74ABT126 PHILIPS

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/C0109 /C0110 /C0114 74ABT126 Quad buffer (3-State) Product specification 1998 Jan 16 INTEGRATED CIRCUITS Supersedes data of 1996 Feb 26 IC23 Data Handbook

Philips Semiconductors Product specification 74ABT126Quad buffer (3-State)

21998 Jan 16 853–1607 18867

FEATURES

  • Quad bus interface
  • 3-State buffers
  • Live insertion/extraction permitted
  • Output capability: +64mA/–32mA
  • Latch-up protection exceeds 500mA per JEDEC Std 17
  • ESD protection exceeds 2000V per MIL STD 883 Method 3015 and 200V per Machine Model
  • Power-up 3-State
  • Inputs are disabled during 3-State mode

DESCRIPTION

The 74ABT126 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ABT126 device is a quad buffer that is ideal for driving bus lines. The device features four Output Enables (OE0, OE1, OE2, OE3), each controlling one of the 3-State outputs. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS Tamb = 25°C; GND = 0V TYPICAL UNIT tPLH tPHL Propagation delay An to Yn C L = 50pF; VCC = 5V 2.9 ns C IN Input capacitance VI = 0V or VCC 4 pF C OUT Output capacitance Outputs disabled; VO = 0V or VCC 7 pF ICCZ Total supply current Outputs disabled; VCC = 5.5V 65 µA

ORDERING INFORMATION

PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 14-Pin Plastic DIP –40°C to +85°C 74ABT126 N 74ABT126 N SOT27-1 14-Pin plastic SO –40°C to +85°C 74ABT126 D 74ABT126 D SOT108-1 14-Pin Plastic SSOP Type II –40°C to +85°C 74ABT126 DB 74ABT126 DB SOT337-1 14-Pin Plastic TSSOP Type I –40°C to +85°C 74ABT126 PW 74ABT126PW DH SOT402-1 PIN DESCRIPTION PIN NUMBER SYMBOL NAME AND FUNCTION 2, 5, 9, 12 A0 – A3 Data inputs 3, 6, 8, 11 Y0 – Y3 Data outputs 1, 4, 10, 13 OE0 – OE3 Output enable inputs

7 GND Ground (0V)

14 VCC Positive supply voltage

Philips Semiconductors Product specification 74ABT126Quad buffer (3-State)

1998 Jan 16 3

LOGIC SYMBOL (IEEE/IEC) EN SA00461 FUNCTION TABLE INPUTS OUTPUTS OEn An Yn H L L H H H L X Z H = High voltage level L = Low voltage level X = Don’t care Z = High impedance ”off” state ABSOLUTE MAXIMUM RATINGS 1, 2 SYMBOL PARAMETER CONDITIONS RATING UNIT VCC DC supply voltage –0.5 to +7.0 V IIK DC input diode current VI < 0 –18 mA VI DC input voltage3 –1.2 to +7.0 V IOK DC output diode current VO < 0 –50 mA VOUT DC output voltage3 output in Off or High state –0.5 to +5.5 V IOUT DC output current output in Low state 128 mA Tstg Storage temperature range –65 to 150 °C NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER LIMITS UNITSYMBOL PARAMETER Min Max UNIT VCC DC supply voltage 4.5 5.5 V VI Input voltage 0 VCC V VIH High-level input voltage 2.0 V VIL Low-level Input voltage 0.8 V IOH High-level output current –32 mA IOL Low-level output current 64 mA Δt/Δv Input transition rise or fall rate 0 10 ns/V Tamb Operating free-air temperature range –40 +85 °C

Philips Semiconductors Product specification 74ABT126Quad buffer (3-State)

1998 Jan 16 4

DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER TEST CONDITIONS Tamb = +25°C Tamb = –40°C to +85°C UNIT Min Typ Max Min Max VIK Input clamp voltage VCC = 4.5V; IIK = –18mA –0.9 –1.2 –1.2 V VCC = 4.5V; IOH = –3mA; VI = VIL or VIH 2.5 2.9 2.5 V VOH High-level output voltageVCC = 5.0V; IOH = –3mA; VI = VIL or VIH 3.0 3.4 3.0 V VCC = 4.5V; IOH = –32mA; VI = VIL or VIH 2.0 2.4 2.0 V VOL Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or VIH 0.35 0.55 0.55 V IOFF Power-off leakage currentVCC = 0.0V; VO or VI ≤ 4.5V ±5.0 ±100 ±100 µA IPU /IPD Power-up/down 3-State output current3 VCC = 2.1V; VO = 0.5V; VI GND or VCC ; V OE = Don’t care ±5.0 ±50 ±50 µA IOZH 3-State output High currentVCC = 5.5V; VO = 2.7V; VI = VIL or VIH 1.0 50 50 µA IOZL 3-State output Low currentVCC = 5.5V; VO = 0.5V; VI = VIL or VIH –1.0 –50 –50 µA ICEX Output High leakage currentVCC = 5.5V; VO = 5.5V; VI = GND or VCC 5.0 50 50 µA IO Output current1 VCC = 5.5V; VO = 2.5V –50 –100 –180 –50 –180 mA ICCH VCC = 5.5V; Outputs High, VI = GND or VCC 65 250 250 µA ICCL Quiescent supply current VCC = 5.5V; Outputs Low, VI = GND or VCC 12 15 15 mA ICCZ VCC = 5.5V; Outputs 3–State; VI = GND or VCC 65 250 250 µA Outputs enabled, one data input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA ΔICC Additional supply current per input pin2 Outputs 3-State, one data input at 3.4V, other inputs at V CC or GND; VCC = 5.5V 50 250 250 µA Outputs 3-State, one enable input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA NOTES: 1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 2. This is the increase in supply current for each input at 3.4V. 3. This parameter is valid for any VCC between 0V and 2.1V, with a transition time of up to10msec. From VCC = 2.1V to VCC = 5V ± 10%, a transition time of up to 100µsec is permitted. AC CHARACTERISTICS GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω LIMITS SYMBOL PARAMETER WAVEFORM Tamb = +25°C VCC = +5.0V Tamb = –40°C to +85°C VCC = +5.0V ±0.5V UNIT Min Typ Max Min Max tPLH tPHL Propagation delay An to Yn 1 1.0 1.0 2.9 3.0 4.2 4.3 1.0 1.0 4.4 4.6 ns tPZH tPZL Output enable time to High and Low level 2 1.9 1.9 3.2 4.4 5.8 5.9 1.9 1.9 6.5 6.5 ns tPHZ tPLZ Output disable time from High and Low level 2 1.0 1.0 4.2 2.9 5.2 4.9 1.0 1.0 5.8 5.5 ns

Philips Semiconductors Product specification 74ABT126Quad buffer (3-State)

1998 Jan 16 5

VM = 1.5V, VIN = GND to 3.0V INPUT 1.5V OUTPUT tPLH tPHL SA00028 1.5V 1.5V 1.5V 3 V 0 V VOH VOL Waveform 1. Waveforms Showing the Input (An) to Output (Yn) Propagation Delays OE INPUT VM VM tPZH tPHZ Yn OUTPUT VOH VM VM Yn OUTPUT VOL tPZL tPLZ 3.5V VOL + 0.3V VOH – 0.3V SA00033 Waveform 2. Waveforms Showing the 3–State Output Enable and Disable Times TEST CIRCUIT AND WAVEFORMS C L = 50 pF 500 Ω Load Circuit DEFINITIONS C L = Load capacitance includes jig and probe capacitance; see AC CHARACTERISTICS for value. TEST S1 tpd open tPLZ /tPZL 7 V tPHZ /tPZH open SA00012 500 ΩFrom Output Under Test 7 V Open GND

Philips Semiconductors Product specification 74ABT126Quad buffer (3-State)

1998 Jan 16 6

DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1

Philips Semiconductors Product specification 74ABT126Quad buffer (3-State)

1998 Jan 16 7

SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

Philips Semiconductors Product specification 74ABT126Quad buffer (3-State)

1998 Jan 16 8

SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1

Philips Semiconductors Product specification 74ABT126Quad buffer (3-State)

1998 Jan 16 9

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1

Philips Semiconductors Product specification 74ABT126Quad buffer (3-State) Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Philips Semiconductors

811 East Arques Avenue

P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 DEFINITIONS Data Sheet Identification Product Status Definition Objective Specification Preliminary Specification Product Specification Formative or in Design Preproduction Product Full Production This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Philips Semiconductors and Philips Electronics North America Corporation register eligible circuits under the Semiconductor Chip Protection Act.  Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. (print code) Date of release: July 1994 Document order number: 9397-750-03462