ICS671-01 RENESAS | Alldatasheet

Document overview

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Technical content

Features

  • Packaged in 16 pin SOIC
  • Pb (lead) free package, RoHS compliant
  • Clock outputs from 5 to 160 MHz
  • Zero input-output delay
  • Integrated x2 or x4 selections, and x5 for CLK7
  • Eight low-skew (<250 ps) outputs
  • Full CMOS outputs with 25 mA output drive capability at TTL le vels
  • Tri-state mode for board-level testing
  • Advanced, low power, sub-micron CMOS process
  • Operating voltage of 3.3V or 5V Block Diagram CLK4 CLK5 CLK3 CLK6 CLK7 CLK2 CLK1 CLK8Control LogicS1, S0 x2, x4, or x5 PLL CLKIN FBIN VDD GND

ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER ZDB AND MULTIPLIER IDT™ / ICS™ ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER 2 ICS671-01 REV F 051310 Pin Assignment Output Clock Mode Select Table Note 1. Outputs are in high impedence state Note 2: In S1:S0 = 01 Mode, only the x1 output on CLK 8 will be zero delay. The x2 and x5 outputs can power-up in different states so the skew relationship is not defined. Pin Descriptions CLKIN FBIN CLK1 CLK2 CLK8 VDD CLK7 GND CLK3 VDD GND CLK6 CLK4 CLK5 S0 S1 16 pin narrow (150 mil) SOIC S1 S0 CLK1:6 CLK7 CLK8 Input Range 0 0 Tri-state (note 1) Tri-state (note 1) Tri-state (note 1) - 0 1 x2 (note 2) x5 (note 2) x1 5 to 30 MHz 1 0 x2 x2 x2 15 to 80 MHz 1 1 x4 x4 x4 7.5 to 40 MHz Pin Number Pin Name Pin Type Pin Description 1 CLKIN Input Clock input. 2-3, 6-7, 10-11 CLK1:6 Output Clock outputs 1:6. See table above. 4 VDD Power Power supply. Connect both pins to the same voltage (either 3.3V or 5V). 5 GND Power Connect to ground. 8 S0 Input Select input 0. See table above. 9 S1 Input Select input 1. See table above. 12 GND Power Connect to ground. 13 VDD Power Power supply. Connect both pins to the same voltage (either 3.3V or 5V). 14 CLK7 Output Clock output 7. See table above. 15 CLK8 Output Clock output 8. See table above. Normally use this clock as feedback. 16 FBIN Input Feedback input. Connect to CLK8 under normal operations.

ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER ZDB AND MULTIPLIER IDT™ / ICS™ ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER 3 ICS671-01 REV F 051310 External Components The ICS671-01 requires a minimum number of external components for proper operation. Decoupling capacitors of 0.01mF should be connected between VDD and GND on pins 4 and 5, and VDD and GND on pins 13 and 12, as close to the device as possible. A series termination resistor of 33Ω may be used to each clock output pin to reduce reflections. Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS671-01. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Recommended Operation Conditions VDD=3.3V ±10%, Ambient temperature 0 to +70° C, unless stated otherwise Item Rating Supply Voltage, VDD 7V All Inputs and Outputs -0.5V to VDD+0.5V CLKIN and FBIN inputs -0.5V to 5.5V Electrostatic Discharge 2000 V Ambient Operating Temperature 0 to +70 ° C Storage Temperature -65 to +150 ° C Junction Temperature 150 ° C Soldering Temperature 260 ° C Parameter Min. Typ. Max. Units Ambient Operating Temperature 0 +70 ° C Power Supply Voltage (measured in respect to GND) +3.13 +5.50 V Parameter Symbol Conditions Min. Typ. Max. Units Operating Voltage VDD 3.13 5.5 V Input High Voltage V IH CLKIN VDD/2+1 VDD/2 V Input Low Voltage V IL CLKIN VDD/2 VDD/2-1 V Input High Voltage V IH 2V Input Low Voltage V IL 0.8 V Input Low Current I IL VIN = 0V 50 µA Input High Current I IH VIN = VDD 100 µA Output High Voltage V OH IOH = -25 mA 2.4 V

ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER ZDB AND MULTIPLIER IDT™ / ICS™ ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER 4 ICS671-01 REV F 051310 VDD = 3.3V ±10%, Ambient Temperature 0 to +70° C, CLOAD at CLK = 15 pF, unless stated otherwise Note 1: With CLKIN = 20 MHz, FBIN to CLK8, all outputs at 40 MHz. Note 2:With CLKIN = 80 MHz, FBIN to CLK8, all outputs at 160 MHz. Note 3: These specs do not apply to mode 01. Thermal Characteristics (16 pin SOIC) Ouput Low Voltage V OL IOL = 25mA 0.4 V Output High Voltage, CMOS level VOH IOH = -8 mA VDD-0.4 V Operating Supply Current IDD No Load, S1 = 1, S0 = 0, Note 1 25 mA No Load, S1 = 1, S0 =0 Note 2 Power Down Supply Current IDDPD CLKIN = 0, S0 = 0, S1 = 0 500 µA Short Circuit Current I OS Each output ±50 mA Input Capacitance C IN S0, S1, FBIN 7 pF Parameter Symbol Conditions Min. Typ. Max. Units Parameter Symbol Conditions Min. Typ. Max. Units Input Clock Frequency f IN See table on page 2 5 80 MHz Output Clock Frequency See table on page 2 5 160 MHz Output Rise Time t OR 0.8 to 2.0V, CL=30 pF 1.5 ns Output Fall Time t OF 2.0 to 0.8V, CL=30 pF 1.5 ns Output Clock Duty Cycle t DC measured at VDD/2 40 50 60 % Device to Device Skew rising edges at VDD/2, Note 3 700 ps Output to Output Skew rising edges at VDD/2, Note 3 250 ps Input to Output Skew rising edges at VDD/2, FBIN to CLK8 ±350 ps Maximum Absolute JItter 15 pF 300 ps Cycle to Cycle Jitter 30 pF loads 500 ps PLL Lock Time Note 3 1.0 ms Parameter Symbol Conditions Min. Typ. Max. Units Thermal Resistance Junction to Ambient θJA Still air 120 ° C/W θJA 1 m/s air flow 115 ° C/W θJA 3 m/s air flow 105 ° C/W Thermal Resistance Junction to Case θJC 58 ° C/W

ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER ZDB AND MULTIPLIER IDT™ / ICS™ ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER 5 ICS671-01 REV F 051310 Package Outline and Package Dimensions (16 pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95

Ordering Information

"LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. Part / Order Number Marking Shipping Packaging Package Temperature 671M-01LF ICS671M-01LF Tubes 16-pin SOIC 0 to +70 ° C 671M-01LFT ICS671M-01LF Tape and Reel 16-pin SOIC 0 to +70 ° C INDEX AREA 1 2 D E SEATING PLANE A e - C - B .10 (.004) C C L H h x 45 Millimeters Inches Symbol Min Max Min Max A 1.35 1.75 .0532 .0688 A1 0.10 0.25 .0040 .0098 B 0 . 3 30 . 5 1. 0 1 3. 0 2 0 C 0.19 0.25 .0075 .0098 D 9.80 10.00 .3859 .3937 E 3.80 4.00 .1497 .1574 e 1.27 BASIC 0.050 BASIC H 5.80 6.20 .2284 .2440 h 0 . 2 50 . 5 0. 0 1 0. 0 2 0 L 0 . 4 01 . 2 7. 0 1 6. 0 5 0 α 0° 8° 0° 8°

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