66581-7 MACOM | Alldatasheet
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4 3 2 ' fet PO. bps perp pr [riper frre] 35 [05 |
1.65 WIRE SIZED STAMPED
D [.065] D WHEN TINES ARE COMPRESSED TO 0.25[.010] FROM BODY 01.52 a [9.060] = a eo REF ne im SS] | $3.18 [9.125] +0.13 2.6748 12 cova y 1905+-005 3.437600 c 20.22£0.38 ai —t c [.796+.015] LOCALIZED TIN—LEAD, 2.6779 -98 3.18 5.53 92.95 OR TIN, PLATE AREA ots [125] : 1057905 : MIN oT =“ SESTION AA a Sw a to eS 1.57 ™ ~ [.062] 3.81 B _. [.150] B LOCALIZED GOLD PLATE AREA aS | REVERSE REELED FOR MINIMAPPLICATOR| /4\\ [6581-4 Q OBSOLETE] CO SBI-Z_ SA [ REVERSE REELED FOR MINIMAPPLICATOR| /\\[ 66581-2 1. WIRE RANGE 22-18 AWG. ~ a = \\ 1 =1>1 = 2. INSULATION RANGE 1.27-2.79[,080~.110] DIA 3. FOR LOOSE PIECE PART SEE DWG 66591 THIS DRAWING IS A CONTROLLED DOCUMENT. i i AX 0.76, [.000030] MIN GOLD IN LOCALIZED GOLD PLATE AREA, al RLF == tyco Tyee Electronics Corporation 1.27 um [.000050] MIN TIN-LEAD IN LOCALIZED TIN-LEAD PLATE AREA, Electronics Harrisburg, PA 17105-3608 A gore owes 1.27um [.000050] MIN NICKEL. OTHERWISE ‘SPECIFIED: PO srenaver | IN PLATED. mm = CONTACT, PIN, STRIP, A Ay GOLD PLATING PER MIL-G-45204, TIN PER MIL-T-10727 aed ro TYPE VI, MULTIMATE A A 5 youn { 000030) nv coun IN LOCALIZED GOLD PLATE AREA, OS me 22° 8) epceanow sree = 1.27 4m [.000050] MIN TIN IN LOCALIZED TIN PLATE AREA, finetes SRE. | CASE CODE /DRAUNG NO *estcrso To BOTH OVER 1.27um [. . vm [.000050] MIN NICKEL MATERIAL FINISH we AS 00779 (G=66581 — BRASS MIL-C-50 see taste AX SOME SHEET REV AMP 1470-19 REV S1MARZ000