55§Ct o a125§C)F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline (SOIC)

Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) 16-Lead Ceramic Dual-In-Line Package (D)

Physical Dimensions inches (millimeters) (Continued) 16-Lead (0.150 × Wide) Molded Small Outline Package, JEDEC (S) 16-Lead (0.300 × Wide) Molded Dual-In-Line Package (P)

54F/74F365 Hex Buffer/Driver with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) 16-Lead Ceramic Flatpak (F) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.

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