SN74CBT16233_06 TI | Alldatasheet
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16-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER SCDS010K – MAY 1995 – REVISED NOVEMBER 2001 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068 Member of the Texas Instruments Widebus Family /C0068 5-Ω Switch Connection Between Two Ports /C0068 TTL-Compatible Input Levels
description
The SN74CBT16233 is a 16-bit 1-of-2 FET multiplexer/demultiplexer used in applications in which two separate data paths must be multiplexed onto, or demultiplexed from, a single path. This device can be used for memory interleaving, where two different banks of memory need to be addressed simultaneously. The device can be used as two 8-bit to 16-bit multiplexers or as one 16-bit to 32-bit multiplexer. Two select (SEL1 and SEL2) inputs control the data flow. When the TEST inputs are asserted, the A port is connected to both the B1 and the B2 ports. SEL1, SEL2, and the TEST inputs can be driven with a 5-V CMOS, a 5-V TTL, or a low-voltage TTL driver. This device is designed so it does not have through current when switching directions.
ORDERING INFORMATION
TA PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING SSOP DL Tube SN74CBT16233DL CBT16233 40°Ct o8 5°C SSOP – DL Tape and reel SN74CBT16233DLR CBT16233 –40°C to 85°C TSSOP – DGG Tape and reel SN74CBT16233DGGR CBT16233 TVSOP – DGV Tape and reel SN74CBT16233DGVR CY233 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DGG, DGV, OR DL PACKAGE (TOP VIEW) 2B1 2B2 4B1 4B2 6B1 6B2 8B1 8B2 GND V CC 10B1 10B2 11A 12B1 12B2 13A 14B1 14B2 15A 16B1 16B2 TEST1 TEST2 1B1 1B2 3B1 3B2 5B1 5B2 7B1 7B2 GND V CC 9B1 9B2 10A 11B1 11B2 12A 13B1 13B2 14A 15B1 15B2 16A SEL1 SEL2 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 2001, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments.
16-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER SCDS010K – MAY 1995 – REVISED NOVEMBER 2001
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
(each multiplexer/demultiplexer) INPUTS FUNCTION SEL TEST FUNCTION L L A = B1 H L A = B2 X H A = B1 and A = B2 logic diagram (positive logic) 8B1 1B1 SEL1 1B2 8B2 TEST1 16B1 9B1 16A SEL2 9B2 16B2 TEST2 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7.
16-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER SCDS010K – MAY 1995 – REVISED NOVEMBER 2001 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 recommended operating conditions (see Note 3) MIN MAX UNIT VCC Supply voltage 4.75 5.25 V VIH High-level control input voltage 2 V VIL Low-level control input voltage 0.8 V TA Operating free-air temperature –40 85 °C NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP † MAX UNIT VIK VCC = 4.75 V, II = –18 mA –1.2 V II VCC = 0, VI = 5.25 V 10 µA II VCC = 5.25 V, VI = 5.25 V or GND ±1 µA ICC VCC = 5.25 V, IO = 0, VI = VCC or GND 3 µA ∆ICC ‡ Control inputsVCC = 5.25 V, One input at 3.4 V, Other inputs at VCC or GND 2.5 mA C i Control inputsVI = 3 V or 0 4.5 pF C io(OFF) VO = 3 V or 0 4 pF § VI=0 II = 64 mA 5 7 ron§ VCC = 4.75 V VI = 0 II = 30 mA 5 7 Ω VI = 2.4 V, II = 15 mA 7 12 † All typical values are at VCC = 5 V, TA = 25°C. ‡ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. § Measured by the voltage drop between A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals. switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM TO MIN MAX UNITPARAMETER (INPUT) (OUTPUT) MIN MAX UNIT tpd¶ A or B B or A 0.25 ns tpd SEL A 1.6 5.3 ns ten TEST or SEL B 1.3 5.2 ns tdis TEST or SEL B 1 5.3 ns ¶ The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
NOTES: A. C L includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω , tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) 74CBT16233DGGRE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74CBT16233DGVRE4 ACTIVE TVSOP DGV 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74CBT16233DGVRG4 ACTIVE TVSOP DGV 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16233DGGR ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16233DGVR ACTIVE TVSOP DGV 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16233DL ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16233DLG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16233DLR ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16233DLRG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 23-Sep-2006 Addendum-Page 1
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
3,70 3,50 4,90 5,10 20DIM PINS ** 4073251/E 08/00 1,20 MAX Seating Plane 0,05 0,15 0,25 0,50 0,75 0,23 0,13 11 2 24 13 4,30 4,50 0,16 NOM Gage Plane A 7,90 7,70 382416 4,90 5,103,70 3,50 A MAX A MIN 6,60 6,20 11,20 11,40 9,60 9,80 0,08 M0,070,40 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040048/E 12/01
48 PINS SHOWN
0.730 (18,54) 0.720 (18,29) 4828 0.370 (9,40) (9,65) 0.380 Gage Plane DIM 0.420 (10,67) 0.395 (10,03) A MIN A MAX 0.010 (0,25) PINS ** 0.630 (16,00) (15,75) 0.620 0.010 (0,25) Seating Plane 0.020 (0,51) 0.040 (1,02) 0.008 (0,203) 0.0135 (0,343) 0.008 (0,20) MIN A 0.110 (2,79) MAX 0.299 (7,59) 0.291 (7,39) 0.004 (0,10) M0.005 (0,13) 0.025 (0,635) 0°–/C02578° 0.005 (0,13) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). D. Falls within JEDEC MO-118
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040078/F 12/97 0,25 0,15 NOM Gage Plane 6,00 6,20 8,30 7,90 0,75 0,50 Seating Plane 0,27 0,17 A 1,20 MAX M0,08 0,10 0,50 0°–8° 14,10 13,90 48DIM A MAX A MIN PINS ** 12,40 12,60 17,10 16,90 0,15 0,05 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
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