68HC705RC16

68HC705RC16 NXP | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 120

Technical content

REV. 3.0 NON-DISCLOSURE AGREEMENT REQUIRED 68HC705RC16 General Release Specification December 13, 1996 CSIC MCU Design Center Austin, Texas Freescale Sem iconductor, I nc...

NON-DISCLOSURE AGREEMENT REQUIRED General Release Specifiation MC68HC705RC16 — Rev. 3.0 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification List of Sections NONDISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 List of Sections Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

General Release Specification MC68HC705RC16 — Rev. 3.0 List of Sections NONDISCLOSURE AGREEMENT REQUIRED Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Table of Contents NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Table of Contents Section 1. General Description Section 2. Memory Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Table of Contents General Release Specification MC68HC705RC16 — Rev. 3.0 Table of Contents Section 3. Central Processor Unit Section 4. Interrupts Section 5. Resets Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Table of Contents NON-DISCLOSURE AGREEMENT REQUIRED Section 6. Low-Power Modes Section 7. Parallel Input/Output (I/O) Section 8. Core Timer Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Table of Contents General Release Specification MC68HC705RC16 — Rev. 3.0 Table of Contents Section 9. Carrier Modulator Transmitter (CMT)

9.4.2 Carrier Generator Data Registers

9.5.4 Modulator Period Data Registers

Section 10. EPROM Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Table of Contents NON-DISCLOSURE AGREEMENT REQUIRED Section 11. Instruction Set Section 12. Electrical Specifications Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Table of Contents General Release Specification MC68HC705RC16 — Rev. 3.0 Table of Contents Section 13. Mechanical Specifications 13.3 28-Pin Plastic Dual In-Line Package 13.4 28-Pin Small Outline Integrated Circuit Package 13.5 44-Pin Plastic Leaded Chip Carrier Section 14. Ordering Information Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification List of Figures NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 List of Figures Figure Title Page Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED List of Figures General Release Specification MC68HC705RC16 — Rev. 3.0 List of Figures Figure Title Page Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification List of Tables NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 List of Tables Table Title Page Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED List of Tables General Release Specification MC68HC705RC16 — Rev. 3.0 List of Tables Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification General Description NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Section 1. General Description

1.1 Contents

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED General Description General Release Specification MC68HC705RC16 — Rev. 3.0 General Description

1.2 Introduction

The MC68HC705RC16 is a low-cost addition to the M68HC05 Family of microcontrollers (MCUs) and is suitable for remote control applications. It contains the HC05 CPU core, including the 14-stage core timer with RTI and COP watchdog systems. On-chip peripherals include a carrier modulator transmitter. The 16-Kbyte memory map has 15,936 bytes of user EPROM, 340 bytes of boot ROM, and 352 bytes of RAM. There are 20 input/output (I/O) lines (eight having keyscan pullups/interrupts) and a low-power reset pin. The MC68HC705RC16 is available in 28-pin small outline integrated circuit (SOIC), dual in-line (DIP), or plastic leaded chip carrier (PLCC) packages. Four additional I/O lines are available for bond out in the 44-lead PLCC package.

1.3 Features

Features of the MC68HC705RC16 are:

• Low Cost
• HC05 Core
• 28-Pin Plastic Dual In-Line (PDIP), Small Outline Integrated Circuit (SOIC), or 44-Lead Plastic Leaded Chip Carrier (PLCC) Packages
• On-Chip Oscillator with Crystal/Ceramic Resonator
• 4-MHz Maximum Oscillator Frequency at 5 V and 3.3 V Supply
• Fully Static Operation
• 15,936 Bytes of User ROM
• 64 Bytes of Burn-In ROM
• 352 Bytes of On-Chip RAM
• 14-Stage Core Timer with Real-Time Interrupt (RTI) and Computer Operating Properly (COP) Watchdog Circuits Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification General Description NON-DISCLOSURE AGREEMENT REQUIRED

• Carrier Modulator Transmitter Supporting Baseband, Pulse Length Modulator (PLM), and Frequency Shift Keying (FSK) Protocols
• Low-Power Reset Pin
• 20 Bidirectional I/O Lines (Four Additional I/O Lines Available for Bond Out in 44-Lead PLCC Package)
• Mask Programmable Pullups and Interrupt on Eight Port Pins (PB0–PB7)
• High-Current Infrared (IR) Drive Pin
• High-Current Port Pin (PC0)
• Power-Saving Stop and Wait Modes
• Mask Selectable Options: – COP Watchdog Timer – STOP Instruction Disable – Edge-Sensitive or Edge- and Level-Sensitive Interrupt Trigger – Port B Pullups for Keyscan

1.4 Mask Options

The mask options on the MC68HC705RC16 are handled with 11 EPROM bits in two separate MOR registers, MOR1 and MOR2. These options are:

• Eight port B pullups
• IRQ sensitivity
• STOP enable/disable
• COP enable/disable ROM versions of this device will have these options programmed by the factory. NOTE: A line over a signal name indicates an active low signal. For example, RESET is active low. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED General Description General Release Specification MC68HC705RC16 — Rev. 3.0 General Description Figure 1-1. MC68HC705RC16 Block Diagram ÷ 2 ACCUMULATOR INDEX REGISTER STACK POINTER PROGRAM COUNTER CONDITION CODE REGISTER OSCILLATOR INTERNAL RESET COP CPU M68HC05 CPU ALU CPU REGISTERS CONTROL PORT A DATA DIRECTION REGISTER PORT B DATA DIRECTION REGISTER PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PROCESSOR CLOCK CORE TIMER SRAM — 352 BYTES EPROM — 15,936 BYTES SYSTEM SYSTEMRTI SYSTEM IRQ 0 0 00 0 0 0 1 1 1 1 1 CZNIH KEYSCAN PULLUPS BURN-IN ROM — 64 BYTES LPRST IRO PORT C DATA DIRECTION REGISTER PC0 PC1 PC2 PC3 PC4* PC5* PC6* PC7* * Marked pins are available only in higher pin count (>28) packages. IRQEN IRQEN OSC2 VDD VSS OSC1 CARRIER MODULATOR TRANSMITTER Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification General Description NON-DISCLOSURE AGREEMENT REQUIRED

1.5 Signal Description

Pinout for the 28-pin dual in-line package (DIP) is shown inFigure 1-2. Figure 1-3 provides the pinout for the 28-pin small outline integrated circuit (SOIC) package.Figure 1-4 shows the pinout for the 44-lead plastic leaded chip carrier (PLCC). The signals are described in the following subsections. Figure 1-2. 28-Pin DIP Pinout Figure 1-3. 28-Pin SOIC Assignments PB4 PB5 PB6 PB7 PA0 PA1 PA2 PA3 PA4 PA5 OSC1 OSC2 VDD VSS PC1 PC2 PC3 PB1 PB2 PC0 PB0 PB3 IRQ/VPP RESET PA7 PA6 LPRST IRO PA2 PA3 PA4 PA5 RESET IRO VSS LPRST PC3 PC2 PC1 PC0 PA7 PA6 PA1 PA0 PB7 PB6 PB5 PB3 PB2 PB1 PB0 OSC1 OSC2 VDD PB4 IRQ/VPP Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED General Description General Release Specification MC68HC705RC16 — Rev. 3.0 General Description Figure 1-4. 44-Pin PLCC Pinout

1.5.1 VDD and VSS

Power is supplied to the microcontroller’s digital circuits using these two pins. VDD is the positive supply and VSS is ground.

1.5.2 IRQ/VPP (Maskable Interrupt Request)

In addition to suppling the EPROM with the required programming voltage, this pin has a mask option as specified by the user that provides one of two different choices of interrupt triggering sensitivity. The options are: 1. Negative edge-sensitive triggering only 2. Both negative edge-sensitive and level-sensitive triggering. PC6 NC PC5 NC PB7 PB6 PB5 PB4 NC PC7 PA0 PA1 NC NC RESET IRO VSS LPRST NC PC4 PC3 PC2 NC OSC1 OSC2 VDD IRQ NC NC PB3 PB2 PB1 PB0 NC PA2 PA3 PA4 PA5 NC PA6 PA7 PC0 PC1 NC NOTE: NC = No Connect All no connects should be tied to an appropriate logic level (either VDD or VSS ). Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification General Description NON-DISCLOSURE AGREEMENT REQUIRED The MCU completes the current instruction before it responds to the interrupt request. WhenIRQ goes low for at least one tILIH (see12.8 Control Timing (5.0 Vdc and 3.3 Vdc)), a logic 1 is latched internally to signify that an interrupt has been requested. When the MCU completes its current instruction, the interrupt latch is tested. If the interrupt latch contains a logic 1 and the interrupt mask bit (I bit) in the condition code register is clear, the MCU then begins the interrupt sequence. If the option is selected to include level-sensitive triggering, theIRQ input requires an external resistor to VDD for wired-OR operation. The IRQ pin contains an internal Schmitt trigger as part of its input to improve noise immunity. Refer to4.2 Introduction for more detail.

1.5.3 OSC1 and OSC2

These pins provide control input for an on-chip clock oscillator circuit. A crystal, a ceramic resonator, or an external signal connects to these pins to provide a system clock. The oscillator frequency is two times the internal bus rate. Figure 1-5 shows the recommended circuit when using a crystal. The crystal and components should be mounted as close as possible to the input pins to minimize output distortion and startup stabilization time. A ceramic resonator may be used in place of the crystal in cost-sensitive applications.Figure 1-5 (a) shows the recommended circuit for using a ceramic resonator. The manufacturer of the particular ceramic resonator being considered should be consulted for specific information. An external clock should be applied to the OSC1 input with the OSC2 pin not connected (seeFigure 1-5 (b)). This setup can be used if the user does not want to run the CPU with a crystal. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED General Description General Release Specification MC68HC705RC16 — Rev. 3.0 General Description Figure 1-5. Oscillator Connections

1.5.4 RESET

This active-low pin is used to reset the MCU to a known start-up state by pullingRESET low. TheRESET pin contains an internal Schmitt trigger as part of its input to improve noise immunity. SeeSection 5. Resets.

1.5.5 LPRST

The LPRST pin is an active-low pin and is used to put the MCU into low-power reset mode. In low-power reset mode the MCU is held in reset with all processor clocks halted. SeeSection 5. Resets.

1.5.6 IRO

The IRO pin is the high-current source and sink output of the carrier modulator transmitter subsystem which is suitable for driving infrared (IR) LED biasing logic. SeeSection 9. Carrier Modulator Transmitter (CMT). OSC1 OSC2OSC1 OSC2 MCUMCU EXTERNAL CLOCK UNCONNECTED (a) Crystal/Ceramic Resonator (b) External Clock Source 10 MΩ Oscillator Connections Connections 30 pF30 pF Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification General Description NON-DISCLOSURE AGREEMENT REQUIRED

1.5.7 PA0–PA7

These eight I/O lines comprise port A. The state of any pin is software programmable and all port A lines are configured as inputs during power-on or reset. For detailed information on I/O programming, see2.4 Input/Output Programming.

1.5.8 PB0–PB7

These eight I/O lines comprise port B. The state of any pin is software programmable and all port B lines are configured as inputs during power-on or reset. Each port B I/O line has a mask optionable pullup/interrupt for keyscan. For detailed information on I/O programming, see2.4 Input/Output Programming.

1.5.9 PC0–PC3 (PC4–PC7)

These eight I/O lines comprise port C. PC0 is a high-current pin. PC4–PC7 are available only in the 44-lead PLCC package. The state of any pin is software programmable and all port C lines are configured as input during power-on or reset. For detailed information on I/O programming, see2.4 Input/Output Programming. NOTE: Only four bits of port C are bonded out in 28-pin packages for the MC68HC705RC16, although port C is truly an 8-bit port. Since pins PC4–PC7 are unbonded, software should include the code to set their respective data direction register locations to outputs to avoid floating inputs. NOTE: Any unused inputs, I/O ports, and no connects should be tied to an appropriate logic level (either VDD or VSS ). Although the I/O ports of the MC68HC705RC16 do not require termination, termination is recommended to reduce the possibility of static damage. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED General Description General Release Specification MC68HC705RC16 — Rev. 3.0 General Description Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Memory NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Section 2. Memory

2.1 Contents

2.2 Introduction

This section describes the organization of the on-chip memory.

2.3 Memory Map

The MC68HC705RC16 has a 16-Kbyte memory map consisting of user EPROM, RAM, burn-in ROM, and input/output (I/O). Figure 2-1 shows the MC68HC705RC16 memory map in user mode. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Memory General Release Specification MC68HC705RC16 — Rev. 3.0 Memory Figure 2-1. 16-KByte Memory Map I/O

32 BYTES

160 BYTES

64 BYTES

128 BYTES

15920 BYTES

16 BYTES

$0000 $001F $0020 $00BF $00C0 $00FF $0180 $3FAF $3FB0 $3FF1 $3FFF 0000 0031 0032 0191 0192 0255 0383 0384 16303 16304 16368 16383 0256 PORT A DATA REGISTER PORT B DATA REGISTER PORT C DATA REGISTER PORT A DATA DIRECTION REGISTER PORT B DATA DIRECTION REGISTER PORT C DATA DIRECTION REGISTER CORE TIMER CONTROL & STATUS REGISTER RESERVED $00 $01 $02 $03 $04 $05 $06 $07 $08 $09 $0FRESERVED RESET VECTOR (LOW BYTE) RESET VECTOR (HIGH BYTE) SWI VECTOR (LOW BYTE) SWI VECTOR (HIGH BYTE) IRQ/PTB KEYSCAN PULLUPS IRQ/ PTB KEYSCAN PULLUPS CMT VECTOR (LOW BYTE) CMT VECTOR (HIGH BYTE) CORE TIMER VECTOR (LOW BYTE) $3FF2 $3FF5 $3FF6 $3FF7 $3FF8 $3FF9 $3FFA $3FFB $3FFC $3FFD $3FFE UNUSED $3FFF RESERVED RESERVED PROGRAMMING REGISTER $18 $1F RESERVED $1E $10 $11 $12 $13 $14 $15 $16 $17 CMT CHR1 CMT CLR1 CMT CHR2 CMT CLR2 CMT MCSR CMT MDR1 CMT MDR2 CMT MDR3 CORE TIMER VECTOR (HIGH BYTE) UNUSED $0A CORE TIMER COUNTER REGISTER VECTOR (HIGH BYTE) VECTOR (LOW BYTE) RESERVED MOR1 MOR2 $3FF0 USER MODE MEMORY MAP $00B0 $0100 16370 $0171 $0170 $3FEF Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Memory NON-DISCLOSURE AGREEMENT REQUIRED Addr. Register Bit 7 6 5 4 3 2 1 Bit 0 $0000 Port A Data Register $0001 Port B Data Register $0002 Port C Data Register $0003 Reserved R RRRRRRR $0004 Port A Data Direction Register $0005 Port B Data Direction Register $0006 Port C Data Direction Register $0007 Reserved R RRRRRRR $0008 Timer Control and Status Reg. CTOFRTIF TOFE RTIE TOFC RTFC RT1 RT0 $0009 Timer Counter Register $000A Reserved R RRRRRRR $000B Reserved R RRRRRRR $000C Reserved R RRRRRRR $000D Reserved R RRRRRRR $000E Reserved R RRRRRRR $000F Reserved R RRRRRRR $0010 IR Timer CHR1 IROLN 0 PH5 PH4 PH3 PH2 PH1 PH0 $0011 IR Timer CLR1 IROLP 0 PL5 PL4 PL3 PL2 PL1 PL0 $0012 IR Timer CHR2 0 0 SH5 SH4 SH3 SH2 SH1 SH0 $0013 IR Timer CLR2 0 0 SL5 SL4 SL3 SL2 SL1 SL0 $0014 IR Timer MCSR EOC 0 EIMSK EXMRK BASE MODE EOCIE MCGEN $0015 IR Timer MDR1 MB11 MB10 MB9 MB8 SB11 SB10 SB9 SB8 $0016 IR Timer MDR2 MB7 MB6 MB5 MB4 MB3 MB2 MB1 MB0 $0017 IR Timer MDR3 SB7 SB6 SB5 SB4 SB3 SB2 SB1 SB0 $0018 Reserved R RRRRRRR $0019 Reserved R RRRRRRR R = Reserved Figure 2-2. I/O Registers Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Memory General Release Specification MC68HC705RC16 — Rev. 3.0 Memory

2.3.1 EPROM

The user EPROM consists of 15,936 bytes of EPROM from $0180 to $3FAF and 14 bytes of user vectors from $3FF2 to $3FFF. The bootloader ROM and vectors are located from $3FB0 to $3FEF. Ten of the user vectors, $3FF6 thorough $3FFF, are dedicated to reset and interrupt vectors. The four remaining locations, $3FF2–$3FF5 are general-purpose user EPROM locations. The mask option registers (MOR1 and MOR2) are located at $3FF0 and $3FF1.

2.3.2 EPROM Security

The MC68HC705RC16 contains special circuitry to prevent accessing the EPROM in nonuser mode. Emulation is not affected by security. Security is controlled by a security bit in the MOR1 register. The security bit is intended to be programmed while the code is being programmed.. When set, this will inhibit reading of the EPROM in all modes other than user mode.1 1. No security feature is absolutely secure. However, Motorola’s strategy is to make reading or copying the ROM difficult for unauthorized users. $001A Reserved R RRRRRRR $001B Reserved R RRRRRRR $001C Reserved R RRRRRRR $001D Reserved R RRRRRRR $001E Reserved R RRRRRRR $001F Reserved R RRRRRRR R = Reserved Addr. Register Bit 7 6 5 4 3 2 1 Bit 0 Figure 2-2. I/O Registers (Continued) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Memory NON-DISCLOSURE AGREEMENT REQUIRED

2.3.3 RAM

The user RAM consists of 352 bytes of a shared stack area. The RAM starts at address $0020 and ends at address $017F. The stack begins at address $00FF. The stack pointer can access 64 bytes of RAM in the range $00FF to $00C0. NOTE: Using the stack area for data storage or temporary work locations requires care to prevent it from being overwritten due to stacking from an interrupt or subroutine call.

2.3.4 Bootloader ROM

Addresses $3FB0 to $3FEF are reserved ROM addresses that contain the instructions for the bootloader functions. (SeeSection 10. EPROM.)

2.4 Input/Output Programming

In user mode, 20 lines (28-pin PDIP or 28-pin SOIC) or 24 lines (44-lead PLCC) are arranged as three 8-bit I/O ports. These ports are programmable as either inputs or outputs under software control of the data direction registers. For detailed information, refer toSection 7. Parallel Input/Output (I/O). Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Memory General Release Specification MC68HC705RC16 — Rev. 3.0 Memory Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Central Processor Unit NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Section 3. Central Processor Unit

3.1 Contents

3.2 Introduction

This section describes the registers of the MC68HC705RC16 central processor unit (CPU). The MCU contains five registers as shown in Figure 3-1. The interrupt stacking order is shown inFigure 3-2. Figure 3-1. Programming Model A X HI N Z C CCR 11 SP PC 13 0 ACCUMULATOR INDEX REGISTER PROGRAM COUNTER STACK POINTER CONDITION CODE REGISTER 0000 0 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Central Processor Unit General Release Specification MC68HC705RC16 — Rev. 3.0 Central Processor Unit Figure 3-2. Stacking Order

3.3 Accumulator

The accumulator (A) is a general-purpose 8-bit register used to hold operands and results of arithmetic calculations or data manipulations.

3.4 Index Register

The index register (X) is an 8-bit register used for the indexed addressing value to create an effective address. The index register also may be used as a temporary storage area. INDEX REGISTER PCL ACCUMULATOR CONDITION CODE REGISTER PCH 11 1

70 STACK

I N T E R R U P T DECREASING UNSTACK R E T U R N INCREASING NOTE: Since the stack pointer decrements during pushes, the PCL is stacked first, followed by PCH, etc. Pulling from the stack is in the reverse order. MEMORY ADDRESSES MEMORY ADDRESSES A X Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Central Processor Unit NON-DISCLOSURE AGREEMENT REQUIRED

3.5 Condition Code Register

The condition code register (CCR) is a 5-bit register in which four bits are used to indicate the results of the instruction just executed, and the fifth bit indicates whether interrupts are masked. These bits can be tested individually by a program, and specific actions can be taken as a result of their state. Each bit is explained in the following paragraphs. H — Half Carry This bit is set during ADD and ADC operations to indicate that a carry occurred between bits 3 and 4. I — Interrupt When this bit is set, timer and external interrupts are masked (disabled). If an interrupt occurs while this bit is set, the interrupt is latched and processed as soon as the interrupt bit is cleared. N — Negative When set, this bit indicates that the result of the last arithmetic, logical, or data manipulation was negative. Z — Zero When set, this bit indicates that the result of the last arithmetic, logical, or data manipulation was zero. C — Carry/Borrow When set, this bit indicates that a carry or borrow out of the arithmetic logical unit (ALU) occurred during the last arithmetic operation. This bit is also affected during bit test and branch instructions and during shifts and rotates. CCR HIN Z C Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Central Processor Unit General Release Specification MC68HC705RC16 — Rev. 3.0 Central Processor Unit

3.6 Stack Pointer

The stack pointer (SP) contains the address of the next free location on the stack. During an MCU reset or the reset stack pointer (RSP) instruction, the stack pointer is set to location $00FF. The stack pointer is then decremented as data is pushed onto the stack and incremented as data is pulled from the stack. When accessing memory, the seven most significant bits are permanently set to 0000011. These seven bits are appended to the six least significant register bits to produce an address within the range of $00FF to $00C0. Subroutines and interrupts may use up to 64 (decimal) locations. If 64 locations are exceeded, the stack pointer wraps around and loses the previously stored information. A subroutine call occupies two locations on the stack; an interrupt uses five locations.

3.7 Program Counter

The program counter (PC) is a 13-bit register that contains the address of the next byte to be fetched. NOTE: The HC05 CPU core is capable of addressing a 64-Kbyte memory map. For this implementation, however, the addressing registers are limited to an 16-Kbyte memory map. 13 7 0

0000011 S P

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Interrupts NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Section 4. Interrupts

4.1 Contents

4.2 Introduction

The MCU can be interrupted four different ways: 1. Nonmaskable software interrupt instruction (SWI) 2. External asynchronous interrupt (IRQ/port B keyscan) 3. Internal carrier modulator transmitter interrupt 4. Internal core timer interrupt Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Interrupts General Release Specification MC68HC705RC16 — Rev. 3.0 Interrupts

4.3 CPU Interrupt Processor

Interrupts cause the processor to save register contents on the stack and to set the interrupt mask (I bit) to prevent additional interrupts. Unlike reset, hardware interrupts do not cause the current instruction execution to be halted, but are considered pending until the current instruction is complete. If interrupts are not masked (I bit in the CCR is clear) and the corresponding interrupt enable bit is set, the processor will proceed with interrupt processing. Otherwise, the next instruction is fetched and executed. If an interrupt occurs, the processor completes the current instruction, stacks the current CPU register state, sets the I bit to inhibit further interrupts, and finally checks the pending hardware interrupts. If more than one interrupt is pending after the stacking operation, the interrupt with the highest vector location shown inTable 4-1 will be serviced first. The SWI is executed the same as any other instruction, regardless of the I-bit state. When an interrupt is to be processed, the CPU fetches the address of the appropriate interrupt software service routine from the vector table at locations $3FF6–$3FFF as defined inTable 4-1. Table 4-1. Vector Address for Interrupts and Reset Register Flag Name Interrupt CPU Interrupt Vector Address N/A N/A Reset RESET $3FFE–$3FFF N/A N/A Software Interrupt SWI $3FFC–$3FFD N/A N/A External Interrupts* IRQ $3FFA–$3FFB MCSR EOC End of Cycle Interrupt CMT $3FF8–$3FF9 CTCSR CTOF , RTIF Real-Time Interrupt Core Timer Overflow CORE TIMER $3FF6–$3FF7 *External interrupts includeIRQ and port B keyscan sources. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Interrupts NON-DISCLOSURE AGREEMENT REQUIRED The M68HC05 CPU does not support interruptible instructions. The maximum latency to the first instruction of the interrupt service routine must include the longest instruction execution time plus stacking overhead. Latency = (Longest instruction execution time + 10) x tcyc seconds An RTI instruction is used to signify when the interrupt software service routine is completed. The RTI instruction causes the register contents to be recovered from the stack and normal processing to resume at the next instruction that was to be executed when the interrupt took place. Figure 4-1 shows the sequence of events that occurs during interrupt processing.

4.4 Reset Interrupt Sequence

The reset function is not in the strictest sense an interrupt; however, it is acted upon in a similar manner as shown inFigure 4-1. A low-level input on theRESET pin or an internally generated RST signal causes the program to vector to its starting address, which is specified by the contents of memory locations $3FFE and $3FFF. The I bit in the condition code register is also set. The MCU is configured to a known state during this type of reset.

4.5 Software Interrupt (SWI)

The SWI is an executable instruction and a nonmaskable interrupt since it is executed regardless of the state of the I bit in the CCR. If the I bit is zero (interrupts enabled), the SWI instruction executes after interrupts that were pending before the SWI was fetched or before interrupts generated after the SWI was fetched. The interrupt service routine address is specified by the contents of memory locations $3FFC and $3FFD. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Interrupts General Release Specification MC68HC705RC16 — Rev. 3.0 Interrupts Figure 4-1.Interrupt Processing Flowchart N N RESTORE REGISTERS FROM STACK: CCR, A, X, PC. LOAD PC FROM APPROPRIATE VECTOR. SET I BIT IN CC REGISTER. STACK PC, X, A, CCR. CLEAR IRQ REQUEST LATCH. FETCH NEXT INSTRUCTION. EXECUTE INSTRUCTION. Y Y N I BIT IN CCR SET? SWI INSTRUCTION N Y RTI INSTRUCTION Y FROM RESET YINTERNAL CMT INTERRUPT N N YINTERNAL CORE TIMER INTERRUPT IRQ/PORT B EXTERNAL INTERRUPTS EIMSK CLEAR? Y N KEYSCAN Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Interrupts NON-DISCLOSURE AGREEMENT REQUIRED

4.6 Hardware Interrupts

All hardware interrupts exceptRESET are maskable by the I bit in the CCR. If the I bit is set, all hardware interrupts (internal and external) are disabled. Clearing the I bit enables the hardware interrupts. The three types of hardware interrupts are explained in the following sections.

4.7 External Interrupt (IRQ/Port B Pullup)

The IRQ pin provides an asynchronous interrupt to the CPU. A block diagram of the IRQ function is shown inFigure 4-2. NOTE: The BIH and BIL instructions will apply to the level on theIRQ pin itself and to the output of the logic OR function with the port B IRQ interrupts. The states of the individual port B pins can be checked by reading the appropriate port B pins as inputs. The IRQ pin is one source of an external interrupt. All port B pins (PB0–PB7) act as other external interrupt sources if the pullup feature is enabled as specified by the user. Figure 4-2. IRQ Function Block Diagram IRQ LATCH R IRQ PIN LEVEL (MASK OPTION) TO IRQ PROCESSING IN CPU PORT B KEYSCAN INTERRUPT TO BIH & BIL INSTRUCTION SENSING RST IRQ VECTOR FETCH VDDEIMSK Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Interrupts General Release Specification MC68HC705RC16 — Rev. 3.0 Interrupts When edge sensitivity is selected for the IRQ interrupt, it is sensitive to these cases: 1. Falling edge on theIRQ pin 2. Falling edge on any port B pin with pullup enabled When edge and level sensitivity is selected for the IRQ interrupt, it is sensitive to these cases: 1. Low level on theIRQ pin 2. Falling edge on theIRQ pin 3. Falling edge or low level on any port B pin with pullup enabled External interrupts also can be masked by setting the EIMSK bit in the MSCR register of the IR remote timer. See9.5.4 Modulator Period Data Registers (MDR1, MDR2, and MDR3) for details.

4.8 External Interrupt Timing

If the interrupt mask bit (I bit) of the CCR is set, all maskable interrupts (internal and external) are disabled. Clearing the I bit enables interrupts. The interrupt request is latched immediately following the falling edge of theIRQ source. It is then synchronized internally and serviced as specified by the contents of $3FFA and $3FFB. Either a level-sensitive and edge-sensitive trigger or an edge-sensitive-only trigger is available via the MOR register for theIRQ pin.

4.9 Carrier Modulator Transmitter Interrupt (CMT)

A CMT interrupt occurs when the end of cycle flag (EOC) and the end of cycle interrupt enable (EOCIE) bits are set in the modulator control and status register (MCSR). This interrupt will vector to the interrupt service routine located at the address specified by the contents of memory locations $3FF8 and $3FF9. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Interrupts NON-DISCLOSURE AGREEMENT REQUIRED

4.10 Core Timer Interrupt

This timer can create two types of interrupts. A timer overflow interrupt occurs whenever the 8-bit timer rolls over from $FF to $00 and the enable bit TOFE is set. A real-time interrupt occurs whenever the programmed time elapses and the enable bit RTIE is set. Either of these interrupts vectors to the same interrupt service routine, located at the address specified by the contents of memory locations $3FF6 and $3FF7. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Interrupts General Release Specification MC68HC705RC16 — Rev. 3.0 Interrupts Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Resets NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Section 5. Resets

5.1 Contents

5.2 Introduction

The MCU can be reset from five sources: two external inputs and three internal restart conditions. TheRESET and LPRST pins are inputs as shown inFigure 5-1. All the internal peripheral modules will be reset by the internal reset signal (RST). Refer toFigure 5-2 for reset timing detail. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Resets General Release Specification MC68HC705RC16 — Rev. 3.0 Resets

5.3 External Reset (RESET)

The RESET pin is one of the two external sources of a reset. This pin is connected to a Schmitt trigger input gate to provide an upper and lower threshold voltage separated by a minimum amount of hysteresis. This external reset occurs whenever theRESET pin is pulled below the lower threshold and remains in reset until theRESET pin rises above the upper threshold. This active-low input will generate the RST signal and reset the CPU and peripherals. Termination of the external RESET input or the internal COP watchdog reset are the only reset sources that can alter the operating mode of the MCU. NOTE: Activation of the RST signal is generally referred to as reset of the device, unless otherwise specified. Figure 5-1. Reset Block Diagram CPU LATCH RESET COP WATCHDOG (COPR) RST OSC DATA ADDRESS PH2 TO OTHER PERIPHERALS S IRQ MODE SELECT TO IRQ LOGIC LATCH R POWER-ON RESET (POR)VDD ILLEGAL ADDRESS (ILLADDR)ADDRESS CLOCKED D D LPRST Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Resets Resets External Reset (RESET) NON-DISCLOSURE AGREEMENT REQUIRED Figure 5-2. Reset and POR Timing Diagram PCH PCL OSC12 RESET INTERNAL PROCESSOR INTERNAL ADDRESS BUS1 3FFE 3FFF VDD 4064 tCYC tCYC tRL INTERNAL DATA BUS1 3FFE3FFE3FFE 3FFE NEW PC3FFF NOTES: 1. Internal timing signal and bus information are not available externally. 2. OSC1 line is not meant to represent frequency. It is only used to represent time. 3. The next rising edge of the internal processor clock following the rising edge of RESET initiates the reset sequence. 4. VDD must fall to a level lower than VPOR to be recognized as a power-on reset. 5. The LPRST pin resets the CPU likeRESET. However, 4064 POR cycles are first, before the reset vector address appears on the internal address bus. (See5.4 Low-Power External Reset (LPRST).) NEW NEW OP CODEPCLPCH NEW PC NEW PC OP CODE NEW PC CLOCK1 0 V > VPOR 4 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Resets General Release Specification MC68HC705RC16 — Rev. 3.0 Resets

5.4 Low-Power External Reset (LPRST)

The LPRST pin is one of the two external sources of a reset. This external reset occurs whenever theLPRST pin is pulled below the lower threshold and remains in reset until theLPRST pin rises. This active low input will, in addition to generating the RST signal and resetting the CPU and peripherals, halt all internal processor clocks. The MCU will remain in this low-power reset condition as long as a logic 0 remains on LPRST. When a logic 1 is applied to LPRST, processor clocks will be re-enabled with the MCU remaining in reset until the 4064 internal processor clock cycle (tcyc) oscillator stabilization delay is completed. If any other reset function is active at the end of this 4064-cycle delay, the RST signal remains in the reset condition until the other reset condition(s) end.

5.5 Internal Resets

The three internally generated resets are the initial power-on reset function, the COP watchdog timer reset, and the illegal address detector. Termination of the external reset input, externalLPRST input, or the internal COP watchdog timer are the only reset sources that can alter the operating mode of the MCU. The other internal resets do not have any effect on the mode of operation when their reset state ends.

5.5.1 Power-On Reset (POR)

The internal POR is generated on power-up to allow the clock oscillator to stabilize. The POR is strictly for power turn-on conditions and is not able to detect a drop in the power supply voltage (brown-out). There is an oscillator stabilization delay of 4064 internal processor bus clock cycles (PH2) after the oscillator becomes active. The POR generates the RST signal that resets the CPU. If any other reset function is active at the end of this 4064-cycle delay, the RST signal remains in the reset condition until the other reset condition(s) ends. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Resets NON-DISCLOSURE AGREEMENT REQUIRED

5.5.2 Computer Operating Properly Reset (COPR)

The MCU contains a watchdog timer that automatically times out if not reset (cleared) within a specific time by a program reset sequence. If the COP watchdog timer is allowed to time out, an internal reset is generated to reset the MCU. The COP reset function is enabled or disabled by the mask option registers (MOR).

5.5.2.1 Resetting the COP

Writing a zero to the COPF bit prevents a COP reset. This action resets the counter and begins the time-out period again. The COPF bit is bit 0 of address $3FF0. A read of address $3FF0 returns user data programmed at that location.

5.5.2.2 COP During Wait Mode

The COP continues to operate normally during wait mode. The software should pull the device out of wait mode periodically and reset the COP by writing to the COPF bit to prevent a COP reset.

5.5.2.3 COP During Stop Mode

When the stop enable mask option is selected, stop mode disables the oscillator circuit and thereby turns the clock off for the entire device. When stop is executed, the COP counter will hold its current state. If a reset is used to exit stop mode, the COP counter is reset and held until 4064 POR cycles are completed. At this time, counting will begin. If an external IRQ is used to exit stop mode, the COP counter does not wait for the completion of the 4064 POR cycles but does count these cycles. It is, therefore, recommended that the COP is fed before executing the STOP instruction. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Resets General Release Specification MC68HC705RC16 — Rev. 3.0 Resets

5.5.2.4 COP Watchdog Timer Considerations

The COP watchdog timer is active in all modes of operation if enabled by a mask option. If the COP watchdog timer is selected by a mask option, any execution of the STOP instruction (either intentionally or inadvertently due to the CPU being disturbed) causes the oscillator to halt and prevents the COP watchdog timer from timing out. If the COP watchdog timer is selected by a mask option, the COP resets the MCU when it times out. Therefore, it is recommended that the COP watchdog be disabled for a system that must have intentional uses of the wait mode for periods longer than the COP time-out period. The recommended interactions and considerations for the COP watchdog timer, STOP instruction, and WAIT instruction are summarized inTable 5-1. Table 5-1. COP Watchdog Timer Recommendations IF the Following Conditions Exist: THEN the COP Watchdog Timer Should Be:Wait Time Wait TimeLess than COP Time-Out Enable or Disable COP by MOR Wait TimeMore than COP Time-Out Disable COP by MOR Any Length Wait Time Disable COP by MOR Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Resets NON-DISCLOSURE AGREEMENT REQUIRED

5.5.2.5 COP Register

The COP register is shared with the LSB of an unimplemented user interrupt vector as shown inFigure 5-3. Reading this location returns whatever user data has been programmed at this location. Writing a zero to the COPR bit in this location clears the COP watchdog timer.

5.5.3 Illegal Address

An illegal address reset is generated when the CPU attempts to fetch an instruction from I/O address space ($0000 to $001F). Address: $0FF) BIt 7 654321 Bit 0 Read: X X X X X X X X Write: COPR = Unimplemented Figure 5-3. COP Watchdog Timer Location Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Resets General Release Specification MC68HC705RC16 — Rev. 3.0 Resets Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Low-Power Modes NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Section 6. Low-Power Modes

6.1 Contents

6.2 Introduction

This section describes the low-power modes.

6.3 Stop Mode

The STOP instruction places the MCU in its lowest power-consumption mode. In stop mode, the internal oscillator is turned off, halting all internal processing, including timer operation. During stop mode, the CTCSR ($08) bits are altered to remove any pending timer interrupt request and to disable any further timer interrupts. The timer prescaler is cleared. The I bit in the CCR is cleared to enable external interrupts. All other registers and memory remain unaltered. All input/output lines remain unchanged. NOTE: The EIMSK bit is not cleared automatically by the execution of a STOP instruction. Care should be taken to clear this bit before entering stop mode. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Low-Power Modes General Release Specification MC68HC705RC16 — Rev. 3.0 Low-Power Modes Figure 6-1. Stop Recovery Timing Diagram

6.4 Stop Recovery

The processor can be brought out of stop mode only by an external interrupt,LPRST, orRESET. Refer toFigure 6-1. NOTE: If an external interrupt is pending when stop mode is entered, then stop mode will be exited immediately.

6.5 Wait Mode

The WAIT instruction places the MCU in a low power-consumption mode, but wait mode consumes more power than stop mode. All CPU action is suspended, but the core timer, the oscillator, and any enabled module remain active. Any interrupt or reset will cause the MCU to exit wait mode. The user must shut off subsystems to reduce power 3FFE 3FFE 3FFE 3FFE 3FFF INTERNAL ADDRESS BUS INTERNAL CLOCK IRQ3 IRQ2 RESET OSC11 tILCH 4064 tCYC RESET OR INTERRUPT VECTOR FETCH tLIH tRL NOTES: 1. Represents the internal gating of the OSC1 pin 2.IRQ pin edge-sensitive mask option 3.IRQ pin level and edge-sensitive mask option Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Low-Power Modes NON-DISCLOSURE AGREEMENT REQUIRED consumption. Wait current specifications assume CPU operation only and do not include current consumption by any other subsystems. During wait mode, the I bit in the CCR is cleared to enable interrupts. All other registers, memory, and input/output lines remain in their previous states. The timer may be enabled to allow a periodic exit from the wait mode.

6.6 Low-Power Reset

Low-power reset mode is entered when a logic 0 is detected on the LPRST pin. When in this mode (as long asLPRST is held low), the MCU is held in reset and all internal clocks are halted. Applying a logic 1 to LPRST will cause the part to exit low-power reset mode and begin counting out the 4064-cycle oscillator stabilization period. Once this time has elapsed, the MCU will begin operation from the reset vectors ($3FFE–$3FFF). Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Low-Power Modes General Release Specification MC68HC705RC16 — Rev. 3.0 Low-Power Modes Figure 6-2. Stop/Wait Flowchart TURN ON OSCILLATOR. WAIT FOR TIME DELAY TO STABILIZE. 1. FETCH RESET VECTOR OR 2. SERVICE INTERRUPT A. STACK B. SET I BIT C. VECTOR TO INTERRUPT ROUTINE RESTART PROCESSOR CLOCK. 1. FETCH RESET VECTOR OR 2. SERVICE INTERRUPT A. STACK B. SET I BIT C. VECTOR TO INTERRUPT ROUTINE Y Y Y Y Y N N N NN STOP WAIT RESET OSCILLATOR ACTIVE. CORE TIMER CLOCK ACTIVE. PROCESSOR CLOCKS STOPPED. STOP OSCILLATOR AND ALL CLOCKS. CLEAR I BIT. IR TIMER INTERNAL INTERRUPT CORE TIMER INTERNAL INTERRUPT N Y Y IR TIMER CLOCK ACTIVE. EXTERNAL INTERRUPT (IRQ) (PTB KEYSCAN PULLUPS) EXTERNAL (IRQ) (PTB KEYSCAN PULLUPS)INTERRUPT OR LPRST RESET OR LPRST Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Parallel Input/Output (I/O) NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Section 7. Parallel Input/Output (I/O)

7.1 Contents

7.2 Introduction

In user mode, 20 lines (28-pin PDIP or 28-pin SOIC) or 24 lines (44-lead PLCC) are arranged as three 8-bit I/O ports. These ports are programmable as either inputs or outputs under software control of the data direction registers. NOTE: To avoid a glitch on the output pins, write data to the I/O port data register before writing a one to the corresponding data direction register.

7.3 Port A

Port A is an 8-bit bidirectional port which does not share any of its pins with other subsystems. The port A data register is at $0000 and the data direction register (DDR) is at $0004. Reset does not affect the data register, but clears the data direction register, thereby returning the ports to inputs. Writing a one to a DDR bit sets the corresponding port bit to output mode. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Parallel Input/Output (I/O) General Release Specification MC68HC705RC16 — Rev. 3.0 Parallel Input/Output (I/O)

7.4 Port B

Port B is an 8-bit bidirectional port which does not share any of its pins with other subsystems. The address of the port B data register is $0001 and the data direction register (DDR) is at address $0005. Reset does not affect the data register, but clears the data direction register, thereby returning the ports to inputs. Writing a one to a DDR bit sets the corresponding port bit to output mode. Each of the port B pins has a mask programmable pullup device that can be enabled. When the pullup device is enabled, this pin will also become an interrupt pin. The edge or edge and level sensitivity of theIRQ pin will also pertain to the enabled port B pins. Care needs to be taken when using port B pins that have the pullup enabled. Before switching from an output to an input, the data should be preconditioned to a logic one or the I bit should be set in the condition code register to prevent an interrupt from occurring. The EIMSK bit in the CMT MCSR register can be used to mask port B keyscan and external interrupts (IRQ). NOTE: When a port B pin is configured as an output, it’s corresponding keyscan interrupt is disabled, regardless of it’s MOR register setting. Figure 7-1. Port B Pullup Option

7.5 Port C

Port C is an 8-bit bidirectional port (PC0–PC7) which does not share any of its pins with other subsystems. The port C data register is at $0003 and the data direction register (DDR) is at $0006. Reset does not affect the data register, but clears the data direction register, thereby returning PB7 VDD VDD DDR BIT NORMAL PORT CIRCUITRY AS SHOWN IN FIGURE 7-2 IRQ TO INTERRUPT LOGIC MASK OPTION (PB7PU)DISABLED ENABLED FROM ALL OTHER PORT B PINS IRQEN Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Parallel Input/Output (I/O) Input/Output Programming MC68HC705RC16 — Rev. 3.0 General Release Specification Parallel Input/Output (I/O) NON-DISCLOSURE AGREEMENT REQUIRED the ports to inputs. Writing a one to a DDR bit sets the corresponding port bit to output mode. Port C pins PC4–PC7 are available only with the 44-lead PLCC package. NOTE: Only four bits of port C are bonded out in 28-pin packages for the MC68HC705RC16, although port C is truly an 8-bit port. Since pins PC4–PC7 are unbonded, software should include the code to set their respective data direction register locations to outputs to avoid floating inputs.

7.6 Input/Output Programming

Port pins may be programmed as inputs or outputs under software control. The direction of the pins is determined by the state of the corresponding bit in the port data direction register (DDR). Each I/O port has an associated DDR. Any I/O port pin is configured as an output if its corresponding DDR bit is set to a logic 1. A pin is configured as an input if its corresponding DDR bit is cleared to a logic 0. At power-on or reset, all DDRs are cleared, which configures all pins as inputs. The data direction registers are capable of being written to or read by the processor. During the programmed output state, a read of the data register actually reads the value of the output data latch and not the I/O pin. Table 7-1. I/O Pin Functions Access DDR I/O Pin Functions Write 0 The I/O pin is in input mode. Data is written into the output data latch. Write 1 Data is written into the output data latch and output to the I/O pin. Read 0 The state of the I/O pin is read. Read 1 The I/O pin is in an output mode. The output data latch is read. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Parallel Input/Output (I/O) General Release Specification MC68HC705RC16 — Rev. 3.0 Parallel Input/Output (I/O) Figure 7-2. I/O Circuitry DATA DIRECTION REGISTER BIT I/O PIN INPUT REG BIT INPUT I/O OUTPUT INTERNAL HC05 CONNECTIONS LATCHED OUTPUT DATA BIT Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Core Timer NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Section 8. Core Timer

8.1 Contents

8.2 Introduction

The core timer for this device is a 14-stage multifunctional ripple counter. Features include timer overflow, power-on reset (POR), real-time interrupt (RTI), and COP watchdog timer. As seen inFigure 8-1, the internal peripheral clock is divided by four, and then drives an 8-bit ripple counter. The value of this 8-bit ripple counter can be read by the CPU at any time by accessing the core timer counter register (CTCR) at address $09. A timer overflow function is implemented on the last stage of this counter, giving a possible interrupt rate of the internal peripheral clock (E)/1024. This point is then followed by three more stages, with the resulting clock (E/4096) driving the real-time interrupt circuit (RTI). The RTI circuit consists of three divider stages with a one-of-four selector. The output of the RTI circuit is further divided by eight to drive the mask optional COP watchdog timer circuit. The RTI rate selector bits and the RTI and CTOF enable bits and flags are located in the timer control and status register at location $08. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Core Timer General Release Specification MC68HC705RC16 — Rev. 3.0 Core Timer Figure 8-1. Core Timer Block Diagram COP CLEAR INTERNAL BUS $09 CORE TIMER COUNTER REGISTER (CTCR) 5-BIT COUNTER CTOF RTIF TOFE RTIE RT1 INTERRUPT CIRCUIT $08 RTI SELECT CIRCUIT STATUS REGISTERRT0 TIMER CONTROL & OVERFLOW CIRCUIT DETECT COP WATCHDOG TIMER (÷8) TO RESET LOGIC 8 8 RTFCTOFC E ÷ 210 TCBP CTCSR CTCR INTERNAL PERIPHERAL CLOCK (E) TO INTERRUPT LOGIC RTIOUT E ÷ 212 POR E ÷ 22 ÷ 4 E ÷ 215 E ÷ 214 E ÷ 213 E ÷ 212 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Core Timer Control and Status Register MC68HC705RC16 — Rev. 3.0 General Release Specification Core Timer NON-DISCLOSURE AGREEMENT REQUIRED

8.3 Core Timer Control and Status Register

The CTCSR contains the timer interrupt flag, the timer interrupt enable bits, and the real-time interrupt rate select bits.Figure 8-2 shows the value of each bit in the CTCSR when coming out of reset. CTOF — Core Timer Overflow CTOF is a read-only status bit set when the 8-bit ripple counter rolls over from $FF to $00. Clearing the CTOF is done by writing a one to TOFC. Writing to this bit has no effect. Reset clears CTOF. RTIF — Real-Time Interrupt Flag The real-time interrupt circuit consists of a 3-stage divider and a one-of-four selector. The clock frequency that drives the RTI circuit is E/212 (or E÷ 4096 with three additional divider stages, giving a maximum interrupt period of 16 milliseconds at a bus rate of 2.024 MHz. RTIF is a clearable, read-only status bit and is set when the output of the chosen (one-of-four selection) stage goes active. Clearing the RTIF is done by writing a one to RTFC. Writing has no effect on this bit. Reset clears RTIF. TOFE — Timer Overflow Enable When this bit is set, a CPU interrupt request is generated when the CTOF bit is set. Reset clears this bit. RTIE — Real-Time Interrupt Enable When this bit is set, a CPU interrupt request is generated when the RTIF bit is set. Reset clears this bit. Address: $08 Read: CTOF RTIF TOFE RTIE RT1 RT0 Write: TOFC RTFC Reset: 00000011 = Unimplemented Figure 8-2. Core Timer Control and Status Register (CTCSR) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Core Timer General Release Specification MC68HC705RC16 — Rev. 3.0 Core Timer TOFC — Timer Overflow Flag Clear When a one is written to this bit, CTOF is cleared. Writing a zero has no effect on the CTOF bit. This bit always reads as zero. RTFC — Real-Time Interrupt Flag Clear When a one is written to this bit, RTIF is cleared. Writing a zero has no effect on the RTIF bit. This bit always reads as zero. RT1 and RT0 — Real-Time Interrupt Rate Select These two bits select one of four taps from the real-time interrupt circuit. Refer toTable 8-1. Reset sets these two bits which selects the lowest periodic rate and gives the maximum time in which to alter these bits if necessary. Care should be taken when altering RT0 and RT1 if the timeout period is imminent or uncertain. If the selected tap is modified during a cycle in which the counter is switching, an RTIF could be missed or an additional one could be generated. To avoid problems, the COP should be cleared before changing RTI taps. Table 8-1. RTI and COP Rates at 4.096 MHz Oscillator RTI RATE 2.048-MHz Bus RT1:RT0 MINIMUM COP RATES 2.048-MHz Bus 2 ms 212 ÷E 00 (215–212)/E 14 ms 4 ms 213 ÷E 01 (216–213)/E 28 ms 8 ms 214 ÷E 10 (217–214)/E 56 ms 16 ms 215 ÷E 11 (218–215)/E 112 ms Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Core Timer Counter Register MC68HC705RC16 — Rev. 3.0 General Release Specification Core Timer NON-DISCLOSURE AGREEMENT REQUIRED

8.4 Core Timer Counter Register

The timer counter register is a read-only register that contains the current value of the 8-bit ripple counter at the beginning of the timer chain. This counter is clocked by the CPU clock (E/4) and can be used for various functions, including a software input capture. Extended time periods can be attained using the TOF function to increment a temporary RAM storage location, thereby simulating a 16-bit (or more) counter. The power-on cycle clears the entire counter chain and begins clocking the counter. After 4064 cycles, the power-on reset circuit is released, which again clears the counter chain and allows the device to come out of reset. At this point, ifRESET is not asserted, the timer starts counting up from zero and normal device operation begins. WhenRESET is asserted any time during operation (other than POR and low-power reset), the counter chain is cleared. Address: $09 Read: D7 D6 D5 D4 D3 D2 D1 D0 Write: Reset: 00000011 = Unimplemented Figure 8-3. Core Timer Counter Register (CTCR) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Core Timer General Release Specification MC68HC705RC16 — Rev. 3.0 Core Timer

8.5 Computer Operating Properly (COP) Reset

The COP watchdog timer function is implemented on this device by using the output of the RTI circuit and further dividing it by eight. The minimum COP reset rates are listed inTable 8-1. If the COP circuit times out, an internal reset is generated and the normal reset vector is fetched. Preventing a COP timeout or clearing the COP is accomplished by writing a zero to bit 0 of address $3FF0. When the COP is cleared, only the final divide-by-eight stage (output of the RTI) is cleared. If the COP watchdog timer is allowed to time out, an internal reset is generated to reset the MCU. The COP remains enabled after execution of the WAIT instruction and all associated operations apply. If the STOP instruction is disabled, execution of STOP instruction causes the CPU to execute a WAIT instruction. In addition, the COP is prohibited from being held in reset. This prevents a device lock-up condition. This COP’s objective is to make it impossible for this device to become stuck or locked-up and to be sure the COP is able to rescue the part from any situation where it might entrap itself in abnormal or unintended behavior. This function is a mask option.

8.6 Timer During Wait Mode

The CPU clock halts during wait mode, but the timer remains active. If interrupts are enabled, a timer interrupt will cause the processor to exit wait mode. The COP is always enabled while in user mode. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Carrier Modulator Transmitter (CMT) NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Section 9. Carrier Modulator Transmitter (CMT)

9.1 Contents

9.2 Introduction

The carrier modulator transmitter (CMT) module provides a means to generate the protocol timing and carrier signals for a wide variety of encoding schemes. It incorporates hardware to off-load the critical and/or lengthy timing requirements associated with code generation from the CPU, releasing much of its bandwidth to handle other tasks such as code data generation, data decompression, or keyboard scanning. The CMT does not include dedicated hardware configurations for specific protocols, but is intended to be sufficiently programmable in its function to handle the timing requirements of most protocols with minimal CPU intervention. When disabled, certain CMT registers can be Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Carrier Modulator Transmitter (CMT) General Release Specification MC68HC705RC16 — Rev. 3.0 Carrier Modulator Transmitter (CMT) used to change the state of the infrared out pin (IRO) directly. This feature allows for the generation of future protocols not readily producible by the current architecture.

9.3 Overview

The module consists of carrier generator, modulator, and transmitter output blocks. The block diagram is shown inFigure 9-1. The carrier generator has a resolution of 500 ns with a 2-MHz oscillator. The user may independently define the high and low times of the carrier signal to determine both period and duty cycle. The carrier generator can generate signals with periods between 1µs (1 MHz) and 64µs (15.6 kHz) in steps of 500 ns. The possible duty cycle options will depend upon the number of counts required to complete the carrier period. For example, a 400-kHz signal has a period of 2.5µs and will therefore require 5 x 500 ns counts to generate. These counts may be split between high and low times so the duty cycles available will be 20% (one high, four low), 40% (two high, three low), 60% (three high, two low) and 80% (four high, one low). For lower frequency signals with larger periods, higher resolution (as a percentage of the total period) duty cycles are possible. The carrier generator may select between two sets of high and low times. When operating in normal mode (subsequently referred to as time mode), just one set will be used. When operating in FSK (frequency shift key) mode, the generator will toggle between the two sets when instructed to do so by the modulator, allowing the user to dynamically switch between two carrier frequencies without CPU intervention. When the BASE bit in the modulator control and status register (MCSR) is set, the carrier output to the modulator is held high continuously to allow for the generation of baseband protocols. See9.4 Carrier Generator. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Carrier Modulator Transmitter (CMT) Overview MC68HC705RC16 — Rev. 3.0 General Release Specification Carrier Modulator Transmitter (CMT) NON-DISCLOSURE AGREEMENT REQUIRED Figure 9-1. Carrier Modulator Transmitter Module Block Diagram The modulator provides a simple method to control protocol timing. The modulator has a resolution of 4µs with a 2-MHz oscillator. It can count system clocks to provide real-time control or it can count carrier clocks for self-clocked protocols. It can either gate the carrier onto the modulator output (TIME), control the logic level of the modulator output (baseband) or directly route the carrier to the modulator output while providing a signal to switch the carrier generator between high/low time register buffers (FSK). See9.5 Modulator. The transmitter output block controls the state of the infrared out pin (IRO). The modulator output is gated on to the IRO pin when the modulator/carrier generator is enabled. Otherwise, the IRO pin is controlled by the state of the IRO latch, which is directly accessible to the CPU by means of bit 7 of the carrier generator data registers CHR1 and CLR1. The IRO latch can be written to on either edge of the internal bus clock (fosc/2), allowing for IR waveforms which have a resolution of twice the bus clock frequency (fosc). See9.4.2 Carrier Generator Data Registers (CHR1, CLR1, CHR2, and CLR2). fOSC CARRIER GENERATOR MODULATOR CARRIER OUT MODULATOR OUT MODULATOR/ TRANSMITTER OUTPUT BASE MODE PRIMARY/SECONDARY SELECT CPU INTERFACE IRO PIN EOC FLAG fOSC ÷2 DB AB EOC INTERRUPT EOC ENABLE INTERRUPT CARRIER ENABLE Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Carrier Modulator Transmitter (CMT) General Release Specification MC68HC705RC16 — Rev. 3.0 Carrier Modulator Transmitter (CMT)

9.4 Carrier Generator

The carrier signal is generated by counting a predetermined number of input clocks (500 ns for a 2-MHz oscillator) for both the carrier high time and the carrier low time. The period is determined by the total number of clocks counted. The duty cycle is determined by the ratio of high time clocks to total clocks counted. The high and low time values are user programmable and are held in two registers. An alternate set of high/low count values is held in another set of registers to allow the generation of dual frequency FSK (frequency shift keying) protocols without CPU intervention. The MCGEN bit in the MCSR must be set and the BASE bit in the MCSR must be cleared to enable carrier generator clocks. The block diagram is shown inFigure 9-2. Figure 9-2. Carrier Generator Block Diagram CLK 6-BIT UP COUNTER CLR CLOCK AND OUTPUT CONTROL PRIMARY HIGH COUNT REGISTER SECONDARY HIGH COUNT REGISTER COUNT REGISTER SELECT CONTROL MODE PRIMARY/ SELECT CARRIER OUT SECONDARY BASE fOSC MODULATOR/ CARRIER GENERATOR ENABLE PRIMARY LOW COUNT REGISTER SECONDARY LOW COUNT REGISTER Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Carrier Modulator Transmitter (CMT) Carrier Generator MC68HC705RC16 — Rev. 3.0 General Release Specification Carrier Modulator Transmitter (CMT) NON-DISCLOSURE AGREEMENT REQUIRED

9.4.1 Time Counter

The high/low time counter is a 6-bit up counter. After each increment, the contents of the counter are compared with the appropriate high or low count value register. When this value is reached, the counter is reset and the compare is redirected to the other count value register. Assuming that the high time count compare register is currently active, a valid compare will cause the carrier output to be driven low. The counter will continue to increment and when reaching the value stored in the selected low count value register, it will be cleared and will cause the carrier output to be driven high. The cycle repeats, automatically generating a periodic signal which is directed to the modulator. The lowest frequency (maximum period) and highest frequency (minimum period) which can be generated are defined below. fmin = fosc ÷(2 x (26 – 1)) Hz fmax = fosc ÷(2 x 1) Hz In the general case, the carrier generator output frequency is: fout = fosc ÷(Highcount + Lowcount) Hz Where: 0 <Highcount < 64 and 0 <Lowcount < 64 NOTE: These equations assume the DIV2 bit (bit 6) of the MCSR is clear. When the DIV2 bit is set, the carrier generator frequency will be half of what is shown in these equations. The duty cycle of the carrier signal is controlled by varying the ratio of high time to low + high time. As the input clock period is fixed, the duty cycle resolution will be proportional to the number of counts required to generate the desired carrier period. Duty Cycle Highcount Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Carrier Modulator Transmitter (CMT) General Release Specification MC68HC705RC16 — Rev. 3.0 Carrier Modulator Transmitter (CMT)

9.4.2 Carrier Generator Data Registers (CHR1, CLR1, CHR2, and CLR2)

The carrier generator contains two, 7-bit data registers: primary high time (CHR1), primary low time (CLR1); and two, 6-bit data registers: secondary high time (CHR2) and secondary low time (CLR2). Bit 7 of CHR1 and CHR2 is used to read and write the IRO latch. Address: $0010 Bit 7 654321 Bit 0 Read: IROLN 0 PH5 PH4 PH3 PH2 PH1 PH0 Write: Reset: 0 0 UUUUUU U = Unaffected Figure 9-3. Carrier Generator Data Register CHR1 Address: $0011 Bit 7 654321 Bit 0 Read: IROLP 0 PL5 PL4 PL3 PL2 PL1 PL0 Write: Reset: 0 0 UUUUUU U = Unaffected Figure 9-4. Carrier Generator Data Register CLR1 Address: $0012 Bit 7 654321 Bit 0 Read: 0 0 SH5 SH4 SH3 SH2 SH1 SH0 Write: Reset: 0 0 UUUUUU U = Unaffected Figure 9-5. Carrier Generator Data Register CHR2 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Carrier Modulator Transmitter (CMT) Carrier Generator MC68HC705RC16 — Rev. 3.0 General Release Specification Carrier Modulator Transmitter (CMT) NON-DISCLOSURE AGREEMENT REQUIRED PH0–PH5 and PL0–PL5 — Primary Carrier High and Low Time Data Values When selected, these bits contain the number of input clocks required to generate the carrier high and low time periods. When operating in time mode (see9.5.1 Time Mode), this register pair is always selected. When operating in FSK mode (see9.5.2 FSK Mode), this register pair and the secondary register pair are alternately selected under control of the modulator. The primary carrier high and low time values are undefined out of reset. These bits must be written to non-zero values before the carrier generator is enabled to avoid spurious results. NOTE: Writing to CHR1 to update PH0–PH5 or to CLR1 to update PL0–PL5 will also update the IRO latch. When MCGEN (bit 0 in the MCSR) is clear, the IRO latch value appears on the IRO output pin. Care should be taken that bit 7 of the data to be written to CHR1 or CHL1 should contain the desired state of the IRO latch. SH0–SH5 and SL0–SL5 — Secondary Carrier High and Low Time Data Values When selected, these bits contain the number of input clocks required to generate the carrier high and low time periods. When operating in time mode (see9.5.1 Time Mode), this register pair is never selected. When operating in FSK mode (see9.5.2 FSK Mode), this register pair and the secondary register pair are alternately selected under control Address: $0013 Bit 7 654321 Bit 0 Read: 0 0 SL5 SL4 SL3 SL2 SL1 SL0 Write: Reset: 0 0 UUUUUU U = Unaffected Figure 9-6. Carrier Generator Data Register CLR2 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Carrier Modulator Transmitter (CMT) General Release Specification MC68HC705RC16 — Rev. 3.0 Carrier Modulator Transmitter (CMT) of the modulator. The secondary carrier high and low time values are undefined out of reset. These bits must be written to non-zero values before the carrier generator is enabled when operating in FSK mode. IROLN and IROLP — IRO Latch Control Reading IROLN or IROLP reads the state of the IRO latch. Writing IROLN updates the IRO latch with the data being written on the negative edge of the internal processor clock (fosc/2). Writing IROLP updates the IRO latch on the positive edge of the internal processor clock; for example, one fosc period later. The IRO latch is clear out of reset. NOTE: Writing to CHR1 to update IROLN or to CLR1 to update IROLP will also update the primary carrier high and low data values. Care should be taken that bits 5–0 of the data to be written to CHR1 or CHL1 should contain the desired values for the primary carrier high or low data.

9.5 Modulator

The modulator consists of a 12-bit down counter with underflow detection which is loaded from the modulation mark period from the mark buffer register, MBUFF. When this counter underflows, the modulator gate is closed and a 12-bit comparator is enabled which continually compares the logical complement of the contents of the (still) decrementing counter with the contents of the modulation space period register, SREG. When a match is obtained, the modulator control gate is opened again. Should SREG = 0, the match will be immediate and no space period will be generated (for instance, for FSK protocols which require successive bursts of different frequencies). When the match occurs, the counter is reloaded with the contents of MBUFF, SREG is reloaded with the contents of its buffer, SBUFF, and the cycle repeats. The MCGEN bit in the MCSR must be set to enable the modulator timer. The 12-bit MBUFF and SBUFF registers are accessed through three 8-bit modulator period registers, MDR1, MDR2, and MDR3. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Carrier Modulator Transmitter (CMT) Modulator MC68HC705RC16 — Rev. 3.0 General Release Specification Carrier Modulator Transmitter (CMT) NON-DISCLOSURE AGREEMENT REQUIRED The modulator can operate in two modes, time or FSK. In time mode the modulator counts clocks derived from the system oscillator and modulates a single-carrier frequency or no carrier (baseband). In FSK mode, the modulator counts carrier periods and instructs the carrier generator to alternate between two carrier frequencies whenever a modulation period (mark + space counts) expires. Figure 9-7. Modulator Block Diagram COUNTER fOSC EOC FLAG MBUFF SBUFF SREG * 13-BIT DOWN COUNTER * * DENOTES HIDDEN REGISTER

12 BITS

□ 8 CLOCK CONTROL CARRIER OUT LOAD MBUFF/SBUFF SYSTEM CONTROL EOC FLAG SET MODULATOR GATE OUT PRIMARY/SECONDARY SELECT MODULATOR MODULATOR/ CARRIER GENERATOR. ENABLE EXTENDED SPACE DIV2 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Carrier Modulator Transmitter (CMT) General Release Specification MC68HC705RC16 — Rev. 3.0 Carrier Modulator Transmitter (CMT)

9.5.1 Time Mode

When the modulator operates in time mode, the modulation mark and space periods consist of zero or an integer number of fosc ÷8 clocks (= 250 kHz @ 2 MHz osc). This provides a modulator resolution of 4µs and a maximum mark and space periods of about 16 ms (each). However, to prevent carrier glitches which could affect carrier spectral purity, the modulator control gate and carrier clock are synchronized. The carrier signal is activated when the modulator gate opens. The modulator gate can only close when the carrier signal is low (the output logic level during space periods is low). If the carrier generator is in baseband mode (BASE bit in MCSR is high), the modulator output will be at a logic 1 for the duration of the mark period and at a logic 0 for the duration of a space period. SeeFigure 9-8. The mark and space time equations are: Setting the DIV2 bit in the MCSR will double mark and space times. tmark MBUFF 1+() 8× fosc tspace SBUFF 8× fosc Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Carrier Modulator Transmitter (CMT) Modulator MC68HC705RC16 — Rev. 3.0 General Release Specification Carrier Modulator Transmitter (CMT) NON-DISCLOSURE AGREEMENT REQUIRED Figure 9-8. CMT Operation in Time Mode

9.5.2 FSK Mode

When the modulator operates in FSK mode, the modulation mark and space periods consist of an integer number of carrier clocks (space period can be zero). When the mark period expires, the space period is transparently started (as in time mode); however, in FSK mode the carrier switches between data registers in preparation for the next mark period. The carrier generator toggles between primary and secondary data register values whenever the modulator mark period expires. The space period provides an interpulse gap (no carrier), but if SBUFF = 0, then the modulator and carrier generator will switch between carrier frequencies without a gap or any carrier glitches (zero space). Using timing data for carrier burst and interpulse gap length calculated by the CPU, FSK mode can automatically generate a phase-coherent, dual-frequency FSK signal with programmable burst and interburst gaps. MODULATOR GATE fOSC ÷8 TIME MODE OUTPUT BASEBAND OUTPUT MARK SPACE MARK MARK SPACE CARRIER FREQUENCY Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Carrier Modulator Transmitter (CMT) General Release Specification MC68HC705RC16 — Rev. 3.0 Carrier Modulator Transmitter (CMT) The mark and space time equations for FSK mode are: Where fcg is the frequency output from the carrier generator, setting the DIV2 bit in the MCSR will double mark and space times.

9.5.3 Extended Space Operation

In either time or FSK mode, the space period can be made longer than the maximum possible value of SBUFF. Setting the EXSPC bit in the MCSR will force the modulator to treat the next modulation period (beginning with the next load of MBUFF/SBUFF) as a space period equal in length to the mark and space counts combined. Subsequent modulation periods will consist entirely of these extended space periods with no mark periods. Clearing EXSPC will return the modulator to standard operation at the beginning of the next modulation period. To calculate the length of an extended space in time mode, use the equation: Where: the subscripts 1, 2, ... n refer to the modulation periods that elapsed while the EXSPC bit was set. tmark MBUFF 1+ fcg tspace SBUFF fcg ((SBUFF1)+(MBUFF 2+1+SBUFF 2) +... (MBUFFn+1+SBUFF n)) x8 fosc texspace = secs Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Carrier Modulator Transmitter (CMT) Modulator MC68HC705RC16 — Rev. 3.0 General Release Specification Carrier Modulator Transmitter (CMT) NON-DISCLOSURE AGREEMENT REQUIRED Similarly, to calculate the length of an extended space in FSK mode, use the equation: Where: fcg is the frequency output from the carrier generator. For an example of extended space operation, seeFigure 9-9. NOTE: The EXSPC feature can be used to emulate a zero mark event. Figure 9-9. Extended Space Operation

9.5.3.1 End Of Cycle (EOC) Interrupt

At the end of each cycle (when the counter is reloaded from MBUFF), the end of cycle (EOC) flag is set. If the interrupt enable bit was previously set, an interrupt will also be issued to the CPU. The EOC interrupt provides a means for the user to reload new mark/space values into the MBUFF and SBUFF registers. As the EOC interrupt is coincident with reloading the counter, MBUFF does not require additional buffering and may be updated with a new value for the next period from within the EOC interrupt service routine (ISR). To allow both mark and space period values to be updated from within the same ISR, SREG is buffered by SBUFF. The contents written to SBUFF are transferred to the active register SREG at the end of every cycle regardless of the state of the EOC flag. The EOC flag is cleared by a read of the modulator control and status register (MCSR) followed by an access of MDR2 or MDR3. The EOC flag must be cleared within the ISR to prevent another interrupt being generated after exiting the ISR. If the EOC interrupt is not being used (IE = 0), the EOC flag need not be cleared. ((SBUFF1)+(MBUFF 2+1+SBUFF 2)+... (MBUFFn+1+SBUFF n)) fcg texspace = secs SET EXSPC CLEAR EXSPC Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Carrier Modulator Transmitter (CMT) General Release Specification MC68HC705RC16 — Rev. 3.0 Carrier Modulator Transmitter (CMT)

9.5.3.2 Modulator Control and Status Register

The modulator control and status register (MCSR) contains the modulator and carrier generator enable (MCGEN), interrupt enable (IE), mode select (MODE), baseband enable (BASE), extended space (EXSPC), and external interrupt mask (EIMSK) control bits, divide-by-two prescaler (DIV2) bit, and the end of cycle (EOC) status bit. EOC — End Of Cycle Status Flag EOC is set when a match occurs between the contents of the space period register, SREG, and the down counter. This is recognized as the end of the modulation cycle. At this time, the counter is initialized with the (possibly new) contents of the mark period buffer, MBUFF, and the space period register, SREG, is loaded with the (possibly new) contents of the space period buffer, SBUFF. This flag is cleared by a read of the MCSR followed by an access of MDR2 or MDR3. The EOC flag is cleared by reset. 1 = End of modulator cycle (counter = SBUFF) has occurred 0 = Current modulation cycle in progress DIV2 — Divide-by-two prescaler The divide-by-two prescaler causes the CMT to be clocked at the bus rate when enabled; 2 x the bus rate when disabled (fosc). This bit is not double buffered and so should not be set during a transmission. 1 = Divide-by-two prescaler enabled 0 = Divide-by-two prescaler disabled Address: $14 Bit 7 654321 Bit 0 Read: EOC DIV2 EIMSK EXSPC BASE MODE IE MCGEN Write: Reset: 00000000 Unimplemented Figure 9-10. Modulator Control and Status Register (MCSR) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Carrier Modulator Transmitter (CMT) Modulator MC68HC705RC16 — Rev. 3.0 General Release Specification Carrier Modulator Transmitter (CMT) NON-DISCLOSURE AGREEMENT REQUIRED EIMSK — External Interrupt Mask The external interrupt mask bit is used to mask IRQ and keyscan interrupts. This bit is cleared by reset. 1 = IRQ and keyscan interrupts masked 0 = IRQ and keyscan interrupts enabled EXSPC — Extended Space Enable For a description of the extended space enable bit, see9.5.3 Extended Space Operation. This bit is cleared by reset. 1 = Extended space enabled 0 = Extended space disabled BASE — Baseband Enable When set, the BASE bit disables the carrier generator and forces the carrier output high for generation of baseband protocols. When BASE is clear, the carrier generator is enabled and the carrier output toggles at the frequency determined by values stored in the carrier data is not double buffered and should not be written to during a transmission. 1 = Baseband enabled 0 = Baseband disabled MODE — Mode Select For a description of CMT operation in time mode, see9.5.1 Time Mode . For a description of CMT operation in FSK mode, see9.5.2 FSK Mode . This bit is cleared by reset. This bit is not double buffered and should not be written to during a transmission. 1 = CMT operates in FSK mode. 0 = CMT operates in time mode. IE — Interrupt Enable A CPU interrupt will be requested when EOC is set if IE was previously set. If IE is clear, EOC will not request a CPU interrupt. 1 = CPU interrupt enabled 0 = CPU interrupt disabled Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Carrier Modulator Transmitter (CMT) General Release Specification MC68HC705RC16 — Rev. 3.0 Carrier Modulator Transmitter (CMT) MCGEN — Modulator and Carrier Generator Enable Setting MCGEN will initialize the carrier generator and modulator and will enable all clocks. Once enabled, the carrier generator and modulator will function continuously. When MCGEN is cleared, the current modulator cycle will be allowed to expire before all carrier and modulator clocks are disabled (to save power) and the modulator output is forced low. The user should initialize all data and control registers before enabling the system to prevent spurious operation. This bit is cleared by reset. 1 = Modulator and carrier generator enabled 0 = Modulator and carrier generator disabled Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Carrier Modulator Transmitter (CMT) Modulator MC68HC705RC16 — Rev. 3.0 General Release Specification Carrier Modulator Transmitter (CMT) NON-DISCLOSURE AGREEMENT REQUIRED

9.5.4 Modulator Period Data Registers (MDR1, MDR2, and MDR3)

The 12-bit MBUFF and SBUFF registers are accessed through three 8-bit registers: MDR1, MDR2, and MDR3. MDR2 and MDR3 contain the least significant eight bits of MBUFF and SBUFF respectively. MDR1 contains the two most significant nibbles of MBUFF and SBUFF. In many applications, periods greater than those obtained by eight bits will not be required. Dividing the registers in this manner allows the user to clear MDR1 and generate 8-bit periods with just two data writes. Address: $0015 Bit 7 654321 Bit 0 Read: MB11 MB10 MB9 MB8 SB11 SB10 SB9 SB8 Write: Reset: Unaffected by Reset Figure 9-11. Modulator Period Data Register MDR1 Address: $0016 Bit 7 654321 Bit 0 Read: MB7 MB6 MB5 MB4 MB3 MB2 MB1 MB0 Write: Reset: Unaffected by Reset Figure 9-12. Modulator Period Data Register MDR2 Address: $0017 Bit 7 654321 Bit 0 Read: SB7 SB6 SB5 SB4 SB3 SB2 SB1 SB0 Write: Reset: Unaffected by Reset Figure 9-13. Modulator Period Data Register MDR3 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Carrier Modulator Transmitter (CMT) General Release Specification MC68HC705RC16 — Rev. 3.0 Carrier Modulator Transmitter (CMT) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification EPROM NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Section 10. EPROM

10.1 Contents

10.2 Introduction

This section describes erasable programmable read-only memory (EPROM) programming.

10.3 EPROM

The user EPROM consists of 15,936 bytes of EPROM from $0180 to $3FAF and 14 bytes of user vectors from $3FF2 to $3FFF. The bootloader ROM and vectors are located from $3FB0 to $3FEF. Ten of the user vectors, $3FF6–$3FFF, are dedicated to reset and interrupt vectors. The four remaining locations, $3FF2–$3FF5, are general-purpose user EPROM locations. The mask option registers (MOR1 and MOR2) are located at $3FF0 and $3FF1. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED EPROM General Release Specification MC68HC705RC16 — Rev. 3.0 EPROM

10.4 Bootloader

This program (contained in an on-chip boot ROM) handles copying of user code from an external EPROM into the on-chip EPROM. The bootloader function does not have to be done from an external EPROM, but can be done from a host.

10.4.1 Bootloader Functions

Two pins are used to select the bootloader function. These pins are PC1 and PB5. PC1 is normally a SYNC pin, which is used to synchronize the MCU to an off-chip source that is driving EPROM data into the MCU. The programmer/host interface is shown inFigure 10-1. Figure 10-1. Programmer Interface to Host If an external EPROM is used, this pin (PC1) must be connected to VSS . PB5 is used to select between program/verify or verify-only modes. Two other pins, PB2 and IRO, are used to drive the VERF LED and the PROG LED respectively. The programming modes are shown inTable 10-1. The bootloader programming board shown inFigure 10-2 uses an external 12-bit counter to address the memory device containing the code to be copied. This counter requires a clock and a reset function. The 12-bit counter can address up to 4 Kbytes of memory, which means that two port pins have to be used to address the extra memory space. Table 10-1. Bootloader Functions PC1 PB5 Mode SYNC 1 Program/Verify SYNC 0 Verify Only CLK (OUT) SYNC (IN) DATA IN DATA READ Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification EPROM NON-DISCLOSURE AGREEMENT REQUIRED NOTE: The user code must be a one-to-one correspondence with the internal EPROM addresses. Figure 10-2. MC68HC705RC16 Programming Circuit VDD A10 A11 A12 Q10 Q11 Q12 CLKRST PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 MC14040B OSC1 OSC2 RESET PC1 (SYNC) IRO PB2 PB4 PB3 IRQ/VPP PROG VERF 2764 CE OE PB5 VDD VDD VDD VPP 15 pF 10 MW

4 MHz

NOTE: All resistors are 10 kΩ unless specified otherwise. 74LS04 VDD VDD 1 KW Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED EPROM General Release Specification MC68HC705RC16 — Rev. 3.0 EPROM

10.4.2 Programming Register

This register is used to program the EPROM array. Only the LATCH and EPGM bits are available in user mode. To program a byte of EPROM, set LATCH, then write data to the desired address, then set EPGM for tEPGM. LATCH — EPROM Latch Control READ: Any time WRITE: Any time 1 = EPROM address and data bus configured for programming. Causes address and data bus to be latched when a write to EPROM is done. EPROM cannot be read if LATCH = 1. 0 = EPROM address and data bus configured for normal reads EPGM — EPROM Program Control READ: Any time WRITE: Any time security is not set 1 = VPP switched on to the EPROM array. If LATCH = 1, EPGM switches programming power to the EPROM array. 0 = Programming power switched off the EPROM array Address: $001E Bit 7 654321 Bit 0 Read: RRRRR L A T C H R EPGM Write: Reset: 00000000 R = Reserved Figure 10-3. Programming Register (PROG) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification EPROM NON-DISCLOSURE AGREEMENT REQUIRED

10.4.3 Mask Option Registers (MOR1 and MOR2)

The mask option registers contain programmable EPROM bits to control mask options. The MOR register is latched at the end of reset and refreshed periodically depending on how often the EPROM is read. PBXPU — Port B Pullup (X is 7–0) When set, the PBPU bit enables the pullup on the corresponding port B pin. If the PBPU bit is cleared, the pullup devices are disabled. The erased state of the PBPU bit is to be cleared, thereby disabling the pullup devices. NOTE: The MOR registers are reset to zero during reset. This causes the port B pullup devices to become inactive until reset is completed. SECUR — SECURITY Enable 1 = This bit secures the EPROM by disabling a read of the EPROM in all modes other than user. This bit also disables writes to the MOR registers and the programming register. 0 = The EPROM can be read in all modes. Address: $3FF0 Bit 7 654321 Bit 0 Read: SECUR IRQ STOP COP Write: Reset: 00000000 = Unimplemented Figure 10-4. Mask Option Register 1 (MOR1) Address: $3FF1 Bit 7 654321 Bit 0 Read: PB7PU PB6PU PB5PU PB4PU PB3PU PB2PU PB1PU PB0PU Write: Reset: 00000000 Figure 10-5. Mask Option Register 2 (MOR2) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED EPROM General Release Specification MC68HC705RC16 — Rev. 3.0 EPROM STOP — STOP Enable 1 = This bit enables the STOP instruction. 0 = A STOP instruction is equivalent to a WAIT instruction. COP — COP Enable 1 = This bit enables the COP watchdog timer. 0 = The COP is disabled. IRQ — IRQ sensitivity 1 = This bit selects the edge- and level-sensitive IRQ. 0 = IRQ is edge-only sensitive. NOTE: The port B keyscan interrupt sensitivity will match that of the IRQ sensitivity. (See4.7 External Interrupt (IRQ/Port B Pullup) for more information.) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Instruction Set NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Section 11. Instruction Set

11.1 Contents

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Instruction Set General Release Specification MC68HC705RC16 — Rev. 3.0 Instruction Set

11.2 Introduction

The MCU instruction set has 62 instructions and uses eight addressing modes. The instructions include all those of the M146805 CMOS Family plus one more: the unsigned multiply (MUL) instruction. The MUL instruction allows unsigned multiplication of the contents of the accumulator (A) and the index register (X). The high-order product is stored in the index register, and the low-order product is stored in the accumulator.

11.3 Addressing Modes

The CPU uses eight addressing modes for flexibility in accessing data. The addressing modes provide eight different ways for the CPU to find the data required to execute an instruction. The eight addressing modes are:

• Inherent
• Immediate
• Direct
• Extended
• Indexed, no offset
• Indexed, 8-bit offset
• Indexed, 16-bit offset
• Relative Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Instruction Set NON-DISCLOSURE AGREEMENT REQUIRED

11.3.1 Inherent

Inherent instructions are those that have no operand, such as return from interrupt (RTI) and stop (STOP). Some of the inherent instructions act on data in the CPU registers, such as set carry flag (SEC) and increment accumulator (INCA). Inherent instructions require no operand address and are one byte long.

11.3.2 Immediate

Immediate instructions are those that contain a value to be used in an operation with the value in the accumulator or index register. Immediate instructions require no operand address and are two bytes long. The opcode is the first byte, and the immediate data value is the second byte.

11.3.3 Direct

Direct instructions can access any of the first 256 memory locations with two bytes. The first byte is the opcode, and the second is the low byte of the operand address. In direct addressing, the CPU automatically uses $00 as the high byte of the operand address.

11.3.4 Extended

Extended instructions use three bytes and can access any address in memory. The first byte is the opcode; the second and third bytes are the high and low bytes of the operand address. When using the Freescale assembler, the programmer does not need to specify whether an instruction is direct or extended. The assembler automatically selects the shortest form of the instruction. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Instruction Set General Release Specification MC68HC705RC16 — Rev. 3.0 Instruction Set

11.3.5 Indexed, No Offset

Indexed instructions with no offset are 1-byte instructions that can access data with variable addresses within the first 256 memory locations. The index register contains the low byte of the effective address of the operand. The CPU automatically uses $00 as the high byte, so these instructions can address locations $0000–$00FF. Indexed, no offset instructions are often used to move a pointer through a table or to hold the address of a frequently used RAM or I/O location.

11.3.6 Indexed, 8-Bit Offset

Indexed, 8-bit offset instructions are 2-byte instructions that can access data with variable addresses within the first 511 memory locations. The CPU adds the unsigned byte in the index register to the unsigned byte following the opcode. The sum is the effective address of the operand. These instructions can access locations $0000–$01FE. Indexed 8-bit offset instructions are useful for selecting the kth element in an n-element table. The table can begin anywhere within the first 256 memory locations and could extend as far as location 510 ($01FE). The k value is typically in the index register, and the address of the beginning of the table is in the byte following the opcode.

11.3.7 Indexed,16-Bit Offset

Indexed, 16-bit offset instructions are 3-byte instructions that can access data with variable addresses at any location in memory. The CPU adds the unsigned byte in the index register to the two unsigned bytes following the opcode. The sum is the effective address of the operand. The first byte after the opcode is the high byte of the 16-bit offset; the second byte is the low byte of the offset. Indexed, 16-bit offset instructions are useful for selecting the kth element in an n-element table anywhere in memory. As with direct and extended addressing, the Freescale assembler determines the shortest form of indexed addressing. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Instruction Set NON-DISCLOSURE AGREEMENT REQUIRED

11.3.8 Relative

Relative addressing is only for branch instructions. If the branch condition is true, the CPU finds the effective branch destination by adding the signed byte following the opcode to the contents of the program counter. If the branch condition is not true, the CPU goes to the next instruction. The offset is a signed, two’s complement byte that gives a branching range of –128 to +127 bytes from the address of the next location after the branch instruction. When using the Freescale assembler, the programmer does not need to calculate the offset, because the assembler determines the proper offset and verifies that it is within the span of the branch.

11.4 Instruction Types

The MCU instructions fall into the following five categories:

• Register/Memory Instructions
• Read-Modify-Write Instructions
• Jump/Branch Instructions
• Bit Manipulation Instructions
• Control Instructions Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Instruction Set General Release Specification MC68HC705RC16 — Rev. 3.0 Instruction Set

11.4.1 Register/Memory Instructions

These instructions operate on CPU registers and memory locations. Most of them use two operands. One operand is in either the accumulator or the index register. The CPU finds the other operand in memory. Table 11-1. Register/Memory Instructions Instruction Mnemonic Add Memory Byte and Carry Bit to Accumulator ADC Add Memory Byte to Accumulator ADD AND Memory Byte with Accumulator AND Bit Test Accumulator BIT Compare Accumulator CMP Compare Index Register with Memory Byte CPX EXCLUSIVE OR Accumulator with Memory Byte EOR Load Accumulator with Memory Byte LDA Load Index Register with Memory Byte LDX Multiply MUL OR Accumulator with Memory Byte ORA Subtract Memory Byte and Carry Bit from Accumulator SBC Store Accumulator in Memory STA Store Index Register in Memory STX Subtract Memory Byte from Accumulator SUB Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Instruction Set NON-DISCLOSURE AGREEMENT REQUIRED

11.4.2 Read-Modify-Write Instructions

These instructions read a memory location or a register, modify its contents, and write the modified value back to the memory location or to the register. NOTE: Do not use read-modify-write operations on write-only registers. 1. Unlike other read-modify-write instructions, BCLR and BSET use only direct addressing. 2. TST is an exception to the read-modify-write sequence be- cause it does not write a replacement value. Table 11-2. Read-Modify-Write Instructions Instruction Mnemonic Arithmetic Shift Left (Same as LSL) ASL Arithmetic Shift Right ASR Bit Clear BCLR (1) Bit Set BSET (1) Clear Register CLR Complement (One’s Complement) COM Decrement DEC Increment INC Logical Shift Left (Same as ASL) LSL Logical Shift Right LSR Negate (Two’s Complement) NEG Rotate Left through Carry Bit ROL Rotate Right through Carry Bit ROR Test for Negative or Zero TST (2) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Instruction Set General Release Specification MC68HC705RC16 — Rev. 3.0 Instruction Set

11.4.3 Jump/Branch Instructions

Jump instructions allow the CPU to interrupt the normal sequence of the program counter. The unconditional jump instruction (JMP) and the jump-to-subroutine instruction (JSR) have no register operand. Branch instructions allow the CPU to interrupt the normal sequence of the program counter when a test condition is met. If the test condition is not met, the branch is not performed. The BRCLR and BRSET instructions cause a branch based on the state of any readable bit in the first 256 memory locations. These 3-byte instructions use a combination of direct addressing and relative addressing. The direct address of the byte to be tested is in the byte following the opcode. The third byte is the signed offset byte. The CPU finds the effective branch destination by adding the third byte to the program counter if the specified bit tests true. The bit to be tested and its condition (set or clear) is part of the opcode. The span of branching is from –128 to +127 from the address of the next location after the branch instruction. The CPU also transfers the tested bit to the carry/borrow bit of the condition code register. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Instruction Set NON-DISCLOSURE AGREEMENT REQUIRED Table 11-3. Jump and Branch Instructions Instruction Mnemonic Branch if Carry Bit Clear BCC Branch if Carry Bit Set BCS Branch if Equal BEQ Branch if Half-Carry Bit Clear BHCC Branch if Half-Carry Bit Set BHCS Branch if Higher BHI Branch if Higher or Same BHS Branch ifIRQ Pin High BIH Branch ifIRQ Pin Low BIL Branch if Lower BLO Branch if Lower or Same BLS Branch if Interrupt Mask Clear BMC Branch if Minus BMI Branch if Interrupt Mask Set BMS Branch if Not Equal BNE Branch if Plus BPL Branch Always BRA Branch if Bit Clear BRCLR Branch Never BRN Branch if Bit Set BRSET Branch to Subroutine BSR Unconditional Jump JMP Jump to Subroutine JSR Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Instruction Set General Release Specification MC68HC705RC16 — Rev. 3.0 Instruction Set

11.4.4 Bit Manipulation Instructions

The CPU can set or clear any writable bit in the first 256 bytes of memory, which includes I/O registers and on-chip RAM locations. The CPU can also test and branch based on the state of any bit in any of the first 256 memory locations. Table 11-4. Bit Manipulation Instructions Instruction Mnemonic Bit Clear BCLR Branch if Bit Clear BRCLR Branch if Bit Set BRSET Bit Set BSET Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Instruction Set NON-DISCLOSURE AGREEMENT REQUIRED

11.4.5 Control Instructions

These instructions act on CPU registers and control CPU operation during program execution. Table 11-5. Control Instructions Instruction Mnemonic Clear Carry Bit CLC Clear Interrupt Mask CLI No Operation NOP Reset Stack Pointer RSP Return from Interrupt RTI Return from Subroutine RTS Set Carry Bit SEC Set Interrupt Mask SEI Stop Oscillator and EnableIRQ Pin STOP Software Interrupt SWI Transfer Accumulator to Index Register TAX Transfer Index Register to Accumulator TXA Stop CPU Clock and Enable InterruptsWAIT Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Instruction Set General Release Specification MC68HC705RC16 — Rev. 3.0 Instruction Set

11.5 Instruction Set Summary

Table 11-6. Instruction Set Summary Source Form Operation Description Effect on CCR Address Mode Opcode Operand CyclesHIN Z C ADC # opr ADC opr ADC opr ADC opr,X ADC opr,X ADC ,X IMM DIR EXT IX2 IX1 IX ii dd hh ll ee ff ff ADD # opr ADD opr ADD opr ADD opr,X ADD opr,X ADD ,X Add without Carry A ← (A) + (M) ↕×— ↕× ↕↕ IMM DIR EXT IX2 IX1 IX AB BB CB DB EB FB ii dd hh ll ee ff ff AND # opr AND opr AN D opr AND opr,X AND opr,X AND ,X IMM DIR EXT IX2 IX1 IX ii dd hh ll ee ff ff ASL opr ASLA ASLX ASL opr,X ASL ,X Arithmetic Shift Left (Same as LSL) — — ↕× ↕↕ DIR INH INH IX1 IX dd ff ASR opr ASRA ASRX ASR opr,X ASR ,X Arithmetic Shift Right — — ↕× ↕↕ DIR INH INH IX1 IX dd ff BCC rel Branch if Carry Bit Clear PC ← (PC) + 2 +rel ? C = 0 ————— R E L 2 4 r r 3 BCLR n opr Clear Bit n Mn ← 0 ————— DIR (b0) DIR (b1) DIR (b2) DIR (b3) DIR (b4) DIR (b5) DIR (b6) DIR (b7) dd dd dd dd dd dd dd dd BCS rel Branch if Carry Bit Set (Same as BLO) PC ← (PC) + 2 +rel ? C = 1 ————— R E L 2 5 r r 3 BEQ rel Branch if Equal PC ← (PC) + 2 +rel ? Z = 1 ————— R E L 2 7 r r 3 BHCC rel Branch if Half-Carry Bit Clear PC ← (PC) + 2 +rel ? H = 0 ————— R E L 2 8 r r 3 BHCS rel Branch if Half-Carry Bit Set PC ← (PC) + 2 +rel ? H = 1 ————— R E L 2 9 r r 3 BHI rel Branch if Higher PC ← (PC) + 2 +rel ? C∨ Z = 0 ————— R E L 2 2 r r 3 BHS rel Branch if Higher or Same PC ← (PC) + 2 +rel ? C = 0 ————— R E L 2 4 r r 3 C b0b7 b0b7 C Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Instruction Set NON-DISCLOSURE AGREEMENT REQUIRED BIH rel Branch if IRQ Pin High PC ← (PC) + 2 +rel ? IRQ = 1 ————— R E L 2 F r r 3 BIL rel Branch if IRQ Pin Low PC ← (PC) + 2 +rel ? IRQ = 0 ————— R E L 2 E r r 3 BIT #opr BIT opr BIT opr BIT opr,X BIT opr,X BIT ,X Bit Test Accumulator with Memory Byte (A) ∧ (M) — — ↕× ↕ — IMM DIR EXT IX2 IX1 IX ii dd hh ll ee ff ff BLO rel Branch if Lower (Same as BCS) PC ← (PC) + 2 +rel ? C = 1 ————— R E L 2 5 r r 3 BLS rel Branch if Lower orSame PC ← (PC) + 2 +rel ? C∨ Z = 1 ————— R E L 2 3 r r 3 BMC rel Branch if Interrupt Mask Clear PC ← (PC) + 2 +rel ? I = 0 ————— R E L 2 C r r 3 BMI rel Branch if Minus PC ← (PC) + 2 +rel ? N = 1 ————— R E L 2 B r r 3 BMS rel Branch if Interrupt Mask Set PC ← (PC) + 2 +rel ? I = 1 ————— R E L 2 D r r 3 BNE rel Branch if Not Equal PC ← (PC) + 2 +rel ? Z = 0 ————— R E L 2 6 r r 3 BPL rel Branch if Plus PC ← (PC) + 2 +rel ? N = 0 ————— R E L 2 A r r 3 BRA rel Branch Always PC ← (PC) + 2 +rel ? 1 = 1 ————— R E L 2 0 r r 3 BRCLR n opr relBranch if Bit n Clear PC ← (PC) + 2 +rel ? M n = 0 ———— ↕× DIR (b0) DIR (b1) DIR (b2) DIR (b3) DIR (b4) DIR (b5) DIR (b6) DIR (b7) dd rr dd rr dd rr dd rr dd rr dd rr dd rr dd rr BRN rel Branch Never PC ← (PC) + 2 +rel ? 1 = 0 ————— R E L 2 1 r r 3 BRSET n opr relBranch if Bit n Set PC ← (PC) + 2 +rel ? M n = 1 ———— × ↕ DIR (b0) DIR (b1) DIR (b2) DIR (b3) DIR (b4) DIR (b5) DIR (b6) DIR (b7) dd rr dd rr dd rr dd rr dd rr dd rr dd rr dd rr BSET n opr Set Bit n Mn ← 1 ————— DIR (b0) DIR (b1) DIR (b2) DIR (b3) DIR (b4) DIR (b5) DIR (b6) DIR (b7) dd dd dd dd dd dd dd dd BSR rel Branch to Subroutine PC ← (PC) + 2; push (PCL) SP ← (SP) – 1; push (PCH) SP ← (SP) – 1 PC ← (PC) +rel CLC Clear Carry Bit C ← 0 ———— 0 I N H 9 8 2 CLI Clear Interrupt Mask I ← 0 — 0 — — — INH 9A 2 Table 11-6. Instruction Set Summary (Continued) Source Form Operation Description Effect on CCR Address Mode Opcode Operand CyclesHIN Z C Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Instruction Set General Release Specification MC68HC705RC16 — Rev. 3.0 Instruction Set CLR opr CLRA CLRX CLR opr,X CLR ,X Clear Byte M ← $00 A ← $00 X ← $00 M ← $00 M ← $00 —— 0 1 — DIR INH INH IX1 IX dd ff CMP # opr CMP opr CMP opr CMP opr,X CMP opr,X CMP ,X Compare Accumulator with Memory Byte (A) – (M) — — ↕× ↕↕ IMM DIR EXT IX2 IX1 IX ii dd hh ll ee ff ff COM opr COMA COMX COM opr,X COM ,X Complement Byte (One’s Complement) M ← (M) = $FF – (M) A ← (A) = $FF – (A) X ← (X) = $FF – (X) M ← (M) = $FF – (M) M ← (M) = $FF – (M) DIR INH INH IX1 IX dd ff CPX #opr CPX opr CPX opr CPX opr,X CPX opr,X CPX ,X Compare Index Register with Memory Byte (X) – (M) — — ↕××↕ ×↕ IMM DIR EXT IX2 IX1 IX ii dd hh ll ee ff ff DEC opr DECA DECX DEC opr,X DEC ,X Decrement Byte M ← (M) – 1 A ← (A) – 1 X ← (X) – 1 M ← (M) – 1 M ← (M) – 1 DIR INH INH IX1 IX dd ff EOR # opr EOR opr EOR opr EOR opr,X EOR opr,X EOR ,X EXCLUSIVE OR Accumulator with Memory IMM DIR EXT IX2 IX1 IX ii dd hh ll ee ff ff INC opr INCA INCX INC opr,X INC ,X Increment Byte M ← (M) + 1 A ← (A) + 1 X ← (X) + 1 M ← (M) + 1 M ← (M) + 1 DIR INH INH IX1 IX dd ff JMP opr JMP opr JMP opr,X JMP opr,X JMP ,X Unconditional Jump PC ← Jump Address ————— DIR EXT IX2 IX1 IX BC CC DC EC FC dd hh ll ee ff ff Table 11-6. Instruction Set Summary (Continued) Source Form Operation Description Effect on CCR Address Mode Opcode Operand CyclesHIN Z C Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Instruction Set NON-DISCLOSURE AGREEMENT REQUIRED JSR opr JSR opr JSR opr,X JSR opr,X JSR ,X Jump to Subroutine PC ← (PC) + n (n = 1, 2, or 3) Push (PCL); SP← (SP) – 1 Push (PCH); SP← (SP) – 1 PC ← Effective Address DIR EXT IX2 IX1 IX BD CD DD ED FD dd hh ll ee ff ff LDA #opr LDA opr LDA opr LDA opr,X LDA opr,X LDA ,X Load Accumulator with Memory Byte A ← (M) — — ↕× ↕ — IMM DIR EXT IX2 IX1 IX ii dd hh ll ee ff ff LDX #opr LDX opr LDX opr LDX opr,X LDX opr,X LDX ,X Load Index Register with Memory Byte X ← (M) — — ↕× ↕×— IMM DIR EXT IX2 IX1 IX AE BE CE DE EE FE ii dd hh ll ee ff ff LSL opr LSLA LSLX LSL opr,X LSL ,X Logical Shift Left (Same as ASL) — — ↕× ↕↕ DIR INH INH IX1 IX dd ff LSR opr LSRA LSRX LSR opr,X LSR ,X Logical Shift Right — — 0 ↕↕ DIR INH INH IX1 IX dd ff MUL Unsigned Multiply X : A ← (X)× (A) 0 — — — 0 INH 42 11 NEG opr NEGA NEGX NEG opr,X NEG ,X Negate Byte (Two’s Complement) DIR INH INH IX1 IX dd ff NOP No Operation ————— I N H 9 D 2 ORA # opr ORA opr ORA opr ORA opr,X ORA opr,X ORA ,X Logical OR Accumulator with Memory A ← (A)∨ (M) — — ↕× ↕ — IMM DIR EXT IX2 IX1 IX AA BA CA DA EA FA ii dd hh ll ee ff ff ROL opr ROLA ROLX ROL opr,X ROL ,X Rotate Byte Left through Carry Bit — — ↕× ↕↕ DIR INH INH IX1 IX dd ff Table 11-6. Instruction Set Summary (Continued) Source Form Operation Description Effect on CCR Address Mode Opcode Operand CyclesHIN Z C C b0b7 b0b7 C b0b7 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Instruction Set General Release Specification MC68HC705RC16 — Rev. 3.0 Instruction Set ROR opr RORA RORX ROR opr,X ROR ,X Rotate Byte Right through Carry Bit — — ↕× ↕↕ DIR INH INH IX1 IX dd ff RSP Reset Stack Pointer SP ← $00FF ————— I N H 9 C 2 RTI Return from Interrupt SP ← (SP) + 1; Pull (CCR) SP ← (SP) + 1; Pull (A) SP ← (SP) + 1; Pull (X) SP ← (SP) + 1; Pull (PCH) SP ← (SP) + 1; Pull (PCL) RTS Return from Subroutine SP ← (SP) + 1; Pull (PCH) SP ← (SP) + 1; Pull (PCL)————— I N H 8 1 6 SBC #opr SBC opr SBC opr SBC opr,X SBC opr,X SBC ,X Subtract Memory Byte and Carry Bit from IMM DIR EXT IX2 IX1 IX ii dd hh ll ee ff ff SEC Set Carry Bit C ← 1 ———— 1 I N H 9 9 2 SEI Set Interrupt Mask I ← 1 — 1 — — — INH 9B 2 STA opr STA opr STA opr,X STA opr,X STA ,X Store Accumulator in Memory M ← (A) — — ↕× ↕ — DIR EXT IX2 IX1 IX dd hh ll ee ff ff STOP Stop Oscillator and Enable IRQ Pin — 0 — — — INH 8E 2 STX opr STX opr STX opr,X STX opr,X STX ,X Store Index Register In Memory M ← (X) — — ↕× ↕ — DIR EXT IX2 IX1 IX BF CF DF EF FF dd hh ll ee ff ff SUB #opr SUB opr SUB opr SUB opr,X SUB opr,X SUB ,X Subtract Memory Byte from Accumulator A ← (A) – (M) — — ↕↕↕ IMM DIR EXT IX2 IX1 IX ii dd hh ll ee ff ff SWI Software Interrupt PC ← (PC) + 1; Push (PCL) SP ← (SP) – 1; Push (PCH) SP ← (SP) – 1; Push (X) SP ← (SP) – 1; Push (A) SP ← (SP) – 1; Push (CCR) SP ← (SP) – 1; I← 1 PCH ← Interrupt Vector High Byte PCL ← Interrupt Vector Low Byte — 1 — — — INH 83 10 TAX Transfer Accumulator to Index Register X ← ( A ) ————— I N H 9 7 2 Table 11-6. Instruction Set Summary (Continued) Source Form Operation Description Effect on CCR Address Mode Opcode Operand CyclesHIN Z C b0b7 C Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Instruction Set NON-DISCLOSURE AGREEMENT REQUIRED TST opr TSTA TSTX TST opr,X TST ,X Test Memory Byte for Negative or Zero (M) – $00 — — ↕↕ — DIR INH INH IX1 IX dd ff TXA Transfer Index Register to Accumulator A ← ( X ) ————— I N H 9 F 2 WAIT Stop CPU Clock and Enable Interrupts — 0× — — — INH 8F 2 A Accumulator opr Operand (one or two bytes) C Carry/borrow flag PC Program counter CCR Condition code register PCH Program counter high byte dd Direct address of operand PCL Program counter low byte dd rr Direct address of operand and relative offset of branch instruction REL Relative addressing mode DIR Direct addressing mode rel Relative program counter offset byte ee ff High and low bytes of offset in indexed, 16-bit offset addressing rr Relative program counter offset byte EXT Extended addressing mode SP Stack pointer ff Offset byte in indexed, 8-bit offset addressing X Index register H Half-carry flag Z Zero flag hh ll High and low bytes of operand address in extended addressing # Immediate value I Interrupt mask ∧ Logical AND ii Immediate operand byte ∨ Logical OR IMM Immediate addressing mode ⊕ Logical EXCLUSIVE OR INH Inherent addressing mode ( ) Contents of IX Indexed, no offset addressing mode –( ) Negation (two’s complement) IX1 Indexed, 8-bit offset addressing mode ← Loaded with IX2 Indexed, 16-bit offset addressing mode ? If M Memory location : Concatenated with N Negative flag ↕ Set or cleared n Any bit — Not affected Table 11-6. Instruction Set Summary (Continued) Source Form Operation Description Effect on CCR Address Mode Opcode Operand CyclesHIN Z C Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification MC68HC705RC16 — Rev. 3.0 Instruction Set Instruction SetTable 11-7. Opcode Map Bit Manipulation Branch Read-Modify-Write Control Register/Memory DIR DIR REL DIR INH INH IX1 IX INH INH IMM DIR EXT IX2 IX1 IX

0123456789 ABCDEF

3 DIR

2 DIR

2 REL

1 INH

2 IX1

2 IMM

3 EXT

3 IX2

A BRSET5 A B BRCLR5 B C BRSET6 C D BRCLR6 D E BRSET7 E F BRCLR7 F INH = Inherent REL = Relative IMM = Immediate IX = Indexed, No Offset DIR = Direct IX1 = Indexed, 8-Bit Offset EXT = Extended IX2 = Indexed, 16-Bit Offset

0 MSB of Opcode in Hexadecimal

LSB of Opcode in Hexadecimal 0 BRSET0 Number of Bytes/Addressing Mode LSB MSB LSB MSB LSB MSB Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Electrical Specifications NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Section 12. Electrical Specifications

12.1 Contents

12.2 Introduction

This section contains the electrical and timing specifications. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Electrical Specifications General Release Specification MC68HC705RC16 — Rev. 3.0 Electrical Specifications

12.3 Maximum Ratings

Maximum ratings are the extreme limits to which the MCU can be exposed without permanently damaging it. The MCU contains circuitry to protect the inputs against damage from high static voltages; however, do not apply voltages higher than those shown in the table below. Keep VIN and VOUT within the range VSS ≤ (VIN or VOUT )≤ VDD . Connect unused inputs to the appropriate voltage level, either VSS or VDD . NOTE: This device is not guaranteed to operate properly at the maximum ratings. Refer to12.6 DC Electrical Characteristics (5.0 Vdc) and12.7 conditions. Rating Symbol Value Unit Supply Voltage V DD –0.3 to +7.0 V Bootloader Mode (IRQ/VPP Pin Only) V IN VSS –0.3 to 2 x VDD + 0.3 V Current Drain Per Pin Excluding VDD and VSS I2 5 m A Operating Junction Temperature T J +150 °C Storage Temperature Range T stg –65 to +150 °C Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Operating Temperature Range MC68HC705RC16 — Rev. 3.0 General Release Specification Electrical Specifications NON-DISCLOSURE AGREEMENT REQUIRED

12.4 Operating Temperature Range

12.5 Thermal Characteristics

Characteristic Symbol Value Unit Operating Temperature Range Standard TA TL to TH 0 to +70 °C Characteristic Symbol Value Unit Thermal Resistance Plastic Dual In-Line Package Small Outline Intergrated Circuit Package Plastic Leaded Chip Carrier Package θJA °C/W Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Electrical Specifications General Release Specification MC68HC705RC16 — Rev. 3.0 Electrical Specifications 12.6 DC Electrical Characteristics (5.0 Vdc) Characteristic Symbol Min Typ Max Unit Output Voltage ILOAD = 10.0 µA ILOAD = -10.0µA VOL VOH VDD – 0.1 0.1 V Output High Voltage (ILOAD –2.0 mA) Port A, Port B, Port C (1–7) (ILOAD –15 mA) IRO (ILOAD –4.0 mA) Port C (Bit 0) VOH VDD –0.8 VDD –0.7 VDD –0.8 VDD –0.2 VDD –0.2 VDD –0.2 V Output Low Voltage (ILOAD = 3.0 mA) Port A, Port B, Port C (1–7) (ILOAD = 25.0 mA) IRO (ILOAD = 20.0 mA) Port C (Bit 0) VOL 0.2 0.2 0.2 0.4 0.8 0.4 V Input High Voltage Port A, Port B, Port C,IRQ,RESET, LPRST, OSC1 VIH 0 . 7xVDD —V DD V Input Low Voltage Port A, Port B, Port C,IRQ,RESET, LPRST, OSC1 VIL VSS — 0.2 x V DD V EPROM Programming Voltage V 14.5 — 15.5 V Supply Current (see Notes) Run Wait Stop 25 oC 0 to +70oC IDD 3.8 0.5 0.3 5.0 1.2 mA mA µA µA I/O Ports Hi-Z Leakage Current Port A, Port B, Port C IOZ –10 — 10 µA Input Current RESET, LPRST,IRQ, OSC1 PB0–PB7 with Pullups Enabled (VIN = 0.2 x VDD )8 PB0–PB7 with Pullups Enabled (VIN = 0.7 x VDD ) IIN –100 –50 –330 –120 –700 –300 µA Capacitance Ports (as Input or Output) RESET, LPRST, IRQ C OUT C INT pF NOTES: 1. V DD = 5.0 Vdcž ±10%, VSS = 0 Vdc, TA = 0°C to +70°C, unless otherwise noted 2. Typical values at midpoint of voltage range, 25°C, only represent average measurements 3. Wait IDD : only core timer active 4. Run (Operating) IDD , wait IDD : Measured using external square wave clock source (fO sc = 4.2 MHz); all inputs 0.2 V from rail; no dc loads; less than 50 pF on all outputs; CL = 20 pF on OSC2 5. Wait, Stop IDD : port A and port C configured as inputs, port B configured as outputs. VIL = 0.2 V, VIH = VDD –0.2 V 6. Stop IDD is measured with OSC1 = VSS . 7. Wait IDD is affected linearly by the OSC2 capacitance. 8. Pullups are designed to be capable of pulling to VIH within 1µs for a 100 pF, 4-kΩ load Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Electrical Specifications NON-DISCLOSURE AGREEMENT REQUIRED 12.7 DC Electrical Characteristics (3.3 Vdc) Characteristic Symbol Min Typ Max Unit Output Voltage ILOAD = 10.0 µA ILOAD = –10.0µA VOL VOH VDD – 0.1 0.1 V Output High Voltage (ILOAD –0.6 mA) Port A, Port B, Port C (1–7) (ILOAD –10.0 mA) IRO (ILOAD –1.2 mA) Port C (Bit 0) VOH VDD – 0.3 VDD – 0.7 VDD – 0.3 VDD – 0.1 VDD – 0.1 VDD – 0.1 V Output Low Voltage (ILOAD = 1.0 mA) Port A, Port B, Port C (1–7) (ILOAD = 8.0 mA) IRO (ILOAD = 7.0 mA) Port C (Bit 0) VOL 0.1 0.1 0.1 0.3 0.8 0.3 V Input High Voltage Port A, Port B, Port C,IRQ,RESET, LPRST, OSC1 VIH 0.7 x VDD —V DD V Input Low Voltage Port A, Port B, Port C,IRQ,RESET, LPRST, OSC1 VIL VSS — 0.4 x V DD V EPROM Programming Voltage V 14.5 — 15.5 V Supply Current (see Notes) Run Wait Stop 25 oC 0 to +70oC IDD 1.8 0.33 0.1 0.1 3.0 0.8 4.0 8.0 mA mA µA µA I/O Ports Hi-Z Leakage Current Port A, Port B, Port C IOZ –4 — 4 µA Input Current RESET, LPRST,IRQ, OSC1 PB0-PB7 with pullups enabled (VIN = 0.4 x VDD )8 PB0-PB7 with pullups enabled (VIN = 0.7 x VDD ) IIN –0.4 –25 –15 –80 –50 0.4 –105 –65 µA Capacitance Ports (as Input or Output) RESET, LPRST, IRQ C OUT C INT pF NOTES: 1. V DD = 3.3 Vdc ±10%, VSS = 0 Vdc, TL = 0°C to +70°C, unless otherwise noted 2. Typical values at midpoint of voltage range, 25°C, only represent average measurements. 3. Wait IDD : only core timer active 4. Run (Operating) IDD , wait IDD : Measured using external square wave clock source (fO sc = 4.2 MHz); all inputs 0.2 V from rail; no dc loads; less than 50 pF on all outputs; CL = 20 pF on OSC2 5. Wait, Stop IDD : port A and port C configured as inputs, port B configured as outputs. VIL = 0.2 V, VIH = VDD –0.2 V 6. Stop IDD is measured with OSC1 = VSS . 7. Wait IDD is affected linearly by the OSC2 capacitance. 8. Pullups are designed to be capable of pulling to VIH within 25µs for a 100 pF, 4-kΩ load Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Electrical Specifications General Release Specification MC68HC705RC16 — Rev. 3.0 Electrical Specifications 12.8 Control Timing (5.0 Vdc and 3.3 Vdc) Characteristic Symbol Min Max Unit Frequency of Operation Crystal External Clock fosc — dc 4.2 4.2 MHz Internal Operating Frequency Crystal (fOSC /2) External Clock (fOSC /2) fop — dc 2.1 2.1 MHz Cycle Time t cyc 480 — ns Crystal Oscillator Startup Time t OXOV — 100 ms Stop Recovery Startup Time (Crystal Oscillator) t ILCH — 100 ms RESET Pulse Width t RL 1.5 — t cyc Interrupt Pulse Width Low (Edge-Triggered) t ILIH 125 — ns Interrupt Pulse Period t ILIL Note 2 — t cyc OSC1 Pulse Width t OH , tOL 90 — ns EPROM Byte Programming Time t EPGM — 10.0 ms NOTES: 1. VDD = 3.0 to 5.5 Vdc, VSS = 0 Vdc, TA = 0oC to +70oC, unless otherwise noted 2. The minimum period, tILIL, should not be less than the number of cycle times it takes to execute the interrupt service routine plus 19 tCYC . Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification Mechanical Specifications NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Section 13. Mechanical Specifications

13.1 Contents

13.4 28-Pin Small Outline Integrated 13.5 44-Pin Plastic Leaded Chip Carrier

13.2 Introduction

This section describes the dimensions of the dual-in-line package (DIP), small outline integrated circuit (SOIC) MCU package, and the plastic leaded chip carrier (PLCC) package. The following figures show the latest packages at the time of this publication. To make sure that you have the latest package specifications, contact one of the following:

• Local Freescale Sales Office Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Mechanical Specifications General Release Specification MC68HC705RC16 — Rev. 3.0 Mechanical Specifications 13.3 28-Pin Plastic Dual In-Line Package (Case 710-02) 13.4 28-Pin Small Outline Integrated Circuit Package (Case 751F-04) /C0052 /C0052 /C0077/C0073 /C0077/C0073/C0077 /C0077 /C0077/C0073 /C0073/C0077 /C0073 /C0073/C0077 /C0051 /C0052 /C0051/C0055 /C0051/C0052 /C0051 /C0051/C0055 /C0052 /C0051 /C0051/C0052/C0051 /C0052/C0051 /C0052 /C0052 /C0052 /C0052 /C0051 /C0052 /C0074 /C0077 %%! $"! /C0051 11 4 1528 B A C N K M J D /C0073 F HG L /C0077/C0073 /C0077/C0073/C0077 /C0077 /C0077/C0073 /C0073/C0077 /C0073 /C0073/C0077 /C0074 /C0077 /C0055 /C0055/C0052 /C0051 /C0051 /C0052 /C0051 /C0051 /C0055 /C0052 /C0051 /C0055 /C0055 /C0051 /C0052 /C0051 /C0055 /C0052 /C0051 /C0051 /C0052 /C0055 /C0089/C0052 /C0051 /C0052 $" /C0051 !$"! -A- -B- 11 4 1528 -T- C /C0073 M J -T- K 26X G 28X D 14X P R X 45° F Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

44-Pin Plastic Leaded Chip Carrier Package (Case 777-02) MC68HC705RC16 — Rev. 3.0 General Release Specification Mechanical Specifications NON-DISCLOSURE AGREEMENT REQUIRED 13.5 44-Pin Plastic Leaded Chip Carrier Package (Case 777-02) -N- -L- -M- DY D K V W144 BRK B Z U X VIEW D-D SL-MM0.007(0.180) N ST SL-MM0.007(0.180) N ST SL-MS0.010 (0.25) N ST F H SL-MM0.007(0.180) N ST Z G R A E J VIEW S C SL-MM0.007(0.180) N ST SL-MM0.007(0.180) N ST 0.004 (0.10) -T- SEATING PLANE VIEW S DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.685 0.695 17.40 17.65 B 0.685 0.695 17.40 17.65 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 0.51 K 0.025 0.64 R 0.650 0.656 16.51 16.66 U 0.650 0.656 16.51 16.66 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Y 0.020 0.50 Z 2° 10° G1 0.610 0.630 15.50 16.00 K1 0.040 1.02 SL-MS0.010 (0.25) N ST SL-MM0.007(0.180) N ST 2° 10° NOTES: 1. DATUMS -L-, -M-, AND -N- ARE DETERMINED WHERE TOP OF LEAD SHOLDERS EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSION R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.25) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF THE MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMINSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTUSION(S) SHALL NOT CAUSE THE H DIMINSION TO BE GREATER THAN 0.037 (0.940116). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMINISION TO SMALLER Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED Mechanical Specifications General Release Specification MC68HC705RC16 — Rev. 3.0 Mechanical Specifications Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MC68HC705RC16 — Rev. 3.0 General Release Specification

Ordering Information

NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification — MC68HC705RC16 Section 14. Ordering Information

14.1 Contents

14.2 Introduction

This section contains ordering instructions for the MC68HC705RC16.

14.3 Ordering Information

Table 14-1 provides information in determing order numbers. Table 14-1. MC Order Numbers Package Type Operating Temperature Range MC Order Number 28-Pin Plastic Dual In-Line 28-Pin Small Outline Integrated Circuit 44-Lead Plastic Leaded Chip Carrier Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NON-DISCLOSURE AGREEMENT REQUIRED General Release Specification MC68HC705RC16 — Rev. 3.0 iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...