SN54CBT16209_07 TI | Alldatasheet
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/C0083/C0078/C0053/C0052/C0067/C0066/C0084/C0049/C0054/C0050/C0048/C0057/C0044 /C0083/C0078/C0055/C0052/C0067/C0066/C0084/C0049/C0054/C0050/C0048/C0057/C0065 /C0049/C0056/C0262/C0066/C0073/C0084 /C0070/C0069/C0084 /C0066/C0085/C0083/C0262/C0069/C0088/C0067/C0072/C0065/C0078/C0071/C0069 /C0083/C0087/C0073/C0084/C0067/C0072/C0069/C0083 SCDS006O − NOVEMBER 1992 − REVISED NOVEMBER 2004 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Members of the Texas Instruments Widebus Family /C00685-Ω Switch Connection Between Two Ports /C0068TTL-Compatible Input Levels description/ordering information The SN54CBT16209 and SN74CBT16209A devices provide 18 bits of high-speed TTL-compatible bus switching or exchanging. The low on-state resistance of the switches allows connections to be made with minimal propagation delay. The devices operate as an 18-bit bus switch or a 9-bit bus exchanger, which provides data exchanging between the four signal ports via the data-select (S0, S1, S2) terminals.
ORDERING INFORMATION
TA PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING SSOP − DL Tube SN74CBT16209ADL CBT16209A −40°C to 85°C SSOP − DL Tape and reel SN74CBT16209ADLR CBT16209A −40°C to 85°C TSSOP − DGG Tape and reel SN74CBT16209ADGGR CBT16209A TVSOP − DGV Tape and reel SN74CBT16209ADGVR CY209A −55°C to 125°C CFP − WD Tube SNJ54CBT16209WD SNJ54CBT16209WD † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Copyright 2004, Texas Instruments Incorporated 1A1 1A2 GND 2A1 2A2 V CC 3A1 3A2 GND 4A1 4A2 5A1 5A2 GND 6A1 6A2 7A1 7A2 GND 8A1 8A2 9A1 9A2 1B1 1B2 2B1 2B2 GND 3B1 3B2 GND 4B1 4B2 5B1 5B2 GND 6B1 6B2 7B1 7B2 GND 8B1 8B2 9B1 9B2 SN54CBT16209 ...W D PACKAGE SN74CBT16209A . . . DGG, DGV, OR DL PACKAGE (TOP VIEW) /C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. /C0079/C0110 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0109/C0112/C0108/C0105/C0097/C0110/C0116 /C0116/C0111 /C0077/C0073/C0076/C0262/C0080/C0082/C0070/C0262/C0051/C0056/C0053/C0051/C0053/C0044 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115 /C0097/C0114/C0101 /C0116/C0101/C0115/C0116/C0101/C0100 /C0117/C0110/C0108/C0101/C0115/C0115 /C0111/C0116/C0104/C0101/C0114/C0119/C0105/C0115/C0101 /C0110/C0111/C0116/C0101/C0100/C0046 /C0079/C0110 /C0097/C0108/C0108 /C0111/C0116/C0104/C0101/C0114 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0115/C0044 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 Widebus is a trademark of Texas Instruments.
/C0083/C0078/C0053/C0052/C0067/C0066/C0084/C0049/C0054/C0050/C0048/C0057/C0044 /C0083/C0078/C0055/C0052/C0067/C0066/C0084/C0049/C0054/C0050/C0048/C0057/C0065 /C0049/C0056/C0262/C0066/C0073/C0084 /C0070/C0069/C0084 /C0066/C0085/C0083/C0262/C0069/C0088/C0067/C0072/C0065/C0078/C0071/C0069 /C0083/C0087/C0073/C0084/C0067/C0072/C0069/C0083 SCDS006O − NOVEMBER 1992 − REVISED NOVEMBER 2004
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTIONS2 S1 S0 A1 A2 FUNCTION L L L Z Z Disconnect L LH B 1 Z A1 port = B1 port L HL B 2 Z A1 port = B2 port L HH Z B1 A2 port = B1 port H LL Z B2 A2 port = B2 port H LH Z Z Disconnect H HL B 1 B2 A1 port = B1 port A2 port = B2 port H H H B2 B1 A1 port = B2 port A2 port = B1 port
/C0083/C0078/C0053/C0052/C0067/C0066/C0084/C0049/C0054/C0050/C0048/C0057/C0044 /C0083/C0078/C0055/C0052/C0067/C0066/C0084/C0049/C0054/C0050/C0048/C0057/C0065 /C0049/C0056/C0262/C0066/C0073/C0084 /C0070/C0069/C0084 /C0066/C0085/C0083/C0262/C0069/C0088/C0067/C0072/C0065/C0078/C0071/C0069 /C0083/C0087/C0073/C0084/C0067/C0072/C0069/C0083 SCDS006O − NOVEMBER 1992 − REVISED NOVEMBER 2004 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 logic diagram (positive logic) 9B2 9B1 1B2 1B1 9A2 9A1 1A2 1A1
/C0083/C0078/C0053/C0052/C0067/C0066/C0084/C0049/C0054/C0050/C0048/C0057/C0044 /C0083/C0078/C0055/C0052/C0067/C0066/C0084/C0049/C0054/C0050/C0048/C0057/C0065 /C0049/C0056/C0262/C0066/C0073/C0084 /C0070/C0069/C0084 /C0066/C0085/C0083/C0262/C0069/C0088/C0067/C0072/C0065/C0078/C0071/C0069 /C0083/C0087/C0073/C0084/C0067/C0072/C0069/C0083 SCDS006O − NOVEMBER 1992 − REVISED NOVEMBER 2004
4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54CBT16209 SN74CBT16209A UNITMIN MAX MIN MAX UNIT VCC Supply voltage 4 5.5 4 5.5 V VIH High-level control input voltage 2 2 V VIL Low-level control input voltage 0.8 0.8 V TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP ‡ MAX UNIT VIK VCC = 4.5 V, II = −18 mA −1.2 V II VCC = 0, VI = 5.5 V 10 AII VCC = 5.5 V, VI = 5.5 V or GND ±1 µA ICC VCC = 5.5 V, IO = 0, VI = VCC or GND 3 µA ∆ICC § Control inputsVCC = 5.5 V, One input at 3.4 V,Other inputs at VCC or GND 2.5 mA C i Control inputsVI = 3 V or 0 4 pF C io(OFF) VO = 3 V or 0, S0, S1, and S2 = GND 7.5 pF VCC = 4 V TYP at VCC = 4 V VI = 2.4 V, II = 15 mA 14 20 ron¶ VI = 0 II = 64 mA 4 8 Ωron¶ VCC = 4.5 V VI = 0 II = 30 mA 4 8 Ω VCC = 4.5 V VI = 2.4 V, II = 15 mA 6 15 ‡ All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. § This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. ¶ Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals.
- On products compliant to MIL-PRF-38535, this parameter is not production tested.
driven by an ideal voltage source (zero output impedance). NOTES: A. C L includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) 5962-9669701QXA ACTIVE CFP WD 48 1 TBD A42 SNPB N / A for Pkg Type 74CBT16209ADGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74CBT16209ADGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74CBT16209ADGVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74CBT16209ADGVRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16209ADGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16209ADGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16209ADL ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16209ADLG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16209ADLR ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT16209ADLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54CBT16209WD ACTIVE CFP WD 48 1 TBD A42 SNPB N / A for Pkg Type (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Addendum-Page 1
to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Addendum-Page 2
TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant SN74CBT16209ADGGR DGG 48 SITE 41 330 24 8.6 15.8 1.8 12 24 Q1 SN74CBT16209ADGVR DGV 48 SITE 41 330 24 6.8 10.1 1.6 12 24 Q1 SN74CBT16209ADLR DL 48 SITE 41 330 32 11.35 16.2 3.1 16 32 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Pack Materials-Page 1
Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74CBT16209ADGGR DGG 48 SITE 41 346.0 346.0 41.0 SN74CBT16209ADGVR DGV 48 SITE 41 346.0 346.0 41.0 SN74CBT16209ADLR DL 48 SITE 41 346.0 346.0 49.0 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Pack Materials-Page 2
MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 WD (R-GDFP-F**) CERAMIC DUAL FLATPACK 4040176/D 10/97
48 LEADS SHOWN
0.610 (18,80) 0.710 (18,03) 0.7400.640 0.390 (9,91) 0.370 (9,40) 0.870 (22,10) 1.130 (28,70) A 0.120 (3,05) 0.075 (1,91) LEADS** NO. OF A MIN A MAX (16,26) (15,49) 0.025 (0,635) 0.009 (0,23) 0.004 (0,10) 0.370 (9,40) 0.250 (6,35) 0.370 (9,40) 0.250 (6,35) 0.014 (0,36) 0.008 (0,20) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a ceramic lid using glass frit. D. Index point is provided on cap for terminal identification only E. Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO-146AA GDFP1-F56 and JEDEC MO-146AB
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
3,70 3,50 4,90 5,10 20DIM PINS ** 4073251/E 08/00 1,20 MAX Seating Plane 0,05 0,15 0,25 0,50 0,75 0,23 0,13 11 2 24 13 4,30 4,50 0,16 NOM Gage Plane A 7,90 7,70 382416 4,90 5,103,70 3,50 A MAX A MIN 6,60 6,20 11,20 11,40 9,60 9,80 0,08 M0,070,40 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040048/E 12/01
48 PINS SHOWN
0.730 (18,54) 0.720 (18,29) 4828 0.370 (9,40) (9,65) 0.380 Gage Plane DIM 0.420 (10,67) 0.395 (10,03) A MIN A MAX 0.010 (0,25) PINS ** 0.630 (16,00) (15,75) 0.620 0.010 (0,25) Seating Plane 0.020 (0,51) 0.040 (1,02) 0.008 (0,203) 0.0135 (0,343) 0.008 (0,20) MIN A 0.110 (2,79) MAX 0.299 (7,59) 0.291 (7,39) 0.004 (0,10) M0.005 (0,13) 0.025 (0,635) 0°–/C02578° 0.005 (0,13) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). D. Falls within JEDEC MO-118
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040078/F 12/97 0,25 0,15 NOM Gage Plane 6,00 6,20 8,30 7,90 0,75 0,50 Seating Plane 0,27 0,17 A 1,20 MAX M0,08 0,10 0,50 0°–8° 14,10 13,90 48DIM A MAX A MIN PINS ** 12,40 12,60 17,10 16,90 0,15 0,05 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
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