54F219DL NSC | Alldatasheet

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Technical content

Features

Y TRI-STATE outputs for data bus applications Y Buffered inputs minimize loading Y Address decoding on-chip Y Diode clamped inputs minimize ringing Y Available in SOIC (300 mil only) Commercial Military Package Package DescriptionNumber 74F219PC N16E 16-Lead (0.300 × Wide) Molded Dual-In-Line 54F219DL (Note 2) J16A 16-Lead Ceramic Dual-In-Line 74F219SC (Note 1) M16B 16-Lead (0.300 × Wide) Molded Small Outline, JEDEC 74F219SJ (Note 1) M16D 16-Lead (0.300 × Wide) Molded Small Outline, EIAJ 54F219FL (Note 2) W16A 16-Lead Cerpack 54F219LL (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C Note 1: Devices also available in 13 × reel. Use suffix e SCX and SJX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DLQB, FLQB and LLQB. Logic Symbol TL/F/9500–1 Connection Diagrams Pin Assignment for DIP, SOIC and Flatpak TL/F/9500–2 Pin Assignment for LCC TL/F/9500–3 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.

Pin Names Description U.L. Input I IH/IIL HIGH/LOW Output I OH/IOL A0 –A3 Address Inputs 1.0/1.0 20 mA/b0.6 mA CS Chip Select Input (Active LOW) 1.0/2.0 20 mA/b1.2 mA WE Write Enable Input (Active LOW) 1.0/1.0 20 mA/b0.6 mA D0 –D3 Data Inputs 1.0/1.0 20 mA/b0.6 mA O0 –O3 TRI-STATE Data Outputs 150/40 (33.3) b3 mA/24 mA (20 mA) Function Table Inputs Operation Condition of Outputs CS WE L L Write High Impedance L H Read True Stored Data H X Inhibit High Impedance H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial Block Diagram TL/F/9500–4

Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b65§Ct o a150§C Ambient Temperature under Bias b55§Ct o a125§C Junction Temperature under Bias b55§Ct o a175§C Plastic b55§Ct o a150§C VCC Pin Potential to Ground Pin b0.5V to a7.0V Input Voltage (Note 2) b0.5V to a7.0V Input Current (Note 2) b30 mA to a5.0 mA Voltage Applied to Output in HIGH State (with V CC e 0V) Standard Output b0.5V to V CC TRI-STATE Output b0.5V to a5.5V Current Applied to Output in LOW State (Max) twice the rated I OL (mA) Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Recommended Operating Conditions Free Air Ambient Temperature Military b55§Ct o a100§C Commercial 0 §Ct o a70§C Supply Voltage Military a4.5V to a5.5V Commercial a4.5V to a5.5V Symbol Parameter 54F/74F Units V CC Conditions Min Typ Max VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal VCD Input Clamp Diode Voltage b1.2 V Min I IN eb 18 mA VOH Output HIGH 54F 10% V CC 2.5 I OH eb 1m A Voltage 54F 10% V CC 2.4 I OH eb 3m A 74F 10% V CC 2.5 V Min IOH eb 1m A 74F 10% V CC 2.4 I OH eb 3m A 74F 5% V CC 2.7 I OH eb 1m A 74F 5% V CC 2.7 I OH eb 3m A VOL Output LOW 54F 10% V CC 0.5 V Min IOL e 20 mA Voltage 74F 10% V CC 0.5 I OL e 24 mA IIH Input HIGH 54F 20.0 mA Max VIN e 2.7V Current 74F 5.0 IBVI Input HIGH Current 54F 100 mA Max VIN e 7.0V Breakdown Test 74F 7.0 ICEX Output HIGH 54F 250 mA Max VOUT e VCC Leakage Current 74F 50 VID Input Leakage 74F 4.75 V 0.0 IID e 1.9 mA Test All Other Pins Grounded IOD Output Leakage 74F 3.75 mA 0.0 VIOD e 150 mV Circuit Current All Other Pins Grounded IIL Input LOW b0.6 mA Max VIN e 0.5V (A n,W E ,D n) Current b1.2 V IN e 0.5V (CS ) IOZH Output Leakage Current 50 mA Max V OUT e 2.7V IOZL Output Leakage Current b50 mA Max V OUT e 0.5V IOS Output Short-Circuit Current b60 b150 mA Max V OUT e 0V IZZ Bus Drainage Test 500 mA 0.0V V OUT e 5.25V ICC Power Supply Current 37 55 mA Max

TA ea 25§CT A ea 100§C TA,V CC e ComSymbol Parameter V CC ea 5.0V V CC e Mil CL e 50 pF Units CL e 50 pF C L e 50 pF Min Typ Max Min Max Min Max AC Operating Requirements 74F 54F 74F Symbol Parameter TA ea 25§CT A ea 100§C TA,V CC e Com UnitsVCC ea 5.0V V CC e Mil Min Max Min Max Min Max ts(H) Setup Time, HIGH or LOW 0 0 0 ts(L) A n to WE 000 ns th(H) Hold Time, HIGH or LOW 2.0 2.0 2.0 th(L) A n to WE 2.0 2.0 2.0 ts(H) Setup Time, HIGH or LOW 10.0 11.0 10.0 ts(L) D n to WE 10.0 11.0 10.0 ns th(H) Hold Time, HIGH or LOW 0 2.0 0 th(L) D n to WE 0 2.0 0 ts(L) Setup Time, LOW 000CS to WE ns th(L) Hold Time, LOW 6.0 7.5 6.0CS to WE tw(L) WE Pulse Width, LOW 6.0 15.0 6.0 ns

Ordering Information

The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 219 S C X Temperature Range Family Special Variations 74F e Commercial QB e Military grade device with 54F e Military environmental and burn-in processingDevice Type X e Devices shipped in 13 × reel Package Code Temperature RangeP e Plastic DIP C e Commercial (0 §Ct o a70§C)D e Ceramic DIP L e Military ( b55§Ct o a100§C)F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L)

Physical Dimensions inches (millimeters) (Continued) 16-Lead Ceramic Dual-In-Line Package (D) 16-Lead (0.300 × Wide) Molded Small Outline Package, JEDEC (S)

Physical Dimensions inches (millimeters) (Continued) 16-Lead (0.300 × Wide) Molded Small Outline Package, EIAJ (SJ) 16-Lead (0.300 × Wide) Molded Dual-In-Line Package (P)

54F/74F219 64-Bit Random Access Memory with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) 16-Lead Ceramic Flatpak (F) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.

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