SN5414_15 TI1 | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 27

Technical content

SN5414, SN54LS14, SN7414, SN74LS14 HEX SCHMITT-TRIGGER INVERTERS SDLS049B – DECEMBER 1983 – REVISED FEBRUARY 2002 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068 Operation From Very Slow Edges /C0068 Improved Line-Receiving Characteristics /C0068 High Noise Immunity

description

Each circuit functions as an inverter, but because of the Schmitt action, it has different input threshold levels for positive-going (V T+) and negative-going (VT–) signals. These circuits are temperature compensated and can be triggered from the slowest of input ramps and still give clean, jitter-free output signals.

ORDERING INFORMATION

TA PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP N Tube SN7414N SN7414N PDIP – N Tube SN74LS14N SN74LS14N Tube SN7414D 7414 0°Ct o7 0°C SOIC D Tape and reel SN7414DR 7414 0°C to 70°C SOIC – D Tube SN74LS14D LS14 Tape and reel SN74LS14DR LS14 SOP – NS Tape and reel SN7414NSR SN7414 SSOP – DB Tape and reel SN74LS14DBR LS14 Tube SN5414J SN5414J CDIP J Tube SNJ5414J SNJ5414J CDIP – J Tube SN54LS14J SN54LS14J –55°C to 125°C Tube SNJ54LS14J SNJ54LS14J CFP W Tube SNJ5414W SNJ5414W CFP – W Tube SNJ54LS14W SNJ54LS14W LCCC – FK Tube SNJ54LS14FK SNJ54LS14FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Copyright  2002, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SN5414, SN54LS14 ...J O R W PACKAGE SN7414 . . . D, N, OR NS PACKAGE SN74LS14 . . . D, DB, OR N PACKAGE (TOP VIEW) GND V CC 3212 0 1 9 91 0 1 1 1 2 1 3 NC NC NC NC NC 4A 6A GND NC NC – No internal connection VCC SN54LS14 . . . FK PACKAGE (TOP VIEW) On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

SN5414, SN54LS14, SN7414, SN74LS14 HEX SCHMITT-TRIGGER INVERTERS SDLS049B – DECEMBER 1983 – REVISED FEBRUARY 2002

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

logic diagram (positive logic) Y = A Pin numbers shown are for the D, DB, J, N, NS, and W packages.

SN5414, SN54LS14, SN7414, SN74LS14 HEX SCHMITT-TRIGGER INVERTERS SDLS049B – DECEMBER 1983 – REVISED FEBRUARY 2002 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 schematic ’14 GND Output Y 100 Ω VCC 6 kΩ Input A GND Output Y VCC 20 kΩ Input A ’LS14 Resistor values shown are nominal.

SN5414, SN54LS14, SN7414, SN74LS14 HEX SCHMITT-TRIGGER INVERTERS SDLS049B – DECEMBER 1983 – REVISED FEBRUARY 2002

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

absolute maximum ratings over operating free-air temperature (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. Voltage values are with respect to network ground terminal. 2. The package termal impedance is calculated in accordance with JESD 51-7 recommended operating conditions SN5414 SN7414 UNIT MIN NOM MAX MIN NOM MAX UNIT VCC Supply voltage 4.5 5 5.5 4.75 5 5.25 V IOH High-level output current –0.8 –0.8 mA IOL Low-level output current 16 16 mA TA Operating free-air temperature –55 125 0 70 °C electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS ‡ SN5414 SN7414 UNITTEST CONDITIONS MIN TYP § MAX VT+ VCC = 5 V 1.5 1.7 2 V VT– VCC = 5 V 0.6 0.9 1.1 V Hysteresis (VT+ – VT–) VCC = 5 V 0.4 0.8 V VIK VCC = MIN, II = –12 mA –1.5 V VOH VCC = MIN, VI = 0.6 V, IOH = –0.8 mA 2.4 3.4 V VOL VCC = MIN, VI = 2 V, IOL = 16 mA 0.2 0.4 V IT+ VCC = 5 V, VI = VT+ –0.43 mA IT– VCC = 5 V, VI = VT– –0.56 mA II VCC = MAX, VI = 5.5 V 1 mA IIH VCC = MAX, VIH = 2.4 V 40 µA IIL VCC = MAX, VIL = 0.4 V –0.8 –1.2 mA IOS ¶ VCC = MAX –18 –55 mA ICCH VCC = MAX 22 36 mA ICCL VCC = MAX 39 60 mA ‡ For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. § All typical values are at VCC = 5 V, TA = 25°C. ¶ Not more than one output should be shorted at a time.

SN5414, SN54LS14, SN7414, SN74LS14 HEX SCHMITT-TRIGGER INVERTERS SDLS049B – DECEMBER 1983 – REVISED FEBRUARY 2002 5POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS SN5414 SN7414 UNITPARAMETER (INPUT) (OUTPUT) TEST CONDITIONS MIN TYP MAX UNIT MIN TYP MAX tPLH A Y R L = 400Ω C L =1 5pF 15 22 ns tPHL A Y R L = 400 Ω , C L = 15 F 15 22 ns recommended operating conditions SN54LS14 SN74LS14 UNIT MIN NOM MAX MIN NOM MAX UNIT VCC Supply voltage 4.5 5 5.5 4.75 5 5.25 V IOH High-level output current –0.4 –0.4 mA IOL Low-level output current 4 8 mA TA Operating free-air temperature –55 125 0 70 °C electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS † SN54LS14 SN74LS14 UNITPARAMETER TEST CONDITIONS † MIN TYP ‡ MAX MIN TYP ‡ MAX UNIT VT– VCC = 5 V 0.5 0.8 1 0.5 0.8 1 V Hysteresis VIK VCC = MIN, II = –18 mA –1.5 –1.5 V VOL VCC = MIN VI= 19V IOL = 4 mA 0.25 0.4 0.25 0.4 VVOL VCC = MIN , VI = –1.9 V IOL = 8 mA 0.35 0.5 V IT+ VCC = 5 V, VI = VT+ –0.14 –0.14 mA IT– VCC = 5 V, VI = VT– –0.18 –0.18 mA II VCC = MAX, VI = 7 V 0.1 0.1 mA IIH VCC = MAX, VIH = 2.7 V 20 20 µA IIL VCC = MAX, VIL = 0.4 V –0.4 –0.4 mA IOS § VCC = MAX –20 –100 –20 –100 mA ICCH VCC = MAX 8.6 16 8.6 16 mA ICCL VCC = MAX 12 21 12 21 mA † For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. ‡ All typical values are at VCC = 5 V, TA = 25°C. § Not more than one output should be shorted at a time, and duration of the short-circuit should not exceed one second. switching characteristics, VCC = 5 V, TA = 25°C (see Figure 2) PARAMETER FROM TO TEST CONDITIONS MIN TYP MAX UNITPARAMETER (INPUT) (OUTPUT) TEST CONDITIONS MIN TYP MAX UNIT tPLH A Y R L =2k Ω C L =1 5pF 15 22 ns tPHL A Y R L = 2 kΩ , C L = 15 F 15 22 ns

6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

NOTES: A. C L includes probe and jig capacitance. B. All diodes are 1N3064 or equivalent. C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. D. S1 and S2 are closed for tPLH , tPHL , tPHZ , and tPLZ ; S1 is open and S2 is closed for tPZH ; S1 is closed and S2 is open for tPZL . 54/74 devices and tr and tf ≤ 2.5 ns for Series 54S/74S devices. F. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuits and Voltage Waveforms

NOTES: A. C L includes probe and jig capacitance. B. All diodes are 1N3064 or equivalent. C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. D. S1 and S2 are closed for tPLH , tPHL , tPHZ , and tPLZ ; S1 is open and S2 is closed for tPZH ; S1 is closed and S2 is open for tPZL . E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples. F. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω , tr ≤ 1.5 ns, tf ≤ 2.6 ns. G. The outputs are measured one at a time with one input transition per measurement. Figure 2. Load Circuits and Voltage Waveforms

SN5414, SN54LS14, SN7414, SN74LS14 HEX SCHMITT-TRIGGER INVERTERS SDLS049B – DECEMBER 1983 – REVISED FEBRUARY 2002

8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

TYPICAL CHARACTERISTICS OF ’14 CIRCUITS† Figure 3 –25–50–75 1.64 1.62 1.61 1.60 02 5 5 0 – Positive-Going Threshold Voltage – V 1.66 1.67 POSITIVE-GOING THRESHOLD VOLTAGE vs FREE-AIR TEMPERATURE 1.70 75 100 125 1.65 1.63 TA – Free-Air Temperature – °C V VCC = 5 V 1.68 1.69 Figure 4 –25–50–75 0.84 0.82 0.81 0.80 02 5 5 0 – Negative-Going Threshold Voltage – V 0.86 0.87 NEGATIVE-GOING THRESHOLD VOLTAGE vs FREE-AIR TEMPERATURE 0.90 75 100 125 0.85 0.83 TA – Free-Air Temperature – °C V VCC = 5 V 0.88 0.89 T+ – –25–50–75 790 770 760 750 02 5 5 0 – Hysteresis – mV 810 820 HYSTERESIS vs FREE-AIR TEMPERATURE 850 75 100 125 800 780 TA – Free-Air Temperature – °C V VCC = 5 V 830 840 Figure 5 T–V † Data for temperatures below 0°C and above 70°C and supply voltage below 4.75 V and above 5.25 V are applicable for SN5414 only.

SN5414, SN54LS14, SN7414, SN74LS14 HEX SCHMITT-TRIGGER INVERTERS SDLS049B – DECEMBER 1983 – REVISED FEBRUARY 2002

10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

TYPICAL CHARACTERISTICS OF ’LS14 CIRCUITS † Figure 10 1.64 1.62 1.61 1.60 Positive-Going Threshold Voltage – V 1.66 1.67 POSITIVE-GOING THRESHOLD VOLTAGE vs FREE-AIR TEMPERATURE 1.70 1.65 1.63 VCC = 5 V 1.68 1.69 TA – Free-Air Temperature – °C –25–50–75 0 25 50 75 100 125 T+ –V Figure 11 0.84 0.82 0.81 0.80 0.86 0.87 NEGATIVE-GOING THRESHOLD VOLTAGE vs FREE-AIR TEMPERATURE 0.90 0.85 0.83 VCC = 5 V 0.88 0.89 –25–50–75 0 25 50 75 100 125 TA – Free-Air Temperature – °C – N egative-G oing Threshold Voltage – VT– V Figure 12 790 770 760 750 810 820 HYSTERESIS vs FREE-AIR TEMPERATURE 850 800 780 VCC = 5 V 830 840 –25–50–75 0 25 50 75 100 125 TA – Free-Air Temperature – °C T+ – – Hysteresis – VV T–V Figure 13 760740 780 800 820 DISTRIBUTION OF UNITS FOR HYSTERESIS 840 860 880 VT+ – VT– – Hysteresis – mV VCC = 5 V TA = 25°C Relative Frequency of Occurence 720 99% ARE ABOVE 735 mV † Data for temperatures below 0°C and above 70°C and supply voltage below 4.75 V and above 5.25 V are applicable for SN5414 only.

SN5414, SN54LS14, SN7414, SN74LS14 HEX SCHMITT-TRIGGER INVERTERS SDLS049B – DECEMBER 1983 – REVISED FEBRUARY 2002

12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

330 Ω Input Multivibrator

0.1 Hz to 10 MHz

VT– VT+ VT– VT+ Input Output Threshold Detector VT+ Input Output Point A A

www.ti.com 17-Dec-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples 5962-9665801Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 9665801Q2A SNJ54LS 14FK 5962-9665801QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9665801QC A SNJ54LS14J 5962-9665801QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9665801QD A SNJ54LS14W 5962-9665801VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9665801VD A SNV54LS14W JM38510/31302BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 31302BCA M38510/31302BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 31302BCA SN5414J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN5414J SN54LS14J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS14J SN7414D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 7414 SN7414DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 7414 SN7414DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 7414 SN7414N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN7414N SN7414N3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70 SN7414NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN7414N SN7414NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 SN7414 SN74LS14D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS14

www.ti.com 17-Dec-2015 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples SN74LS14DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS14 SN74LS14DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS14 SN74LS14DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS14 SN74LS14DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS14 SN74LS14DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS14 SN74LS14DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS14 SN74LS14DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS14 SN74LS14N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS14N SN74LS14N3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70 SN74LS14NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS14N SN74LS14NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS14 SNJ5414J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ5414J SNJ5414W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ5414W SNJ54LS14FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 9665801Q2A SNJ54LS 14FK SNJ54LS14J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9665801QC A SNJ54LS14J SNJ54LS14W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9665801QD A SNJ54LS14W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.

www.ti.com 17-Dec-2015 Addendum-Page 3 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN5414, SN54LS14, SN54LS14-SP, SN7414, SN74LS14 :

  • Catalog: SN7414 , SN74LS14 , SN54LS14
  • Military: SN5414 , SN54LS14
  • Space: SN54LS14-SP

www.ti.com 17-Dec-2015 Addendum-Page 4 NOTE: Qualified Version Definitions:

  • Catalog - TI's standard catalog product
  • Military - QML certified for Military and Defense Applications
  • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN7414DR SOIC D 14 2500 367.0 367.0 38.0 SN7414NSR SO NS 14 2000 367.0 367.0 38.0 SN74LS14DBR SSOP DB 14 2000 367.0 367.0 38.0 SN74LS14DR SOIC D 14 2500 367.0 367.0 38.0 SN74LS14NSR SO NS 14 2000 367.0 367.0 38.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01

28 PINS SHOWN

8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic”are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated