74695-1003 MOLEX | Alldatasheet

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Technical content

FEATURES AND SPECIFICATIONS 2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD Module-to-Backplane Connector System Features and Benefits I Up to 5.0 Gbps bandwidth per signal pair enables state-of-the-art system design and performance I 2.00 by 2.25mm (.079 by .089”) pitch provides real signal density of 10 differential pairs for 5-row and 6-row and 15 differential pairs for 8-row per centimeter (25 and 38 pairs respectively per inch) I Minimum distance between daughtercards: – 5-row system offers 15.00mm (.591") – 6-row system offers 18.00mm (.709") – 8-row system offers 22.00mm (.866") I Ground planes between signal columns provide tightly controlled impedance for rise times down to 50 picoseconds (10-90%). This ensures very low cross talk between signals within and between columns I Ground pins are in the same grid as signal pins, allowing wider channels for PCB routing and traces up to 0.25mm (.010”) wide I 6-row or 8-row VHDM-HSD wafers can be applied to the same stiffener as standard VHDM 6-row or 8- row wafers. The combination of VHDM and VHDM- HSD wafers, grouped together in the same stiffener, provides cost effective solutions to different performance parameters The Very High Density Metric High Speed Differential (VHDM-HSD) connector system has been expanded to include 5-row, 6-row and 8-row daughtercard and backplane modules. VHDM-HSD is designed for differential-pair architecture applications that require very high interconnect density and signal integrity in a single-ended configuration. The same great modularity features and components of VHDM are provided in the VHDM-HSD. The 5-row and 6- row systems feature 2 signal pairs per column and the 8-row system features 3 signal pairs per column in increments of 10 and 25 columns. All circuits are utilized as signal circuits without the need to use some as ground circuits. The daughtercard connector consists of a metal stiffener just as with the VHDM system. The system combines the signal wafers, power modules and guidance modules into one continuous connector that can be ordered as a single specific part number. The card pitch of the VHDM- HSD 8-row system is the same as the standard VHDM 8- row system, allowing both signal wafer types for single ended and differential pair to be used together. This modularity and design flexibility allow engineers to incorporate both connector systems on the same platforms. The system is based on a 2.00mm (.079") pitch and includes vertical and right angle products that can be configured up to 2000 circuits. The maximum length of a daughtercard connector on a single stiffener is 300mm (12"). The backplane connectors feature headers with open ends for continuous side-to-side stacking and headers with guide pins and polarizing keys on either end to aid in proper alignment of the mating daughtercard. The power modules occupy just a small width and hold sequentially matable pins that each manage 10.0 amps of current. Molex offers application tooling for pressing VHDM-HSD connectors into PCBs as separate modules or as complete assemblies. VHDM-HSD cable assemblies are also available for connecting backplane headers to high- performance cables. Note: VHDM and VHDM-HSD are trademarks or registered trademarks of Teradyne,Inc.

FEATURES AND SPECIFICATIONS 2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD Module-to-Backplane Connector System Modular Construction Internal Ground Planes Press Fit Right Angle Receptacle 10 amp Power Blades 8 row Version

Applications

The VHDM-HSD products are used in very high speed, short rise-time, high circuit count applications connecting daughtercards to the backplane: I Network Switches I Routers I Computer Servers I Telecommunication Equipment I Internetworking Devices

ORDERING INFORMATION

Daughtercard Assembly Configuration 5-Row 6-Row 8-Row Signal wafers, power modules and guide modules sequentially assigned by application VHDM-HSD wafers 74670-XXXX 74880-XXXX 74680-XXXX Combination of VHDM and VHDM-HSD wafers 74686-XXXX 74886-XXXX 74686-XXXX Backplane Header Signal Module Standard Loaded Pin Height 0.76µm (30µ”) Gold 5-Row 6-Row 8-Row 10-Column 25-Column 10-Column 25-Column 10-Column 25-Column Open Ended 4.25mm (.167”) 74695-1003 74695-2503 74979-1003 74979-2503 74649-1003 74649-2503 4.75mm (.187”) 74695-1001 74695-2501 74979-1001 74979-2501 74649-1001 74649-2501 5.15mm (.203”) 74695-1004 74695-2504 74979-1004 74979-2504 74649-1004 74649-2504 6.25mm (.266”) 74695-1002 74695-2502 74979-1002 74979-2502 74649-1002 74649-2502 Left Guide Pin No Polarizing Key 4.25mm (.167”) 74696-1003 74696-2503 – – 74650-1003 74650-2503 4.75mm (.187”) 74696-1001 74696-2501 – – 74650-1001 74650-2501 5.15mm (.203”) 74696-1004 74696-2504 – – 74650-1004 74650-2504 6.25mm (.266”) 74696-1002 74696-2502 – – 74650-1002 74650-2502 Left Guide Pin “A” Polarizing Key 4.25mm (.167”) 74696-1013 74696-2513 – – 74650-1013 74650-2513 4.75mm (.187”) 74696-1011 74696-2511 – – 74650-1011 74650-2511 5.15mm (.203”) 74696-1014 74696-2514 – – 74650-1014 74650-2514 6.25mm (.266”) 74696-1012 74696-2512 – – 74650-1012 74650-2512 Right Guide Pin No Polarizing Key 4.25mm (.167”) 74697-1003 74697-2503 – – 74651-1003 74651-2503 4.75mm (.187”) 74697-1001 74697-2501 – – 74651-1001 74651-2501 5.15mm (.203”) 74697-1004 74697-2504 – – 74651-1004 74651-2504 6.25mm (.266”) 74697-1002 74697-2502 – – 74651-1002 74651-2502 Right Guide Pin “A” Polarizing Key 4.25mm (.167”) 74697-1013 74697-2513 – – 74651-1013 74651-2513 4.75mm (.187”) 74697-1011 74697-2511 – – 74651-1011 74651-2511 5.15mm (.203”) 74697-1014 74697-2514 – – 74651-1014 74651-2514 6.25mm (.266”) 74697-1012 74697-2512 – – 74651-1012 74651-2512 Backplane Power and Guide Components 5-Row and 6-Row 8-Row Power Module 74029-6000 74029-8000 Keying Post 74069-0010 74069-0010 Guide Pin 74076-0001/0002 74076-0001/0002 Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com Far East South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Visit our Web site at http://www.molex.com/product/backplan/hsd.html Order No. USA-158 Rev. 2 Printed in USA/2.5K/JI/JI/2003.03 2003, Molex Note: VHDM and VHDM-HSD are trademarks or registered trademarks of Teradyne,Inc.