SN74LS47 ONSEMI | Alldatasheet
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Technical content
Semiconductor Components Industries, LLC, 1999 December, 1999 – Rev. 6
1 Publication Order Number:
/C0083/C0078/C0055/C0052/C0076/C0083/C0052/C0055 /C0066/C0067/C0068 /C0116/C0111 /C0055/C0045/C0083/C0101/C0103/C0109/C0101/C0110/C0116 /C0068/C0101/C0099/C0111/C0100/C0101/C0114/C0047/C0068/C0114/C0105/C0118/C0101/C0114 The SN74LS47 are Low Power Schottky BCD to 7-Segment Decoder/Drivers consisting of NAND gates, input buffers and seven AND-OR-INVERT gates. They offer active LOW, high sink current outputs for driving indicators directly. Seven NAND gates and one driver are connected in pairs to make BCD data and its complement available to the seven decoding AND-OR-INVERT gates. The remaining NAND gate and three input buffers provide lamp test, blanking input/ripple-blanking output and ripple-blanking input. The circuits accept 4-bit binary-coded-decimal (BCD) and, depending on the state of the auxiliary inputs, decodes this data to drive a 7-segment display indicator. The relative positive-logic output levels, as well as conditions required at the auxiliary inputs, are shown in the truth tables. Output configurations of the SN74LS47 are designed to withstand the relatively high voltages required for 7-segment indicators. These outputs will withstand 15 V with a maximum reverse current of 250µA. Indicator segments requiring up to 24 mA of current may be driven directly from the SN74LS47 high performance output transistors. Display patterns for BCD input counts above nine are unique symbols to authenticate input conditions. The SN74LS47 incorporates automatic leading and/or trailing-edge zero-blanking control (RBI and RBO). Lamp test (LT) may be performed at any time which the BI/RBO node is a HIGH level. This device also contains an overriding blanking input (BI) which can be used to control the lamp intensity by varying the frequency and duty cycle of the BI input signal or to inhibit the outputs.
- Lamp Intensity Modulation Capability (BI/RBO)
- Open Collector Outputs
- Lamp Test Provision
- Leading/Trailing Zero Suppression
- Input Clamp Diodes Limit High-Speed Termination Effects GUARANTEED OPERATING RANGES Symbol Parameter Min Typ Max Unit VCC Supply Voltage 4.75 5.0 5.25 V TA Operating Ambient Temperature Range 0 25 70 °C IOH Output Current – High BI/RBO –50 /C0109A IOL Output Current – Low BI/RBO BI/RBO 3.2 mA VO(off) Off–State Output Voltage a to g 15 V IO(on) On–State Output Current a to g 24 mA LOW POWER SCHOTTKY SOIC D SUFFIX CASE 751B http://onsemi.com PLASTIC N SUFFIX CASE 648 Device Package Shipping
ORDERING INFORMATION
SN74LS47N 16 Pin DIP 2000 Units/Box SN74LS47D 16 Pin 2500/Tape & Reel
http://onsemi.com LOGIC SYMBOL CONNECTION DIAGRAM DIP (TOP VIEW) BCD Inputs Ripple–Blanking Input Lamp–Test Input Blanking Input or Ripple–Blanking Output Outputs A, B, C, D RBI LT BI/RBO a, to g 0.5 U.L. 0.5 U.L. 0.5 U.L. 0.5 U.L. 1.2 U.L. Open–Collector 0.25 U.L. 0.25 U.L. 0.25 U.L. 0.75 U.L. 2.0 U.L. 15 U.L. NOTES: a) 1 Unit Load (U.L.) = 40 /C0109A HIGH, 1.6 mA LOW. b) Output current measured at V OUT = 0.5 V b) The Output LOW drive factor is 15 U.L. for Commercial (74) Temperature Ranges. HIGH LOW (Note a)LOADING PIN NAMES 14 13 12 11 10 9 12345 6 VCC 16 15 f g a b c d e BCL T BI / RBO RBI D A GND VCC = PIN 16 GND = PIN 8 7 126 35 13 12 11 10 9 15 14 4 A B C D LT RBI abcdefg BI/ RBO
http://onsemi.com 14 15 LOGIC DIAGRAM NUMERICAL DESIGNATIONS — RESULTANT DISPLAYS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 INPUT BLANKING INPUT OR RIPPLE-BLANKING OUTPUT RIPPLE-BLANKING INPUT LAMP-TEST INPUT A B C D aa bb cc dd ee ff gg OUTPUT DECIMAL OR FUNCTION LT RBI D C B A BI/RBO a b c d e f g NOTE
0 H H L L L L H L L L L L L H A
1 H X L L L H H H L L H H H H A
2 H X L L H L H L L H L L H L
3 H X L L H H H L L L L H H L
4 H X L H L L H H L L H H L L
5 H X L H L H H L H L L H L L
6 H X L H H L H H H L L L L L
7 H X L H H H H L L L H H H H
8 H X H L L L H L L L L L L L
9 H X H L L H H L L L H H L L
10 H X H L H L H H H H L L H L
11 H X H L H H H H H L L H H L
12 H X H H L L H H L H H H L L
13 H X H H L H H L H H L H L L
14 H X H H H L H H H H L L L L
15 H X H H H H H H H H H H H H
BI X X X X X X L H H H H H H H B RBI H L L L L L L H H H H H H H C LT L X X X X X H L L L L L L L D H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial NOTES: (A) BI/RBO is wire-AND logic serving as blanking Input (BI) and/or ripple-blanking output (RBO). The blanking out (BI) must be open or held at a HIGH level when output functions 0 through 15 are desired, and ripple-blanking input (RBI) must be open or at a HIGH level if blanking of a decimal 0 is not desired. X = input may be HIGH or LOW. (B) When a LOW level is applied to the blanking input (forced condition) all segment outputs go to a LOW level regardless of the state of any other input condition. (C) When ripple-blanking input (RBI) and inputs A, B, C, and D are at LOW level, with the lamp test input at HIGH level, all segment outputs go to a HIGH level and the ripple-blanking output (RBO) goes to a LOW level (response condition). (D) When the blanking input/ripple-blanking output (BI/RBO) is open or held at a HIGH level, and a LOW level is applied to lamp test input, all segment outputs go to a LOW level.
Note 1: Not more than one output should be shorted at a time, nor for more than 1 second. Figure 1. Figure 2.
http://onsemi.com PACKAGE DIMENSIONS N SUFFIX PLASTIC PACKAGE CASE 648–08 ISSUE R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. –A– B F C S H G D J L M 16 PL SEATING 916 K PLANE–T– MAM0.25 (0.010) T DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01 /C0095/C0095/C0095/C0095
http://onsemi.com PACKAGE DIMENSIONS D SUFFIX PLASTIC SOIC PACKAGE CASE 751B–05 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 16 9 SEATING PLANE F JM R X 45/C0095 G
8 PLP–B–
–A– M0.25 (0.010) B S –T– D K C 16 PL SBM0.25 (0.010) A ST DIM MIN MAX MIN MAX INCHESMILLIMETERS A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019 /C0095/C0095/C0095/C0095
http://onsemi.com Notes
http://onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION ASIA/PACIFIC: LDC for ON Semiconductor – Asia Support Phone : 303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time) Toll Free from Hong Kong 800–4422–3781 Email: ONlit–asia@hibbertco.com JAPAN : ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–8549 Phone : 81–3–5487–8345 Email: r14153@onsemi.com Fax Response Line: 303–675–2167 800–344–3810 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. SN74LS47/D North America Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone : 303–675–2175 or 800–344–3860 Toll Free USA/Canada Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800–282–9855 Toll Free USA/Canada EUROPE: LDC for ON Semiconductor – European Support German Phone: (+1) 303–308–7140 (M–F 2:30pm to 5:00pm Munich Time) Email: ONlit–german@hibbertco.com French Phone: (+1) 303–308–7141 (M–F 2:30pm to 5:00pm Toulouse Time) Email: ONlit–french@hibbertco.com English Phone: (+1) 303–308–7142 (M–F 1:30pm to 5:00pm UK Time) Email: ONlit@hibbertco.com