RY8310 RYCHIP | Alldatasheet

Document overview

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  • PDF pages: 13

Technical content

Features

  • Wide 4.5V to 30V Operating Input Range
  • 1.2A Continuous Output Current
  • 1.4MHz Switching Frequency
  • Short Protection with Hiccup-Mode
  • Built-in Over Current Limit
  • Built-in Over V oltage Protection
  • Force-PWM Mode
  • Internal Soft-Start
  • 200mΩ/150mΩ Low RDS(ON) Internal Power MOSFETs
  • Output Adjustable from 0.8V
  • No Schottky Diode Required
  • Integrated internal compensation
  • Thermal Shutdown
  • Available in SOT23-6 Package
  • -40°C to +85°C Temperature Range

Applications

  • CCTV Camera
  • Flat-Panel Television and Monitor
  • Battery Charger
  • Distributed Power Systems General Description The RY8310 is a high frequency, synchronous, rectified, step- down, switch-mode converter with internal power MOSFETs. It offers a very compact solution to provide a 1.2A continuous current over a wide input supply range, with excellent load and line regulation. The RY8310 requires a minimal number of readily available, external components and is available in a space saving SOT23-6 package. Typical Application Circuit COUTR1 CIN IN SW EN FB GND VIN VOUT BS ON/ OFF CFF Basic Application Circuit

Email: support@rychip.com http://www.rychip.com ©RYCHIP Semiconductor Inc. 30V 1.2A 1.4MHz Synchronous Step-Down Regulator Page 2 / 13 Pin Description Pin Configuration SW EN IN BS FB GND TOP VIEW SOT23-6 Top Marking: GBYLL (device code: GB, Y=year code, LL= lot number code) Pin Description Pin Name Function 1 BS Bootstrap. A capacitor connected between SW and BST pins is required to form a floating supply across the high-side switch driver.

2 GND Ground Pin

3 FB Adjustable Version Feedback input. Connect FB to the center point of the external resistor divider 4 EN Drive this pin to a logic-high to enable the IC. Drive to a logic-low to disable the IC and enter micro-power shutdown mode.

5 IN Power Supply Pin

6 SW Switching Pin

Order Information (1) Marking Part No. Model Description Package T/R Qty GBYLL 70301500 RY8310 RY8310 Buck, 4.5-30V , 2A, 1.4MHz, VFB 0.8V , SOT23-6 SOT23-6 3000PCS Note (1): All RYCHIP parts are Pb-Free and adhere to the RoHS directive.

Email: support@rychip.com http://www.rychip.com ©RYCHIP Semiconductor Inc. 30V 1.2A 1.4MHz Synchronous Step-Down Regulator Page 3 / 13 Specifications Absolute Maximum Ratings (1) (2) Item Min Max Unit VIN voltage -0.3 32 V EN voltage -0.3 32 V SW voltage -0.3 VIN+0.5V V BS voltage -0.3 Vsw+5V V FB voltage –0.3 6 V Power dissipation (3) Internally Limited Operating junction temperature, TJ -40 150 °C Storage temperature, Tstg –55 150 °C Lead Temperature (Soldering, 10sec.) 260 °C Note (1): Exceeding these ratings may damage the device. Note (2): The device is not guaranteed to function outside of its operating conditions. Note (3): The maximum allowable power dissipation is a function of the maximum junction temperature, T J(MAX), the junction-to-ambient thermal resistance, RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) − TA)/RθJA. Exceeding the maximum allowable power dissipation causes excessive die temperature, and the regulator goes into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T J=160°C (typical) and disengages at TJ= 130°C (typical). ESD Ratings Item Description Value Unit V(ESD-HBM) Human Body Model (HBM) ANSI/ESDA/JEDEC JS-001-2014 Classification, Class: 2 ±2000 V V(ESD-CDM) Charged Device Mode (CDM) ANSI/ESDA/JEDEC JS-002-2014 Classification, Class: C0b ±200 V ILATCH-UP JEDEC STANDARD NO.78E APRIL 2016 Temperature Classification, Class: I ±150 mA Recommended Operating Conditions Item Min Max Unit Operating junction temperature (1) –40 125 °C Operating temperature range -40 85 °C Input voltage VIN 4.5 30 V Output current 0 1.2 A Note (1): All limits specified at room temperature (T A = 25°C) unless otherwise specified. All room temperature limits are 100% production tested. All limits at temperature extremes are ensured through correlation using standard

Email: support@rychip.com http://www.rychip.com ©RYCHIP Semiconductor Inc. 30V 1.2A 1.4MHz Synchronous Step-Down Regulator Page 4 / 13 Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). Thermal Information Item Description Value Unit RθJA Junction-to-ambient thermal resistance (1)(2) 105 °C/W RθJC(top) Junction-to-case (top) thermal resistance 55 °C/W RθJB Junction-to-board thermal resistance 17.5 °C/W ψJT Junction-to-top characterization parameter 3.5 °C/W ψJB Junction-to-board characterization parameter 17.5 °C/W Note (1): The package thermal impedance is calculated in accordance to JESD 51-7. Note (2): Thermal Resistances were simulated on a 4-layer, JEDEC board. Electrical Characteristics (1) (2) VIN=12V , TA=25°C, unless otherwise specified. Parameter Test Conditions Min Typ. Max Unit Input V oltage Range 4.5 30 V Supply Current (Quiescent) VEN =3.0V 0.6 0.8 mA Supply Current (Shutdown) VEN =0 or EN = GND 4 uA Feedback V oltage 0.780 0.800 0.820 V High-Side Switch On-Resistance ISW=100mA 200 mΩ Low-Side Switch On-Resistance ISW=-100mA 150 mΩ Upper Switch Current Limit 2 A Over V oltage Protection Threshold 30.8 V Switching Frequency 1.4 MHz Maximum Duty Cycle VFB=90% 92 % Minimum On-Time 90 nS EN Rising Threshold 1.3 V EN Falling Threshold 0.9 V Under-V oltage Lockout Threshold Wake up VIN V oltage 3.6 3.8 V Shutdown VIN V oltage 3.1 3.3 V Hysteresis VIN voltage 300 mV Soft Start 1 mS Thermal Shutdown 160 ℃ Thermal Hysteresis 30 ℃ Note (1): MOSFET on-resistance specifications are guaranteed by correlation to wafer level measurements. Note (2): Thermal shutdown specifications are guaranteed by correlation to the design and characteristics analysis.

Email: support@rychip.com http://www.rychip.com ©RYCHIP Semiconductor Inc. 30V 1.2A 1.4MHz Synchronous Step-Down Regulator Page 5 / 13 Typical Performance Characteristics (1) (2) Note (1): Performance waveforms are tested on the evaluation board. Note (2): VIN =12V , VOUT=3.3V , TA = +25ºC, unless otherwise noted. Efficiency vs Load Current VOUT=5V, 3.3V, 1.2V Output Ripple Voltage VIN=12V, VOUT=3.3V, IOUT=0A Loop Response VIN=12V, VOUT=3.3V, IOUT=0.6A-1.2A Load Regulation VOUT=5V, 3.3V, 1.2 Output Ripple Voltage VIN=12V, VOUT=3.3V, IOUT=0.6A Output Short VIN=12V, VOUT=3.3V Line Regulation V OUT=3.3V Output Ripple Voltage VIN=12V, VOUT=3.3V, IOUT=1.2A Short Circuit Entry VIN=12V, VOUT=3.3V

Email: support@rychip.com http://www.rychip.com ©RYCHIP Semiconductor Inc. 30V 1.2A 1.4MHz Synchronous Step-Down Regulator Page 6 / 13 Short Circuit Recovery VIN=12V, VOUT=3.3V Enable Startup at Full Load VIN=12V, VOUT=3.3V, IOUT=1.2A Power Up at Full Load VIN=12V, VOUT=3.3V, IOUT=1.2A Enable Startup at No Load VIN=12V, VOUT=3.3V, IOUT=0A Enable Shutdown at Full Load VIN=12V, VOUT=3.3V, IOUT=1.2A Enable Shutdown at No Load VIN=12V, VOUT=3.3V, IOUT=0A Power Up at No Load VIN=12V, VOUT=3.3V, IOUT=0A

Email: support@rychip.com http://www.rychip.com ©RYCHIP Semiconductor Inc. 30V 1.2A 1.4MHz Synchronous Step-Down Regulator Page 7 / 13 Functional Block Diagram VCC REGULATOR OSCILLATOR REFERENCE 400k56pF 1pF COMPARATOR ON TIME CONTROL LOGI C CO NTROL BOOST REGULATOR HS DRIVER LS DRIVER VCC VCC IN EN FB GND SW BS CURRENT LIMIT COMPARATOR CURRENT SENSE AMPLIFIER RSEN ERROR AMPLIFIER -VCC REGULATOR OSCILLATOR REFERENCE 400k56pF 1pF COMPARATOR ON TIME CONTROL LOGI C CO NTROL BOOST REGULATOR HS DRIVER LS DRIVER VCC VCC IN EN FB GND SW BS CURRENT LIMIT COMPARATOR CURRENT SENSE AMPLIFIER RSEN ERROR AMPLIFIER Block Diagram Functions Description Internal Regulator The RY8310 is a current mode step down DC/DC converter that provides excellent transient response with no extra external compensation components. This device contains an internal, low resistance, high voltage power MOSFET, and operates at a high 1.4MHz operating frequency to ensure a compact, high efficiency design with excellent AC and DC performance. Error Amplifier The error amplifier compares the FB pin voltage with the internal FB reference (V FB) and outputs a current proportional to the difference between the two. This output current is then used to charge or discharge the internal compensation network, which is used to control the power MOSFET current. The optimized internal compensation network minimizes the external component counts and simplifies the control loop design. Under-Voltage Lockout (UVLO) Under-voltage lockout (UVLO) protects the chip from operating at an insufficient supply voltage. UVLO protection monitors the internal regulator voltage. When the voltage is lower than UVLO threshold voltage, the device is shut off. When the voltage is higher than UVLO threshold voltage, the device is enabled again. Thermal Shutdown Thermal shutdown prevents the chip from operating at exceedingly high temperatures. When the silicon die temperature exceeds 160°C, it shuts down the whole chip. When the temperature falls below its lower threshold (Typ. 130°C) the chip is enabled again.

Email: support@rychip.com http://www.rychip.com ©RYCHIP Semiconductor Inc. 30V 1.2A 1.4MHz Synchronous Step-Down Regulator Page 8 / 13 Internal Soft-Start The soft-start is implemented to prevent the converter output voltage from overshooting during startup. When the chip starts, the internal circuitry generates a soft -start voltage (SS) ramping up from 0V to 0.8V . When it is lower than the internal reference (REF), SS overrides REF so the error amplifier uses SS as the reference. When SS is higher than REF, REF regains control. The SS time is internally max to 1ms. Over Current Protection and Hiccup The RY8310 has cycle-by-cycle over current limit when the inductor current peak value exceeds the set current limit threshold. Meanwhile, output voltage starts to drop until FB is below the Under-V oltage (UV) threshold. Once a UV is triggered, the RY8310 enters hiccup mode to periodically restart the part. This protection mode is especially useful when the output is dead-short to ground. The average short circuit current is greatly reduced to alleviate the thermal issue and to protect the regulator. The RY 8310 exits the hiccup mode once the over current condition is removed. Startup and Shutdown If both V IN and EN are higher than their appropriate thresholds, the chip starts. The reference block starts first, generating stable reference voltage and currents, and then the internal regulator is enabled. The regulator provides stable supply for the remaining ci rcuitries. Three events can shut down the chip: EN low, V IN low and thermal shutdown. In the shutdown procedure, the signaling path is first blocked to avoid any fault triggering. The comp voltage and the internal supply rail are then pulled down. The floa ting driver is not subject to this shutdown command.

Email: support@rychip.com http://www.rychip.com ©RYCHIP Semiconductor Inc. 30V 1.2A 1.4MHz Synchronous Step-Down Regulator Page 9 / 13 Applications Information Setting the Output Voltage RY8310 require an input capacitor, an output capacitor and an inductor. These components are critical to the performance of the device. RY8310 are internally compensated and do not require external components to achieve stable operation. The output voltage can be programmed by resistor divider. 𝑉𝑉𝑂𝑂𝑂𝑂𝑂𝑂 = 𝑉𝑉𝐹𝐹𝐹𝐹 × 𝑅𝑅1 + 𝑅𝑅2 𝑅𝑅2 VOUT(V) R1(KΩ) R2(KΩ) L1(μH) C1(nF) CIN(μF) COUT(μF) CFF (pF) Opt. 1.0 2.50 10 2.2 100 22 22×2 CFF Chapter 1.05 3.13 10 2.2 100 22 22×2 CFF Chapter 1.2 5.00 10 2.2 100 22 22×2 CFF Chapter 1.5 8.75 10 2.2 100 22 22×2 CFF Chapter 1.8 12.50 10 3.3 100 22 22×2 CFF Chapter 2.5 21.25 10 3.3 100 22 22×2 CFF Chapter 3.3 31.25 10 4.7 100 22 22×2 CFF Chapter 5.0 52.50 10 4.7 100 22 22×2 CFF Chapter All the external components are the suggested values, the final values are based on the application testing results. Selecting the Inductor The recommended inductor values are shown in the Application Diagram. It is important to guarantee the inductor core does not saturate during any foreseeable operational situation. The inductor should be rated to handle the maximum inductor peak current: Care should be taken when reviewing the different saturation current ratings that are specified by different manufacturers. Saturation current ratings are typically specified at 25°C, so ratings at maximum ambient temperature of the application should be requested from the manufacturer. The inductor value can be calculated with: 𝐿𝐿 = 𝑉𝑉𝑂𝑂𝑂𝑂𝑂𝑂 × (𝑉𝑉𝐼𝐼𝐼𝐼 −𝑉𝑉𝑂𝑂𝑂𝑂𝑂𝑂) 𝑉𝑉𝐼𝐼𝐼𝐼 × ∆𝐼𝐼𝐿𝐿 × 𝐹𝐹𝑂𝑂𝑂𝑂𝑂𝑂 Where ΔIL is the inductor ripple current. Choose inductor ripple current to be approximately 30% to 40% of the maximum load current. The maximum inductor peak current can be estimated as: 𝐼𝐼𝐿𝐿(𝑀𝑀𝑀𝑀𝑀𝑀) = 𝐼𝐼𝐿𝐿𝑂𝑂𝑀𝑀𝐿𝐿 + ∆𝐼𝐼𝐿𝐿 Under light load conditions below 100mA, larger inductance is recommended for improved efficiency. Larger inductances lead to smaller ripple currents and voltages, but they also have larger physical dimensions, lower saturation currents and higher linear impedance. Therefore, the choice of inductance should be compromised according to the specific application.

Email: support@rychip.com http://www.rychip.com ©RYCHIP Semiconductor Inc. 30V 1.2A 1.4MHz Synchronous Step-Down Regulator Page 10 / 13 Selecting the Input Capacitor The input current to the step-down converter is discontinuous and therefore requires a capacitor to supply AC current to the step-down converter while maintaining the DC input voltage. For a better performance, use ceramic capacitors placed as close to VIN as possible and a 0.1µF input capacitor to filter out high frequency interference is recommended. Capacitors with X5R and X7R ceramic dielectrics are recommended because they are stable with temperature fluctuations. The capacitors must also have a ripple current rating greater than the maximum input ripple current of the converter. The input ripple current can be estimated with Equation: 𝐼𝐼𝑂𝑂𝐼𝐼𝐼𝐼 = 𝐼𝐼𝑂𝑂𝑂𝑂𝑂𝑂 × 𝑉𝑉𝑂𝑂𝑂𝑂𝑂𝑂 𝑉𝑉𝐼𝐼𝐼𝐼 × 1 −𝑉𝑉𝑂𝑂𝑂𝑂𝑂𝑂 𝑉𝑉𝐼𝐼𝐼𝐼 From the above equation, it can be concluded that the input ripple current reaches its maximum at VIN=2VOUT where I𝑂𝑂𝐼𝐼𝐼𝐼 = 𝐼𝐼𝑂𝑂𝑂𝑂𝑂𝑂 2 . For simplification, choose an input capacitor with an RMS current rating greater than half of the maximum load current. The input capacitance value determines the input voltage ripple of the converter. If there is an input voltage ripple requirement in the system, choose the input capacitor that meets the specification. The input voltage ripple can be estimate with Equation: ∆𝑉𝑉𝐼𝐼𝐼𝐼 = 𝐼𝐼𝑂𝑂𝑂𝑂𝑂𝑂 𝐹𝐹𝑂𝑂𝑂𝑂𝑂𝑂 × 𝐶𝐶𝐼𝐼𝐼𝐼 × 𝑉𝑉𝑂𝑂𝑂𝑂𝑂𝑂 𝑉𝑉𝐼𝐼𝐼𝐼 × 1 −𝑉𝑉𝑂𝑂𝑂𝑂𝑂𝑂 𝑉𝑉𝐼𝐼𝐼𝐼 Similarly, when VIN=2VOUT, input voltage ripple reaches its maximum of ∆𝑉𝑉𝐼𝐼𝐼𝐼 = 4 × 𝐼𝐼𝑂𝑂𝑂𝑂𝑂𝑂 𝐹𝐹𝑂𝑂𝑂𝑂𝑂𝑂×𝑂𝑂𝐼𝐼𝐼𝐼 Selecting the Output Capacitor An output capacitor is required to maintain the DC output voltage. The output voltage ripple can be estimated with Equation: ∆𝑉𝑉𝑂𝑂𝑂𝑂𝑂𝑂 = 𝑉𝑉𝑂𝑂𝑂𝑂𝑂𝑂 𝐹𝐹𝑂𝑂𝑂𝑂𝑂𝑂 × 𝐿𝐿× 1 −𝑉𝑉𝑂𝑂𝑂𝑂𝑂𝑂 𝑉𝑉𝐼𝐼𝐼𝐼 × 𝑅𝑅𝐸𝐸𝑂𝑂𝐸𝐸 + 1 8 × 𝐹𝐹𝑂𝑂𝑂𝑂𝑂𝑂 × 𝐶𝐶𝑂𝑂𝑂𝑂𝑂𝑂 There are some differences between different types of capacitors. In the case of ceramic capacitors, the impedance at the switching frequency is dominated by the capacitance. The output voltage ripple is mainly caused by the capacitance. For simplification, the output voltage ripple can be estimated with Equation: ∆𝑉𝑉𝑂𝑂𝑂𝑂𝑂𝑂 = 𝑉𝑉𝑂𝑂𝑂𝑂𝑂𝑂 8 × 𝐹𝐹𝑂𝑂𝑂𝑂𝑂𝑂 2 × 𝐿𝐿× 𝐶𝐶𝑂𝑂𝑂𝑂𝑂𝑂 × 1 −𝑉𝑉𝑂𝑂𝑂𝑂𝑂𝑂 𝑉𝑉𝐼𝐼𝐼𝐼 A larger output capacitor can achieve a better load transient response, but the maximum output capacitor limitation should also be considered in the design application. If the output capacitor value is too high, the output voltage will not be able to reach the design value during the soft-start time and will fail to regulate. The maximum output capacitor value (COUT_MAX) can be limited approximately with Equation: 𝐶𝐶𝑂𝑂𝑂𝑂𝑂𝑂_𝑀𝑀𝑀𝑀𝑀𝑀 = 𝐼𝐼𝐿𝐿𝐼𝐼𝑀𝑀_𝑀𝑀𝐴𝐴𝐴𝐴 −𝐼𝐼𝑂𝑂𝑂𝑂𝑂𝑂× 𝑇𝑇𝑂𝑂𝑂𝑂/𝑉𝑉𝑂𝑂𝑂𝑂𝑂𝑂

Email: support@rychip.com http://www.rychip.com ©RYCHIP Semiconductor Inc. 30V 1.2A 1.4MHz Synchronous Step-Down Regulator Page 11 / 13 Where LL I M _ AV G is the average start-up current during the soft-start period, and TSS is the soft- start time. On the other hand, special attention should be paid when selecting these components. The DC bias of these capacitors can result in a capacitance value that falls below the minimum value given in the recommended capacitor specifications table. The ceramic capacitor’s actual capacitance can vary with temperature. The capacitor type X7R, which operates over a temperature range of −55°C to +125°C, will only vary the capacitance to within ±15%. The capacitor type X5R has a similar tolerance over a reduced temperature range of −55°C to +85°C. Many large value ceramic capacitors, larger than 1uF are manufactured with Z5U or Y5V temperature characteristics. Their capacitance can drop by more than 50% as the temperatu re varies from 25°C to 85°C. Therefore, X5R or X7R is recommended over Z5U and Y5V in applications where the ambient temperature will change significantly above or below 25°C. Feed-Forward Capacitor (CFF) RY8310 has internal loop compensation, so adding C FF is optional. Specifically, for specific applications, if necessary, consider whether to add feed-forward capacitors according to the situation. The use of a feed -forward capacitor (CFF) in the feedback network is to improve the transient response or higher phase margin. For optimizing the feed-forward capacitor, knowing the cross frequency is the first thing. The cross frequency (or the converter bandwidth) can be determined by using a network analyzer. When getting the cross frequency with no feed- forward capacitor identified, the value of feed -forward capacitor (C FF) can be calculated with the following Equation: 𝐶𝐶𝐹𝐹𝐹𝐹 = 1 2𝜋𝜋× 𝐹𝐹𝑂𝑂𝐸𝐸𝑂𝑂𝑂𝑂𝑂𝑂 × 1 𝑅𝑅1 × 1 𝑅𝑅1 + 1 𝑅𝑅2 Where F CROSS is the cross frequency. To reduce transient ripple, the feed-forward capacitor value can be increased to push the cross frequency to higher region. Although this can improve transient response, it also decreases phase margin and cause more ringing. In the other hand, if more phase margin is desired, the feed- forward capacitor value can be decreased to push the cross frequency to lower region.

Email: support@rychip.com http://www.rychip.com ©RYCHIP Semiconductor Inc. 30V 1.2A 1.4MHz Synchronous Step-Down Regulator Page 12 / 13 PC Board Layout Consideration PCB layout is very important to achieve stable operation. It is highly recommended to duplicate EVB layout for optimum performance. If change is necessary, please follow these guidelines for reference. 1. Keep the path of switching current short and minimize the loop area formed by Input capacitor, high-side MOSFET and low-side MOSFET. 2. Bypass ceramic capacitors are suggested to be put close to the VIN Pin. 3. Ensure all feedback connections are short and direct. Place the feedback resistors and compensation components as close to the chip as possible. 4. VOUT, SW away from sensitive analog areas such as FB. 5. Connect IN, SW, and especially GND respectively to a large copper area to cool the chip to improve thermal performance and long-term reliability. Top Layer Bottom Layer Sample Board Layout

Email: support@rychip.com http://www.rychip.com ©RYCHIP Semiconductor Inc. 30V 1.2A 1.4MHz Synchronous Step-Down Regulator Page 13 / 13 Package Description TOP VIEW RECOMMENDED PAD LAYOUT FRONT VIEW SIDE VIEW AAAAA 2. 80 3. 00 1. 50 1. 70 2. 60 3. 00 PI N 1 EXAMPLE TOP MA RK 1. 20 TYP 0. 60 TYP 0. 95 BSC 2. 60 TYP 0. 90 1. 30 0. 30 0. 50 0. 95 BSC 1. 45 MA X 0. 00 0. 15 SEATING PLANE 0. 09 0. 20 AAAAA 2. 80 3. 00 1. 50 1. 70 2. 60 3. 00 PI N 1 EXAMPLE TOP MA RK 1. 20 TYP 0. 60 TYP 0. 95 BSC 2. 60 TYP 0. 90 1. 30 0. 30 0. 50 0. 95 BSC 1. 45 MA X 0. 00 0. 15 SEATING PLANE 0. 09 0. 20 NOTE: 1. CONTROL DIMENSION IS IN INCHES. DIMENSION IN BRACKET IS IN MILLIMETERS. 2. PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 3. PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. 4. LEAD COPLANARITY (BOT TOM OF LEADS AFTER FORMING) SHAL L BE 0.004" INCHES MAX. 5. DRAWING CONFORMS TO JEDEC MS-012, VARIATION BA. 6. DRAWING IS NOT TO SCALE. AAAAA 2. 80 3. 00 1. 50 1. 70 2. 60 3. 00 PI N 1 EXAMPLE TOP MA RK 1. 20 TYP 0. 60 TYP 0. 95 BSC 2. 60 TYP 0. 90 1. 30 0. 30 0. 50 0. 95 BSC 1. 45 MA X 0. 00 0. 15 SEATING PLANE 0. 09 0. 20 NOTE: 1. CONTROL DIMENSION IS IN INCHES. DIMENSION IN BRACKET IS IN MILLIMETERS. 2. PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 3. PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. 4. LEAD COPLANARITY (BOT TOM OF LEADS AFTER FORMING) SHAL L BE 0.004" INCHES MAX. 5. DRAWING CONFORMS TO JEDEC MS-012, VARIATION BA. 6. DRAWING IS NOT TO SCALE. SOT23-6 GAUG E PLANE 0. 25 BSC 0. 30 0. 550° ~8 °