74AC08

MC74AC08_06 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

• Outputs Source/Sink 24 mA
• ′ACT08 Has TTL Compatible Inputs
• Pb−Free Packages are Available MAXIMUM RATINGS Rating Symbol Value Unit DC Supply Voltage (Referenced to GND) VCC −0.5 to +7.0 V DC Input Voltage (Referenced to GND) Vin −0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) Vout −0.5 to VCC +0.5 V DC Input Current, per Pin Iin ±20 mA DC Output Sink/Source Current, per Pin Iout ±50 mA DC VCC or GND Current per Output Pin ICC ±50 mA Storage Temperature Tstg −65 to +150 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1314 12 11 10 9 8 21 34567 GND VCC

Figure 1. Pinout: 14−Lead Packages Conductors section on page 5 of this data sheet. dimensions section on page 5 of this data sheet.

ORDERING INFORMATION

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MC74AC08, MC74ACT08 http://onsemi.com RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit VCC Supply Voltage ′AC 2.0 5.0 6.0 V ′ACT 4.5 5.0 5.5 Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) 0 − VCC V tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs VCC @ 3.0 V − 150 − ns/V VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − tr, tf Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs VCC @ 4.5 V − 10 − ns/V TJ Junction Temperature (PDIP) − − 140 °C TA Operating Ambient Temperature Range −40 25 85 °C IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA 1. V in from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. V in from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. DC CHARACTERISTICS Symbol Parameter Conditions VCC (V) 74AC 74AC Unit TA = +25°C TA = −40°C to +85°C Typ Guaranteed Limits VIH Minimum High Level Input Voltage VOUT = 0.1 V or VCC − 0.1 V 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VIL Maximum Low Level Input Voltage VOUT = 0.1 V or VCC − 0.1 V 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOH Minimum High Level Output Voltage IOUT = −50 /C0109A 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V VIN = VIL or VIH (Note 3) −12 mA IOH −24 mA −24 mA 3.0 4.5 5.5 2.56 3.86 4.86 2.46 3.76 4.76 V VOL Maximum Low Level Output Voltage VIN = VIL or VIH(Note 3) 12 mA IOL 24 mA 24 mA 3.0 4.5 5.5 0.36 0.36 0.36 0.44 0.44 0.44 V IIN Maximum Input Leakage Current VI = VCC, GND 5.5 − ±0.1 ±1.0 /C0109A IOLD Minimum Dynamic (Note 4) Output Current VOLD = 1.65 V Max 5.5 − − 75 mA IOHD VOHD = 3.85 V Min 5.5 − − −75 mA ICC Maximum Quiescent Supply Current VIN = VCC or GND 5.5 − 4.0 40 /C0109A NOTE: I IN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V CC. 3. All outputs loaded; thresholds on input associated with output under test. 4. Maximum test duration 2.0 ms, one output loaded at a time.

MC74AC08, MC74ACT08 http://onsemi.com AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol Parameter VCC (V) (Note5 ) 74AC 74AC Unit Fig. No. TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS Symbol Parameter Conditions VCC (V) 74ACT 74ACT Unit TA = +25°C TA = −40°C to +85°C Typ Guaranteed Limits VIH Minimum High Level Input Voltage V VIL Maximum Low Level Input Voltage V VOH Minimum High Level Output Voltage IOUT = −50 /C0109A 4.5 4.49 4.4 4.4 V 5.5 5.49 5.4 5.4 VIN = VIL or VIH (Note 6) V −24 mA 4.5 − 3.86 3.76 −24 mA 5.5 − 4.86 4.76 VOL Maximum Low Level Output Voltage IOUT = 50 /C0109A 4.5 0.001 0.1 0.1 V 5.5 0.001 0.1 0.1 VIN = VIL or VIH (Note 6) V 24 mA 4.5 − 0.36 0.44 24 mA 5.5 − 0.36 0.44 IIN Maximum Input Leakage Current VI = VCC, GND 5.5 − ±0.1 ±1.0 /C0109A IOLD Minimum Dynamic (Note 7) Output Current VOLD = 1.65 V Max 5.5 − − 75 mA IOHD VOHD = 3.85 V Min 5.5 − − −75 mA ICC Maximum Quiescent Supply Current VIN = VCC or GND 5.5 − 4.0 40 /C0109A 6. All outputs loaded; thresholds on input associated with output under test. 7. Maximum test duration 2.0 ms, one output loaded at a time.

MC74AC08, MC74ACT08 http://onsemi.com AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol Parameter VCC (V) (Note 8) 74ACT 74ACT Unit Fig. No. TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max CAPACITANCE Symbol Parameter Test Conditions Value Typ Unit CIN Input Capacitance VCC = 5.0 V 4.5 pF CPD Power Dissipation Capacitance VCC = 5.0 V 20 pF

MC74AC08, MC74ACT08 http://onsemi.com MARKING DIAGRAMS A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or /C0071= Pb−free Package PDIP−14 SOIC−14 TSSOP −14 MC74AC08N AWLYYWWG AC ALYW/C0071 /C0071 MC74ACT08N AWLYYWWG 74AC08 ALYWG SOEIAJ−14 74ACT08 ALYWG ACT ALYW/C0071 /C0071 (Note: Microdot may be in either location) AC08G AWLYWWG ACT08G AWLYWWG 1 1 14 14 Device Package Shipping† MC74AC08N PDIP−14

25 Units / RailMC74AC08NG PDIP−14

(Pb−Free) MC74AC08D SOIC−14

55 Units / RailMC74AC08DG SOIC−14

(Pb−Free) MC74AC08DR2 SOIC−14 2500 / Tape & Reel MC74AC08DR2G SOIC−14 (Pb−Free) MC74AC08DTR2 TSSOP−14* MC74AC08DTR2G TSSOP−14* MC74AC08MEL SOEIAJ−14 2000 / Tape & ReelMC74AC08MELG SOEIAJ−14 (Pb−Free) MC74ACT08N PDIP−14

25 Units / RailMC74ACT08NG PDIP−14

(Pb−Free) MC74ACT08D SOIC−14

55 Units / RailMC74ACT08DG SOIC−14

(Pb−Free) MC74ACT08DR2 SOIC−14 2500 / Tape & Reel MC74ACT08DR2G SOIC−14 (Pb−Free) MC74ACT08DTR2 TSSOP−14* MC74ACT08DTR2G TSSOP−14* MC74ACT08MEL SOEIAJ−14 2000 / Tape & ReelMC74ACT08MELG SOEIAJ−14 (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free.

MC74AC08, MC74ACT08 http://onsemi.com PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE P 14 8 B A DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.715 0.770 18.16 19.56 B 0.240 0.260 6.10 6.60 C 0.145 0.185 3.69 4.69 D 0.015 0.021 0.38 0.53 F 0.040 0.070 1.02 1.78 G 0.100 BSC 2.54 BSC H 0.052 0.095 1.32 2.41 J 0.008 0.015 0.20 0.38 K 0.115 0.135 2.92 3.43 L N 0.015 0.039 0.38 1.01 /C0095/C0095 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. F HG D K C SEATING PLANE N −T− 14 PL M0.13 (0.005) L M J 0.290 0.310 7.37 7.87

MC74AC08, MC74ACT08 http://onsemi.com PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− −B− G P 7 PL 14 8 M0.25 (0.010) B M SBM0.25 (0.010) A ST −T− FR X 45 SEATING PLANE D 14 PL K C JM /C0095 DIM MIN MAX MIN MAX INCHESMILLIMETERS A 8.55 8.75 0.337 0.344 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.228 0.244 R 0.25 0.50 0.010 0.019 /C0095/C0095/C0095/C0095 7.04 14X 0.58 14X 1.52 1.27 DIMENSIONS: MILLIMETERS PITCH SOLDERING FOOTPRINT* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

MC74AC08, MC74ACT08 http://onsemi.com PACKAGE DIMENSIONS TSSOP−14 CASE 948G−01 ISSUE B DIM MIN MAX MIN MAX INCHESMILLIMETERS A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0 8 0 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. /C0095/C0095/C0095/C0095 SU0.15 (0.006) T 2X L/2 SUM0.10 (0.004) V ST L −U− SEATING PLANE 0.10 (0.004) −T− ÇÇÇ ÇÇÇ ÇÇÇ SECTION N−N DETAIL E J J1 K ÉÉÉ ÉÉÉ DETAIL E F M −W− 0.25 (0.010) 814 PIN 1 IDENT. HG A D C B SU0.15 (0.006) T −V− 14X REFK N N 7.06 14X 0.36 14X 1.26 0.65 DIMENSIONS: MILLIMETERS PITCH SOLDERING FOOTPRINT* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

MC74AC08, MC74ACT08 http://onsemi.com PACKAGE DIMENSIONS SOEIAJ−14 CASE 965−01 ISSUE A HE DIM MIN MAX MIN MAX INCHES MILLIMETERS 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.10 0.20 0.004 0.008 9.90 10.50 0.390 0.413 5.10 5.45 0.201 0.215 1.27 BSC 0.050 BSC 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0.70 0.90 0.028 0.035 A HE LE /C009510 /C00950 /C009510 /C0095 LE /C0095 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). D Z E 14 8 e A b VIEW P c L DETAIL P M A b c D E e 0.50 M Z ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 MC74AC08/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative