74ABT16245B PHILIPS | Alldatasheet

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/C0109 /C0110 /C0114 74ABT16245B 74ABTH16245B 16-bit bus transceiver (3-state) Product specification Supersedes data of 1996 Nov 20 IC23 Data Handbook

1998 Feb 25

Philips Semiconductors Product specification 74ABT16245B 74ABTH16245B16-bit bus transceiver (3-State)

21998 Feb 25 853-1742 19018

FEATURES

  • 16-bit bidirectional bus interface
  • Power-up 3-State
  • Multiple VCC and GND pins minimize switching noise
  • 3-State buffers
  • Output capability: +64 mA/–32mA
  • Latch–up protection exceeds 500mA per JEDEC Std 17
  • Live insertion/extraction permitted
  • ESD protection exceeds 2000 V per MIL STD 883 Method 3015 and 200V per Machine Model
  • 74ABTH16245B incorporates bus hold data inputs which eliminate the need for external pull-up resistors to hold unused inputs
  • Bus-hold data inputs eliminate the need for external pull-up resistors to hold unused inputs

DESCRIPTION

The 74ABT16245B high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ABT16245B device is a dual octal transceiver featuring non-inverting 3-State bus compatible outputs in both send and receive directions. The control function implementation minimizes external timing requirements. The device features two Output Enable (1OE , 2OE) inputs for easy cascading and two Direction (1DIR, 2DIR) inputs for direction control. Two options are available, 74ABT16245B which does not have the bus hold feature and the 74ABTH16245B which incorporates the bus hold feature.QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS Tamb = 25°C; GND = 0V TYPICAL UNIT tPLH tPHL Propagation delay nAx to nBx or nBx to nAx C L = 50pF; VCC = 5V 2.0 2.3 ns C IN Input capacitance VI = 0V or VCC 4 pF C I/O I/O pin capacitance VO = 0V or VCC ; 3-State 7 pF ICCZ Quiescent supply current Outputs disabled; VCC =5.5V 500 µA ICCL Quiescent su ly current Output Low; VCC =5.5V 10 mA

ORDERING INFORMATION

PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 48-Pin Plastic SSOP Type III –40°C to +85°C 74ABT16245B DL BT16245B DL SOT370-1 48-Pin Plastic TSSOP Type II –40°C to +85°C 74ABT16245B DGG BT16245B DGG SOT362-1 48-Pin Plastic SSOP Type III –40°C to +85°C 74ABTH16245B DL BH16245B DL SOT370-1 48-Pin Plastic TSSOP Type II –40°C to +85°C 74ABTH16245B DGG BH16245B DGG SOT362-1

Philips Semiconductors Product specification 74ABT16245B 74ABTH16245B16-bit bus transceiver (3-State)

1998 Feb 25 3

V CC 2B4 VCC 2B2 2B5 GND 2B7 2DIR 2B6 1OE 1A0 1A1 GND 1A2 1A3 1A4 1A5 GND 1A6 1A7 2A0 2A1 GND 2A3 V CC 2A4 VCC 2A2 2A5 GND 2A7 2OE 2A6 SA00020 LOGIC SYMBOL 2DIR 24 26 23 2OE 2A0 2A1 2A2 2A3 2A4 2A5 2A6 2A7 2B0 2B1 2B2 2B3 2B4 2B5 2B6 2B7 1DIR 37 12 1OE 1A0 1A1 1A2 1A3 1A4 1A5 1A6 1A7 1B0 1B1 1B2 1B3 1B4 1B5 1B6 1B7 SA00021 PIN DESCRIPTION SYMBOL PIN NUMBER NAME AND FUNCTION 1DIR, 2DIR 1, 24 Direction control inputs (Active-High) 1A0 – 1A7, 2A0 – 2A7 47, 46, 44, 43 41, 40, 38, 37 36, 35, 33, 32 30, 29, 27, 26 Data inputs/outputs (A side) 1B0 – 1B7 2B0 – 2B7 2, 3, 5, 6 8, 9, 11, 12 13, 14, 16, 17 19, 20, 22, 23 Data inputs/outputs (B side) 1OE , 2OE 48, 25 Output enables GND 4, 10, 15, 21 28, 34, 39, 45Ground (0V) VCC 7, 18, 31, 42Positive supply voltage LOGIC SYMBOL (IEEE/IEC) ∇ 1 1 3 EN1 (BA)

3 EN2 (AB)

2 ∇ 44 5 43 6 41 8 40 9 38 11 37 12 ∇ 436 5 ∇ 33 16 32 17 30 19 29 20 27 22 26 23

6 EN4 (BA)

6 EN5 (AB)

Philips Semiconductors Product specification 74ABT16245B 74ABTH16245B16-bit bus transceiver (3-State)

1998 Feb 25 4

L L A = B Inputs L H Inputs B = A H X Z Z H = High voltage level L = Low voltage level X = Don’t care Z = High impedance “off” scale ABSOLUTE MAXIMUM RATINGS 1, 2 SYMBOL PARAMETER CONDITIONS RATING UNIT VCC DC supply voltage –0.5 to +7.0 V IIK DC input diode current VI < 0 –18 mA VI DC input voltage3 –1.2 to +7.0 V IOK DC output diode current VO < 0 –50 mA VOUT DC output voltage3 output in Off or High state –0.5 to +5.5 V IO DC output current output in Low state 128 mAIOUT DC output current output in High state –64 mA Tstg Storage temperature range –65 to 150 °C NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER LIMITS UNITSYMBOL PARAMETER Min Max UNIT VCC DC supply voltage 4.5 5.5 V VI Input voltage 0 VCC V VIH High-level input voltage 2.0 V VIL Low-level Input voltage 0.8 V IOH High-level output current –32 mA IOL Low-level output current 64 mA Δt/Δv Input transition rise or fall rate 0 10 ns/V Tamb Operating free-air temperature range –40 +85 °C

Philips Semiconductors Product specification 74ABT16245B 74ABTH16245B16-bit bus transceiver (3-State)

1998 Feb 25 5

DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER TEST CONDITIONS Tamb = +25°C Tamb = –40°C to +85°C UNIT Min Typ Max Min Max VIK Input clamp voltage VCC = 4.5V; IIK = –18mA –0.9 –1.2 –1.2 V VCC = 4.5V; IOH = –3mA; VI = VIL or VIH 2.5 2.9 2.5 V VOH High-level output voltageVCC = 5.0V; IOH = –3mA; VI = VIL or VIH 3.0 3.4 3.0 V VCC = 4.5V; IOH = –32mA; VI = VIL or VIH 2.0 2.4 2.0 V VOL Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or VIH 0.42 0.55 0.55 V II Input leakage current VCC = 5.5V; VI = GND or 5.5V Control pins ±0.01 ±1.0 ±1.0 µA Bus hold current VCC = 4.5V; VI = 0.8V 50 50 IHOLD Bus hold current A and B inputs 74ABTH16245B VCC = 5.5V; VI = 2.0V –75 –75 µA 74ABTH16245B VCC = 5.5V; VI = 0 to 5.5V ±500 IOFF Power-off leakage currentVCC = 0.0V; VO or VI ≤ 4.5V ±5.0 ±100 ±100 µA IPU /IPD Power-up/down 3-State output current VCC = 2.0V; VO = 0.5V; VI = GND or VCC; VOE = Don’t care ±5.0 ±50 ±50 µA IIH+IOZH 3-State output High currentVCC = 5.5V; VO = 5.5V; VI = VIL or VIH 0.1 10 10 µA IIL+IOZL 3-State output Low currentVCC = 5.5V; VO = 0.0V; VI = VIL or VIH 0.1 10 10 µA ICEX Output high leakage currentVCC = 5.5V; VO = 5.5V; VI = GND or VCC 5.0 50 50 µA IO Output current1 VCC = 5.5V; VO = 2.5V –50 –92 –180 –50 –180 mA ICCH VCC = 5.5V; Outputs High, VI = GND or VCC 0.30 0.70 0.70 mA ICCL Quiescent supply current VCC = 5.5V; Outputs Low, VI = GND or VCC 10 19 19 mA ICCZ VCC = 5.5V; Outputs 3-State; VI = GND or VCC 0.30 0.70 0.70 mA Outputs enabled, one data input at 3.4V, other inputs at V CC or GND; VCC = 5.5V 400 700 700 µA ΔICC Additional supply current per input pin2 Outputs disabled, one data input at 3.4V, other inputs at V CC or GND; VCC = 5.5V 100 250 250 µA in ut in Control pins, outputs disabled, one enable input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 400 700 700 µA NOTES: 1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 2. This is the increase in supply current for each input at 3.4V. 3. This is the bus hold overdrive current required to force the input to the opposite logic state.

Philips Semiconductors Product specification 74ABT16245B 74ABTH16245B16-bit bus transceiver (3-State)

1998 Feb 25 6

GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω LIMITS SYMBOL PARAMETER WAVEFORM Tamb = +25°C VCC = +5.0V Tamb = –40°C to +85°C VCC = +5.0V ±0.5V UNIT Min Typ Max Min Max tPLH tPHL Propagation delay nAx to nBx or nBx to nAx 1 1.0 1.0 2.0 2.3 3.2 3.5 1.0 1.0 3.5 4.0 ns tPZH tPZL Output enable time to High and Low level 2 1.0 1.7 3.1 4.0 4.4 5.2 1.0 1.7 5.1 6.1 ns tPHZ tPLZ Output disable time from High and Low level 2 1.7 1.5 3.5 3.2 4.9 4.4 1.7 1.5 5.4 5.0 ns AC WAVEFORMS VM = 1.5V, VIN = GND to 3.0V INPUT VM VMOUTPUT VM VM tPLH tPHL SA00023 Waveform 1. Input to Output Propagation Delays nOE INPUT OUTPUT OUTPUT VM VM tPZH tPHZ VOH VM VM VOL tPZL tPLZ 3.5V VOL + 0.3V VOH – 0.3V SA00024 Waveform 2. 3-State Output Enable and Disable Times

Philips Semiconductors Product specification 74ABT16245B 74ABTH16245B16-bit bus transceiver (3-State)

1998 Feb 25 7

D.U.T. VOUT R L VCC R L 7.0V Test Circuit for 3-State Outputs VM VM tW AMP (V) NEGATIVE PULSE 10% 10% 90% 90% VM VM tW AMP (V) POSITIVE PULSE 90% 90% 10% 10% tTHL (tF) tTLH (tR )t THL (tF) tTLH (tR ) VM = 1.5V Input Pulse Definition DEFINITIONS R L = Load resistor; see AC CHARACTERISTICS for value. C L = Load capacitance includes jig and probe capacitance; see AC CHARACTERISTICS for value. R T = Termination resistance should be equal to ZOUT of pulse generators. INPUT PULSE REQUIREMENTS FAMILY Amplitude Rep. Rate t W tR tF 74ABT/H16 3.0V 1MHz 500ns 2.5ns 2.5ns SWITCH POSITION TEST SWITCH tPLZ closed tPZL closed All other open SA00018 C L

Philips Semiconductors Product specification 74ABT16245B 74ABTH16245B16-Bit bus transceiver (3-State)

81998 Feb 25

SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1

Philips Semiconductors Product specification 74ABT16245B 74ABTH16245B16-Bit bus transceiver (3-State)

1998 Feb 25 9

TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1mm SOT362-1

Philips Semiconductors Product specification 74ABT16245B 74ABTH16245B16-Bit bus transceiver (3-State)

1998 Feb 25 10

Philips Semiconductors Product specification 74ABT16245B 74ABTH16245B16-Bit bus transceiver (3-State) yyyy mmm dd 11 Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Philips Semiconductors

811 East Arques Avenue

P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381  Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. print code Date of release: 05-96 Document order number: 9397-750-03486 /C0109 /C0110 /C0114 Data sheet status Objective specification Preliminary specification Product specification Product status Development Qualification Production Definition [1] This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Data sheet status [1] Please consult the most recently issued datasheet before initiating or completing a design.