74AVC16269DGGRE4

SN74AVC16269 TI1 | Alldatasheet

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0.4 0.8 1.2 1.6 2.0 2.4 2.8 17015311910285685134170 0.4 0.8 1.2 1.6 2.0 2.4 2.8

3.2 TA = 25° C

Process = Nominal IOL - Output Current - mA VCC = 3.3 V VCC = 2.5 V VCC = 1.8 V - Output Voltage - VOLV TA = 25° C Process = Nominal IOH - Output Current - mA VCC = 3.3 V VCC = 2.5 V VCC = 1.8 V - Output Voltage - VOHV SN74AVC16269 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS SCES152G DECEMBER 1998 REVISED MAY 2005 Overvoltage-Tolerant Inputs/Outputs Allow Mixed-Voltage-Mode Data Communications Member of the Texas Instruments Widebus Family I off Supports Partial-Power-Down Mode Operation EPIC (Enhanced-Performance Implanted CMOS) Submicron Process Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II DOC (Dynamic Output Control) Circuit Dynamically Changes Output Impedance, Package Options Include Plastic Thin Shrink Resulting in Noise Reduction Without Speed Small-Outline (DGG) and Thin Very Degradation Small-Outline (DGV) Packages Dynamic Drive Capability Is Equivalent to Standard Outputs With I OH and I OL of mA at 2.5-V V CC A Dynamic Output Control (DOC circuit is implemented, which, during the transition, initially lowers the output impedance to effectively drive the load and, subsequently, raises the impedance to reduce noise. Figure shows typical V OL vs I OL and V OH vs I OH curves to illustrate the output impedance and drive capability of the circuit. At the beginning of the signal transition, the DOC circuit provides a maximum dynamic drive that is equivalent to a high-drive standard-output device. For more information, refer to the TI application reports, AVC Logic Family Technology and

Applications

SCEA006, and Dynamic Output Control (DOC Circuitry Technology and SCEA009. Figure Output Voltage vs Output Current This 12-bit to 24-bit registered bus exchanger is operational at 1.2-V to 3.6-V V CC but is designed specifically for 1.65-V to 3.6-V V CC operation. The SN74AVC16269 is used in onto, or demultiplexed from, a single port. The device is particularly suitable as an interface between synchronous DRAMs and high-speed microprocessors. Data is stored in the internal B-port registers on the low-to-high transition of the clock (CLK) input when the appropriate clock-enable CLKENA inputs are low. Proper control of these inputs allows two sequential 12-bit words to be presented as a 24-bit word on the B port. For data transfer in the B-to-A direction, a single storage register is provided. The select SEL line selects or data for the A outputs. The register on the A output permits the fastest possible data transfer, thus extending the period during which the data is valid on the bus. Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. Widebus, EPIC, DOC are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright 1998 2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com (CONTINUED) TERMINAL ASSIGNMENTS DGG OR DGV PACKAGE (TOP VIEW) OEA OEB1 2B3 GND 2B2 2B1 V CC GND GND A10 A11 A12 V CC 1B1 1B2 GND 1B3 NC SEL OEB2 CLKENA2 2B4 GND 2B5 2B6 V CC 2B7 2B8 2B9 GND 2B10 2B11 2B12 1B12 1B11 1B10 GND 1B9 1B8 1B7 V CC 1B6 1B5 GND 1B4 CLKENA1 CLK NC - No internal connection SN74AVC16269 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS SCES152G DECEMBER 1998 REVISED MAY 2005 The control terminals are registered so that all transactions are synchronous with CLK. Data flow is controlled by the active-low output enables OEA OEB1 OEB2 To ensure the high-impedance state during power up or power down, a clock pulse should be applied as soon as possible, and OE should be tied to V CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Due to OE being routed through a register, the active state of the outputs cannot be determined prior to the arrival of the first clock pulse. This device is fully specified for partial-power-down I off The I off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The SN74AVC16269 is characterized for operation from C to

www.ti.com SN74AVC16269 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS SCES152G DECEMBER 1998 REVISED MAY 2005 FUNCTION TABLES ABC OUTPUT ENABLE INPUTS OUTPUTS CLK OEA OEB A 1B, H H Z Z H L Z Active L H Active Z L L Active Active A-TO-B STORAGE OEB INPUTS OUTPUTS CLKENA1 CLKENA2 CLK A H H X X (1) (1) L X L L X L X H H X X L L X L X L H X H (1) Output level before the indicated steady-state input conditions were established B-TO-A STORAGE OEA INPUTS OUTPUT A CLK SEL X H X X A (1) X L X X A (1) H L X L H H X H L X L L L X H H (1) Output level before the indicated steady-state input conditions were established

www.ti.com CLK SEL A1 1B1 2B1 CLKENA1 CLKENA2 CE CE OEA 1 of 12 Channels OEB1 OEB2 1D 8 23 SN74AVC16269 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS SCES152G DECEMBER 1998 REVISED MAY 2005 LOGIC DIAGRAM (POSITIVE LOGIC)

www.ti.com Absolute Maximum Ratings (1) SN74AVC16269 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS SCES152G DECEMBER 1998 REVISED MAY 2005 over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage range 0.5 4.6 V V I Input voltage range (2) 0.5 4.6 V Voltage range applied to any input/output V O 0.5 4.6 V when the output is in the high-impedance or power-off state (2) V O Voltage range applied to any input/output when the output is in the high or low state (2) (3) 0.5 V CC 0.5 V I IK Input clamp current V I mA I OK Output clamp current V O mA I O Continuous output current mA Continuous current through each V CC or GND 100 mA DGG package θ JA Package thermal impedance (4) C/W DGV package T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. (3) The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current rating is observed. (4) The package thermal impedance is calculated in accordance with JESD 51.

www.ti.com Recommended Operating Conditions (1) SN74AVC16269 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS SCES152G DECEMBER 1998 REVISED MAY 2005 MIN MAX UNIT Operating 1.4 3.6 V CC Supply voltage V Data retention only 1.2 V CC 1.2 V V CC V CC 1.4 V to 1.6 V 0.65 V CC V IH High-level input voltage V CC 1.65 V to 1.95 V 0.65 V CC V V CC 2.3 V to 2.7 V 1.7 V CC V to 3.6 V V CC 1.2 V GND V CC 1.4 V to 1.6 V 0.35 V CC V IL Low-level input voltage V CC 1.65 V to 1.95 V 0.35 V CC V V CC 2.3 V to 2.7 V 0.7 V CC V to 3.6 V 0.8 V I Input voltage 3.6 V Active state V CC V O Output voltage V 3-state 3.6 V CC 1.4 V to 1.6 V V CC 1.65 V to 1.95 V I OHS Static high-level output current (2) mA V CC 2.3 V to 2.7 V V CC V to 3.6 V V CC 1.4 V to 1.6 V V CC 1.65 V to 1.95 V I OLS Static low-level output current (2) mA V CC 2.3 V to 2.7 V V CC V to 3.6 V Δ Δ v Input transition rise or fall rate V CC 1.4 V to 3.6 V ns/V T A Operating free-air temperature C (1) All unused inputs of the device must be held at V CC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs literature number SCBA004. (2) Dynamic drive capability is equivalent to standard outputs with I OH and I OL of mA at 3.3-V V CC See Figure for V OL vs I OL and V OH vs I OH characteristics. Refer to the TI application reports, AVC Logic Family Technology and SCEA006, and Dynamic Output Control (DOC Circuitry Technology and SCEA009.

www.ti.com Electrical Characteristics Timing Requirements SN74AVC16269 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS SCES152G DECEMBER 1998 REVISED MAY 2005 over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS V CC MIN TYP (1) MAX UNIT I OHS 100 µ A 1.4 V to 3.6 V V CC 0.2 I OHS mA, V IH 0.91 V 1.4 V 1.05 V OH I OHS mA, V IH 1.07 V 1.65 V 1.2 V I OHS mA, V IH 1.7 V 2.3 V 1.75 I OHS mA, V IH V V 2.3 I OLS 100 µ A 1.4 V to 3.6 V 0.2 I OLS mA, V IL 0.49 V 1.4 V 0.4 V OL I OLS mA, V IL 0.57 V 1.65 V 0.45 V I OLS mA, V IL 0.7 V 2.3 V 0.55 I OLS mA, V IL 0.8 V V 0.7 I I Control inputs V I V CC or GND 3.6 V 2.5 µ A I off V I or V O 3.6 V µ A I OZ (2) V O V CC or GND 3.6 V 12.5 µ A I CC V I V CC or GND, I O 3.6 V µ A 2.5 V 3.5 C i Control inputs V I V CC or GND pF 3.3 V 3.5 2.5 V 8.5 C io A or B ports V O V CC or GND pF 3.3 V 8.5 (1) Typical values are measured at T A (2) For I/O ports, the parameter I OZ includes the input leakage current. over recommended operating free-air temperature range (unless otherwise noted) (see Figure through Figure V CC 1.5 V V CC 1.8 V V CC 2.5 V V CC 3.3 V V CC 1.2 V 0.1 V 0.15 V 0.2 V 0.3 V UNIT TYP MIN MAX MIN MAX MIN MAX MIN MAX f clock Clock frequency 125 175 MHz t w Pulse duration, CLK high or low 5.8 3.5 ns A data before CLK 4.7 3.9 2.6 2.1 1.9 B data before CLK 6.2 4.3 2.1 1.9 SEL before CLK 4.5 3.4 2.2 1.6 1.3 t su Setup time ns CLKENA1 or CLKENA2 before 0.9 0.9 1.1 1.1 CLK OE before CLK 5.4 5.3 1.6 1.1 A data after CLK 1.9 1.2 1.1 B data after CLK 0.4 1.3 0.5 0.6 0.7 SEL after CLK 0.4 0.3 0.4 t h Hold time ns CLKENA1 or CLKENA2 after 2.6 2.2 1.4 1.1 CLK OE after CLK 0.4 0.4 0.4 0.5 0.3

www.ti.com Switching Characteristics Switching Characteristics (1) Operating Characteristics SN74AVC16269 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS SCES152G DECEMBER 1998 REVISED MAY 2005 over recommended operating free-air temperature range (unless otherwise noted) (see Figure through Figure V CC 1.5 V V CC 1.8 V V CC 2.5 V V CC 3.3 V V CC 1.2 V FROM TO 0.1 V 0.15 V 0.2 V 0.3 V PARAMETER UNIT (INPUT) (OUTPUT) TYP MIN MAX MIN MAX MIN MAX MIN MAX f max 125 175 MHz B 13.5 9.5 2.5 6.7 1.6 1.1 t pd CLK ns A 11.6 2.6 7.4 2.2 5.8 1.5 3.5 2.7 B 3.5 2.4 8.5 2.1 4.8 1.5 3.8 t en CLK ns A 14.2 3.2 9.3 6.7 4.4 1.4 3.4 B 4.9 12.3 3.3 8.5 1.9 4.8 1.3 3.7 t dis CLK ns A 11.9 8.7 2.1 6.7 1.8 3.6 1.7 3.4 T A C to C L pF V CC 3.3 V FROM TO 0.15 V PARAMETER UNIT (INPUT) (OUTPUT) MIN MAX B 1.4 2.4 t pd CLK ns A 1.2 2.1 (1) Texas Instruments SPICE simulation data T A C V CC 1.8 V V CC 2.5 V V CC 3.3 V PARAMETER TEST CONDITIONS UNIT TYP TYP TYP Outputs enabled 133 145 168 Power dissipation C pd C L f MHz pF capacitance Outputs disabled 102 109 124

www.ti.com PARAMETER MEASUREMENT INFORMATION VCC/2 VCC/2 VCC/2VCC/2 VCC/2VCC/2 VCC/2VCC/2 VOH VOL thtsu From Output Under Test CL = 15 pF (see Note A) LOAD CIRCUIT S1 Open GND 2 kΩ 2 kΩ Output Control (low-level enabling) Output Waveform 1 S1 at 2 × VCC (see Note B) Output Waveform 2 S1 at GND (see Note B) tPZL tPZH tPLZ tPHZ 0 V VOL + 0.1 V VOH − 0.1 V 0 V VCC 0 V 0 V tw VCC VCC VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES Timing Input Data Input Input tpd tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND TEST S1 NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤/char????????10 MHz, ZO = 50 Ω , tr ≤/char????????2 ns, tf ≤/char????????2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. 0 V VCC VCC/2 tPHL VCC/2 VCC/2 VCC 0 V VOH VOL Input Output VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VCC/2 VCC/2 tPLH 2 × VCC VCC SN74AVC16269 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS SCES152G DECEMBER 1998 REVISED MAY 2005 V CC 1.2 V AND 1.5 V 0.1 V Figure Load Circuit and Voltage Waveforms

www.ti.com PARAMETER MEASUREMENT INFORMATION VCC/2 VCC/2 VCC/2VCC/2 VCC/2VCC/2 VCC/2VCC/2 VOH VOL thtsu From Output Under Test CL = 30 pF (see Note A) LOAD CIRCUIT S1 Open GND 1 kΩ 1 kΩ Output Control (low-level enabling) Output Waveform 1 S1 at 2 × VCC (see Note B) Output Waveform 2 S1 at GND (see Note B) tPZL tPZH tPLZ tPHZ 0 V VOL + 0.15 V VOH − 0.15 V 0 V VCC 0 V 0 V tw VCC VCC VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES Timing Input Data Input Input tpd tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND TEST S1 NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω , tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. 0 V VCC VCC/2 tPHL VCC/2 VCC/2 VCC 0 V VOH VOL Input Output VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VCC/2 VCC/2 tPLH 2 × VCC VCC SN74AVC16269 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS SCES152G DECEMBER 1998 REVISED MAY 2005 V CC 1.8 V 0.15 V Figure Load Circuit and Voltage Waveforms

www.ti.com PARAMETER MEASUREMENT INFORMATION VCC/2 VCC/2 VCC/2VCC/2 VCC/2VCC/2 VCC/2VCC/2 VOH VOL thtsu From Output Under Test CL = 30 pF (see Note A) LOAD CIRCUIT S1 Open GND 500 Ω 500 Ω Output Control (low-level enabling) Output Waveform 1 S1 at 2 × VCC (see Note B) Output Waveform 2 S1 at GND (see Note B) tPZL tPZH tPLZ tPHZ 0 V VOL + 0.15 V VOH − 0.15 V 0 V VCC 0 V 0 V tw VCC VCC VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES Timing Input Data Input Input tpd tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND TEST S1 NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω , tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. 0 V VCC VCC/2 tPHL VCC/2 VCC/2 VCC 0 V VOH VOL Input Output VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VCC/2 VCC/2 tPLH 2 × VCC VCC SN74AVC16269 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS SCES152G DECEMBER 1998 REVISED MAY 2005 V CC 2.5 V 0.2 V Figure Load Circuit and Voltage Waveforms

www.ti.com PARAMETER MEASUREMENT INFORMATION VOH VOL thtsu From Output CL = 30 pF (see Note A) LOAD CIRCUIT 2 × VCC Open GND 500 Ω 500 Ω tPLH tPHL Output Control (low-level enabling) Output Waveform 1 S1 at 2 × VCC (see Note B) Output Waveform 2 S1 at GND (see Note B) tPZL tPZH tPLZ tPHZ VCC 0 V VOH VOL 0 V VOL + 0.3 V VOH − 0.3 V 0 V VCC 0 V 0 V VCC 0 V tw Input VCC VCC VCC VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES Timing Input Data Input Output Input tpd tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND TEST S1 NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤/char????????10 MHz, ZO = 50 Ω , tr ≤/char????????2 ns, tf ≤/char????????2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 SN74AVC16269 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS SCES152G DECEMBER 1998 REVISED MAY 2005 V CC 3.3 V 0.3 V Figure Load Circuit and Voltage Waveforms

www.ti.com 20-Aug-2011 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 74AVC16269DGGRE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AVC16269DGGRG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AVC16269DGGR ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AVC16269DGGR TSSOP DGG 56 2000 367.0 367.0 45.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2

MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040078/F 12/97

48 PINS SHOWN

0,25 0,15 NOM Gage Plane 6,00 6,20 8,30 7,90 0,75 0,50 Seating Plane 0,27 0,17 A 1,20 MAX M0,08 0,10 0,50 0°–8° 14,10 13,90 48DIM A MAX A MIN PINS ** 12,40 12,60 17,10 16,90 0,15 0,05 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

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