74F2244

54F2244DM NSC | Alldatasheet

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Technical content

Features

Y TRI-STATEÉ outputs drive bus lines or buffer memory address registers Y 12 mA source current Y 25X series resistors in outputs eliminate the need for external resistors. Y Designed to drive the capacitive inputs of MOS devices Y Guaranteed 4000V minimum ESD protection Commercial Military Package Package DescriptionNumber 74F2244PC N20B 20-Lead (0.300 × Wide) Molded Dual-In-Line 54F2244DM (Note 2) J20A 20-Lead Ceramic Dual-In-Line 74F2244SC (Note 1) M20B 20-Lead (0.300 × Wide) Molded Small Outline JEDEC 74F2244MSA (Note 1) MSA20 20-Lead Molded Shrink Small Outline EIAJ Type II 54F2244FM (Note 2) W20A 20-Lead Cerpak 54F2244LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carier, Type C Note 1: Devices also available in 13 × reel. Use suffix e SCX and MSAX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Connection Diagrams Pin Assignment for LCC ’F2244 TL/F/9499–3 Pin Assignment for DIP, SOIC and SSOP ’F2244 TL/F/9499–4 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.

’F2244 TL/F/9499–6 Unit Loading/Fan Out 54F/74F Pin Names Description U.L. Input I IH/IIL HIGH/LOW Output I OH/IOL OE1,O E 2 TRI-STATE Output Enable Input (Active LOW) 1.0/1.667 20 mA/b1m A OE2 TRI-STATE Output Enable Input (Active HIGH) 1.0/1.667 20 mA/b1m A Ian,I bn Inputs 1.0/2.667 * 20 mA/b1.6 mA Oan,Obn Outputs 750/20 b15 mA/12 mA *Worst-case ’F2244 disabled Truth Table ’F2244 OE1 Ian Oan OE2 Ibn Obn HXZ HXZ LH H LH H LLL LLL H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial Z e High Impedance

Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b65§Ct o a150§C Ambient Temperature under Bias b55§Ct o a125§C Junction Temperature under Bias b55§Ct o a175§C Plastic b55§Ct o a150§C VCC Pin Potential to Ground Pin b0.5V to a7.0V Input Voltage (Note 2) b0.5V to a7.0V Input Current (Note 2) b30 mA to a5.0 mA Voltage Applied to Output in HIGH State (with V CC e 0V) Standard Output b0.5V to V CC TRI-STATE Output b0.5V to a5.5V Current Applied to Output in LOW State (Max) twice the rated I OL (mA) ESD Last Passing Voltage (Min) 4000V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Recommended Operating Conditions Free Air Ambient Temperature Military b55§Ct o a125§C Commercial 0 §Ct o a70§C Supply Voltage Military a4.5V to a5.5V Commercial a4.5V to a5.5V Symbol Parameter 54F/74F Units V CC Conditions Min Typ Max VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal VCD Input Clamp Diode Voltage b1.2 V Min I IN eb 18 mA VOH Output HIGH 54F 10% V CC 2.4 I OH eb 3m A Voltage 54F 10% V CC 2.0 I OH eb 12 mA 74F 10% V CC 2.4 V Min IOH eb 3m A 74F 10% V CC 2.0 I OH eb 15 mA 74F 5% V CC 2.7 I OH eb 3m A VOL Output LOW 0.50 V Min IOL e 1m A Voltage 0.75 I OL e 12 mA IIH Input HIGH 54F 20.0 mA Max V IN e 2.7VCurrent 74F 5.0 IBVI Input HIGH Current 54F 100 mA Max V IN e 7.0VBreakdown Test 74F 7.0 ICEX Output HIGH 54F 250 mA Max V OUT e VCCLeakage Current 74F 50 VID Input Leakage 74F 4.75 V 0.0 IID e 1.9 mA Test All other pins grounded IOD Output Leakage 74F 3.75 mA 0.0 VIOD e 150 mV Circuit Current All other pins grounded IIL Input LOW Current b1.0 mA Max VIN e 0.5V (OE 1,O E 2,O E 2) b1.6 V IN e 0.5V (I n) IOZH Output Leakage Current 50 mA Max V OUT e 2.7V IOZL Output Leakage Current b50 mA Max V OUT e 0.5V IOS Output Short-Circuit Current b100 b225 mA Max V OUT e 0V ICCH Power Supply Current 40 60 mA Max V O e HIGH ICCL Power Supply Current 60 90 mA Max V O e LOW ICCZ Power Supply Current 60 90 mA Max V O e HIGH Z

TA ea 25§C TA,V CC e Mil T A,V CC e ComSymbol Parameter V CC ea 5.0V CL e 50 pF C L e 50 pF Units CL e 50 pF Min Typ Max Min Max Min Max

Ordering Information

The device number is used to form part of a simplified purchasing code where a package type and temperature range are defined as follows: 74F 2244 S C X Temperature Range Family Special Variations 74F e Commercial QB e Military grade device with 54F e Military environmental and burn-in processingDevice Type X e Devices shipped in 13 × reel Package Code Temperature RangeP e Plastic DIP C e Commercial (0 §Ct o a70§C)D e Ceramic DIP M e Military ( b55§Ct o a125§C)S e Small Outline Package (SOIC) MSA e Shrink Small Outline Package SOIC EIAJ Type II (74F244 only) L e Leadless Chip Carrier (LCC) F e Flatpak

Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier, Type C (L) 20-Lead Ceramic Dual-In-Line Package (D)

Physical Dimensions inches (millimeters) (Continued) 20-Lead Molded Shrink Small Outline Package, EIAJ Type II (MSA) 20-Lead (0.300 × Wide) Molded Dual-In-Line Package (P)

54F/74F2244 Octal Buffer/Line Driver with 25 X Series Resistors in Outputs Physical Dimensions inches (millimeters) (Continued) 20-Lead Cerpak (F) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.

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