ICS651B IDT | Alldatasheet

Document overview

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Technical content

Features

  • Low skew outputs (250 ps)
  • Packaged in 8-pin SOIC
  • RoHS 5 (green) or RoHS 6 (green and lead-free) package
  • Low power CMOS technology
  • Operating Voltages of 1.5 V to 2.5 V
  • Output Enable pin tri-states outputs
  • 3.3 V tolerant input clock Block Diagram ICLK Output Enable

LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 2 ICS651B REV B 112509 Pin Assignment Pin Descriptions External Components A minimum number of external components are required for proper operation. A decoupling capacitor of 0.01 µF should be connected between VDD on pin 7 and GND on pin 6, as close to the device as possible. A 33 Ω series terminating resistor may be used on each clock output if the trace is longer than 1 inch. To achieve the low output skew that the ICS651B is capable of, careful attention must be paid to board layout. Essentially, all four outputs must have identical terminations, identical loads and identical trace geometries. If they do not, the output skew will be degraded. For example, using a 30Ω series termination on one output (with 33Ω on the others) will cause at least 15 ps of skew. 4 5 8ICLK Q3 Q4 OE VDD GND Pin Number Pin Name Pin Type Pin Description 1 ICLK Input Clock Input. 3.3 V tolerant input. 2 Q1 Output Clock Output 1. 3 Q2 Output Clock Output 2. 4 Q3 Output Clock Output 3. 5 Q4 Output Clock Output 4. 6 GND Power Connect to ground. 7 VDD Power Connect to +1.5 V or +2.5 V. 8 OE Input Output Enable. Tri-states outputs w hen low. Connect to VDD for normal operation.

LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 3 ICS651B REV B 112509 Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS651B. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Recommended Operation Conditions Item Rating Supply Voltage, VDD 7 V Output Enable and All Outputs -0.5 V to VDD+0.5 V ICLK -0.5 V to 3.6 V (VDD > 0V) Ambient Operating Temperature 0 to +70 ° C Storage Temperature -65 to +150 ° C Junction Temperature 125 ° C Soldering Temperature 260 ° C Parameter Min. Typ. Max. Units Ambient Operating Temperature 0 +70 ° C Power Supply Voltage (measured in respect to GND) +1.425 +2.625 V

LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 4 ICS651B REV B 112509 VDD=1.5 V ±5%, Ambient temperature 0 to +70° C, unless stated otherwise Notes: 1. Nominal switching threshold is VDD/2 VDD=2.5 V ±5%, Ambient temperature 0 to +70° C, unless stated otherwise Notes: 1. Nominal switching threshold is VDD/2 Parameter Symbol Conditions Min. Typ. Max. Units Operating Voltage VDD 1.425 1.575 V Input High Voltage V IH Note 1, ICLK 1.17 3.6 V OE VDD+0.5 V Input Low Voltage V IL Note 1, ICLK, OE 0.63 V Output High Voltage V OH IOH = -6 mA 1.35 V Output Low Voltage V OL IOL = 6 mA 0.45 V Operating Supply Current IDD No load, 133 MHz 25 mA Nominal Output Impedance Z O 20 Ω Input Capacitance C IN ICLK, OE pin 5 pF Short Circuit Current I OS ±28 mA Parameter Symbol Conditions Min. Typ. Max. Units Operating Voltage VDD 2.375 2.625 V Input High Voltage V IH Note 1, ICLK 1.7 3.6 V OE VDD+0.5 V Input Low Voltage V IL Note 1, ICLK, OE 0.7 V Output High Voltage V OH IOH = -8 mA 2 V Output Low Voltage V OL IOL = 8mA 0.4 V Operating Supply Current IDD No load, 133 MHz 50 mA Nominal Output Impedance Z O 20 Ω Input Capacitance C IN ICLK, OE pin 5 pF Short Circuit Current I OS ±50 mA

LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 5 ICS651B REV B 112509 VDD = 1.5 V ±5%, Ambient Temperature 0 to +70° C, unless stated otherwise VDD = 2.5 V ±5%, Ambient Temperature 0 to +70° C, unless stated otherwise Notes: 1. With rail to rail input clock 2. Between any 2 outputs with equal loading. Thermal Characteristics Parameter Symbol Conditions Min. Typ. Max. Units Input Frequency 0 166 MHz Output Rise Time t OR 0.63 V to 1.17 V 1.0 1.5 ns Output Fall Time t OF 1.17 V to 0.63 V 1.0 1.5 ns Propagation Delay Note 1 2.2 3 5 ns Output to Output Skew Note 2 Rising edges at VDD/2 0 ±250 ps Parameter Symbol Conditions Min. Typ. Max. Units Input Frequency 0 200 MHz Output Rise Time t OR 0.7 V to 1.7 V 1.0 1.5 ns Output Fall Time t OF 1.7 V to 0.7 V 1.0 1.5 ns Propagation Delay Note 1 2.2 3 5 ns Output to Output Skew Note 2 Rising edges at VDD/2 0 ±250 ps Parameter Symbol Conditions Min. Typ. Max. Units Thermal Resistance Junction to Ambient θJA Still air 150 ° C/W θJA 1 m/s air flow 140 ° C/W θJA 3 m/s air flow 120 ° C/W Thermal Resistance Junction to Case θJC 40 ° C/W Case Temperature 120 ° C Thermal Resistance Junction to Top of Case ΨJT Still air 20 ° C/W

LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 6 ICS651B REV B 112509 Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95

Ordering Information

“LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. Part / Order Number Marking Shipping Packaging Package Temperature 651BMLF 651BMLF Tubes 8-pin SOIC 0 to +70 ° C 651BMLFT 651BMLF Tape and Reel 8-pin SOIC 0 to +70 ° C INDEX AREA 1 2 D E SEATING PLANE A e - C - B .10 (.004) C C L H h x 45 *For reference only. Controlling dimensions in mm. Millimeters Inches* Symbol Min Max Min Max A 1.35 1.75 .0532 .0688 A1 0.10 0.25 .0040 .0098 B 0 . 3 30 . 5 1. 0 1 3. 0 2 0 C 0.19 0.25 .0075 .0098 D 4.80 5.00 .1890 .1968 E 3.80 4.00 .1497 .1574 e 1.27 BASIC 0.050 BASIC H 5.80 6.20 .2284 .2440 h 0 . 2 50 . 5 0. 0 1 0. 0 2 0 L 0 . 4 01 . 2 7. 0 1 6. 0 5 0 α 0° 8° 0° 8°

LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 7 ICS651B REV B 112509

Revision History

Rev. Originator Date Description of Change A K. Beckmeyer 12/15/05 Preliminary Datasheet release; new device. B LPL 11/25/09 Released to final.

© 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names a nd marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA Corporate Headquarters Integrated Device Technology, Inc. www.idt.com For Sales 800-345-7015 408-284-8200 Fax: 408-284-2775 For Tech Support www.idt.com/go/clockhelp Innovate with IDT and accelerate your future networks. Contact: www.IDT.com ICS651B LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER