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  1. General description The 74AXP1G125 is a single buffer/line driver with 3-state output. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.7 V to 2.75 V. It is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down. 2. Features and benefits  Wide supply voltage range from 0.7 V to 2.75 V  Low input capacitance; CI = 0.5 pF (typical)  Low output capacitance; CO = 1.0 pF (typical)  Low dynamic power consumption; CPD = 2.5 pF at VCC = 1.2 V (typical)  Low static power consumption; ICC = 0.6 A (85 C maximum)  High noise immunity  Complies with JEDEC standard:  JESD8-12A.01 (1.1 V to 1.3 V)  JESD8-11A.01 (1.4 V to 1.6 V)  JESD8-7A (1.65 V to 1.95 V)  JESD8-5A.01 (2.3 V to 2.7 V)  ESD protection:  HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV  CDM JESD22-C101E exceeds 1000 V  Latch-up performance exceeds 100 mA per JESD 78 Class II  Inputs accept voltages up to 2.75 V  Low noise overshoot and undershoot < 10 % of VCC  IOFF circuitry provides partial Power-down mode operation  Multiple package options  Specified from 40 Ct o+ 8 5C 74AXP1G125 Low-power buffer/line driver; 3-state Rev. 1 — 16 January 2014 Product data sheet

[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. Table 1. Ordering information Table 2. Marking

6.1 Pinning

6.2 Pin description

Z = high-impedance OFF-state. Table 3. Pin description Table 4. Function table [1]

[1] The minimum input and output voltage ratings may be exceed ed if the input and output current ratings are observed.

  1. Recommended operating conditions

Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V).

[1] All typical values are measured at V CC = 1.2 V. Table 7. Static characteristics At recommended operating conditions, unless otherwise specified; voltages are referenced to GND (ground = 0 V).

Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 13.

[1] All typical values are measured at nominal V CC. [2] t pd is the same as tPLH and tPHL. [3] t en is the same as tPZH and tPZL. [4] t dis is the same as tPHZ and tPLZ. [5] For additional propagation delays and enable times values at different load capacitances see Figure 8 to Figure 12. [6] t t is the same as tTHL and tTLH. [7] C PD is used to determine the dynamic power dissipation (PD in W). N = number of inputs switching. Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 13. Measurement points are given in Table 9. VOL and VOH are typical output voltage levels that occur with the output load.

Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage drops that occur with the output load. Table 9. Measurement points Tamb = 40 C to +85 C unless otherwise specified. Tamb = 40 C to +85 C unless otherwise specified.

Product data sheet Rev. 1 — 16 January 2014 9 of 18 NXP Semiconductors 74AXP1G125 Low-power buffer/line driver; 3-state Tamb = 40 C to +85 C unless otherwise specified. (1) Minimum: V CC = 1.6 V (2) Typical: T amb = 25 C; VCC = 1.5 V (3) Maximum: V CC = 1.4 V Tamb = 40 C to +85 C unless otherwise specified. (1) Minimum: V CC = 1.3 V (2) Typical: T amb = 25 C; VCC = 1.2 V (3) Maximum: V CC = 1.1 V Fig 10. Additional t pd and ten versus load capacitance Fig 11. Additional t pd and ten versus load capacitance DDD ǻWW QV DDD ǻW QV Tamb = 40 C to +85 C unless otherwise specified. (1) Minimum: V CC = 0.85 V (2) Typical: T amb = 25 C; VCC = 0.8 V (3) Maximum: V CC = 0.75 V Fig 12. Additional t pd and ten versus load capacitance DDD ǻW QV

Test data is given in Table 10. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Table 10. Test data

Product data sheet Rev. 1 — 16 January 2014 11 of 18 NXP Semiconductors 74AXP1G125 Low-power buffer/line driver; 3-state 13. Package outline Fig 14. Package outline SOT886 (XSON6) 5HIHUHQFHV2XWOLQH YHUVLRQ (XURSHDQ SURMHFWLRQ ,VVXHGDWH ,(& -('(& -(,7$ 627 02 VRWBSR 8QLW PP PD[ QRP PLQ 'LPHQVLRQV PPDUHWKHRULJLQDOGLPHQVLRQV 1RWHV ,QFOXGLQJSODWLQJWKLFNQHVV &DQEHYLVLEOHLQVRPHPDQXIDFWXULQJSURFHVVHV ;621 SODVWLFH[WUHPHO\\WKLQVPDOORXWOLQHSDFNDJH QROHDGV WHUPLQDOV ERG\\[[PP 627 $ E '(HH WHUPLQDO LQGH[DUHD H H E H PP VFDOH

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Product data sheet Rev. 1 — 16 January 2014 14 of 18 NXP Semiconductors 74AXP1G125 Low-power buffer/line driver; 3-state Fig 17. Package outline SOT1226 (X2SON5) 5HIHUHQFHV2XWOLQH YHUVLRQ (XURSHDQ SURMHFWLRQ ,VVXHGDWH ,(& -('(& (,$- 627 VRWBSR 8QLW PP PD[ QRP PLQ 'LPHQVLRQV 1RWH 'LPHQVLRQ$LVLQFOXGLQJSODWLQJWKLFNQHVV 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 627 $ $ '' K (EH N/Y VFDOH PP WHUPLQDO LQGH[DUHD $ % GHWDLO; \\&\\ WHUPLQDO LQGH[DUHD E N H $ &%Y ;621 SODVWLFWKHUPDOHQKDQFHGH[WUHPHO\\WKLQVPDOORXWOLQHSDFNDJH QROHDGV WHUPLQDOV ERG\\[[PP

Table 11. Abbreviations Table 12. Revision history

Product data sheet Rev. 1 — 16 January 2014 16 of 18 NXP Semiconductors 74AXP1G125 Low-power buffer/line driver; 3-state 16. Legal information

16.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

16.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

16.3 Disclaimers

Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 1 — 16 January 2014 17 of 18 NXP Semiconductors 74AXP1G125 Low-power buffer/line driver; 3-state Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

16.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors 74AXP1G125 Low-power buffer/line driver; 3-state © NXP B.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 January 2014 Document identifier: 74AXP1G125 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 18. Contents