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Technical content

Fast-acting chip fuses help provide overcurrent protection on systems using DC power sources up to 63VDC . The fuse’s monolithic, multilayer design provides the highest hold current in the smallest footprint, reduces diffusion- related aging, improves product reliability and resilience, and enhances high-temperature performance in a wide range of circuit designs. These RoHS-compliant surface mount devices offer strong arc suppression characteristics and facilitate the development of more reliable, high performance consumer electronics such as laptops, multimedia devices, cell phones, and other portable electronics.

• Small size with high-current ratings
• Excellent temperature stability
• High reliability and resilience
• Strong arc suppression characteristics
• RoHS compliant
• Halogen free (refers to: Br/H11349900ppm, Cl/H11349900ppm, Br+Cl/H113491500ppm)
• Monolithic, multilayer design
• High-temperature performance
• -55°C to +125°C operating range
• Laptops
• Digital cameras
• Cell phones Benefits Features

Applications

• Printers
• DVD players
• Portable electronics
• Game systems
• LCD monitors
• Scanners Fast-Acting Chip Fuses

RoHS Compliant, ELV Compliant HF Halogen Free % of rated current Clear time at 25°C 100% 4 hours min. 250% 5 seconds max. 400% 0.05 seconds max. Clear Time Characteristics for Fast-Acting Chip FusesTable FF1 Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for Fast-Acting Chip FusesTable FF2 0402SFF050F/24 0.50 0.380 24 35 0402SFF075F/24 0.75 0.210 24 35 0402SFF100F/24 1.00 0.120 24 35 0402SFF150F/24 1.50 0.056 24 35 0402SFF200F/24 2.00 0.035 24 35 0402SFF300F/24 3.00 0.021 24 35 0402SFF400F/24 4.00 0.014 24 35 Part Number Rated Current (A) Nominal Cold DCR* (Ω) Voltage (VDC ) Current (A) T ypical Electrical Characteristics Max. Interrupt Ratings 0603SFF050F/32 0.50 0.485 32 50 0603SFF075F/32 0.75 0.254 32 50 0603SFF100F/32 1.00 0.131 32 50 0603SFF150F/32 1.50 0.059 32 35 0603SFF200F/32 2.00 0.044 32 35 0603SFF250F/32 2.50 0.032 32 35 0603SFF300F/32 3.00 0.025 32 35 0603SFF350F/32 3.50 0.024 32 35 0603SFF400F/32 4.00 0.018 32 35 0603SFF500F/32 5.00 0.013 32 35 0603SFF600F/24 6.00 0.010 24 35 Part Number Rated Current (A) Nominal Cold DCR* (Ω) Voltage (VDC ) Current (A) T ypical Electrical Characteristics Max. Interrupt Ratings 1206SFF050F/63 0.50 0.500 63 50 1206SFF075F/63 0.75 0.330 63 50 1206SFF100F/63 1.00 0.220 63 50 1206SFF150F/63 1.50 0.120 63 50 1206SFF175F/63 1.75 0.100 63 50 1206SFF200F/63 2.00 0.050 63 50 1206SFF250F/32 2.50 0.035 32 50 1206SFF300F/32 3.00 0.031 32 50 1206SFF400F/32 4.00 0.022 32 45 1206SFF500F/32 5.00 0.015 32 45 1206SFF600F/24 6.00 0.012 24 45 1206SFF700F/24 7.00 0.011 24 45 1206SFF800F/24 8.00 0.008 24 45 * Measured at /H1134910% of rated current and 25°C ambient temperature. Part Number Rated Current (A) Nominal Cold DCR* (Ω) Voltage (VDC ) Current (A) T ypical Electrical Characteristics Max. Interrupt Ratings 0402 (1005mm) Fast-Acting Chip Fuses 0603 (1608mm) Fast-Acting Chip Fuses 1206 (3216mm) Fast-Acting Chip Fuses 0.063 (1. 60) 0.039±0.004 (1 .00±0.10) 0.020±0.004 (0.51±0.10) 0.010±0.004 (0.25±0.10) 0.020±0.004 (0.51±0.10) S Shape and Dimensions Inch (mm) Recommended Pad Layout Inch (mm) 0.028 (0.70) 0.024 (0.60) 0.016 (0.40) Shape and Dimensions Inch (mm) Recommended Pad Layout Inch (mm) 0.031±0.006 (0.80±0.15) 0.031±0.006 (0.80±0.15) 0.014±0.006 (0.36±0.15) 0.063±0.006 (1. 60±0.15) 0.110 (2.80) 0.039 (1 .00) 0.043 (1. 09) 0.024 (0.60) Shape and Dimensions Inch (mm) Recommended Pad Layout Inch (mm) 0.063±0.008 (3.20±0.20) 0.043±0.008 (1. 10±0.20) 0.020±0.010 (0.51±0.25) 0.173 (4.40) 0.071 (1. 80) 0.057 (1. 45) 0.059 (1. 50)

RoHS Compliant, ELV Compliant HF Halogen Free Family Performance CurvesFigure FF1-FF6 0.1 1011 00 Clear-Time (s) 0.1 0.01 0.001 Current (A) 0402SFF AverageTime Current Curves A = 0.5A B = 0.7A C = 1.0A D = 1.2A E = 1.5A F = 2.0A G = 2.5A H = 3.0A I = 4.0A A B C D E F G H I 0.001 0.01 0.1 1 10 1000 100 0.1 0.01 0.001 I²t (A²s) Time (s) 0402SFF I²t vs. t Curves A = 0.5A B = 0.75A C = 1.0A D = 1.5A E = 2.0A F = 3.0A G = 4.0A A B C DE F G Figure FF2Figure FF1 0.1 0.01 0.001 10.1 10 1 00 Current (A) Clear-Time (s) 0603SFF AverageTime Current Curves A = 0.5A B = 0.7A C = 1 .0A D = 1.5A E = 2.0A F = 2.5A G = 3.0A H = 3.5A I = 4.0A J = 5.0A K = 6.0A A B C D E FG HIJK 0.001 0.01 0.1 1 10 10000 1000 100 0.1 0.01 0.001 I²t (A²s) Time (s) 0603SFF I²t vs. t Curves B C D E F G H I J K A = 0.5A B = 0.75A C = 1.0A D = 1.5A E = 2.0A F = 2.5A G = 3.0A H = 3.5A I = 4.0A J = 5.0A K = 6.0A A Figure FF4Figure FF3 Note:Curves are nominal Note:Curves are nominal

RoHS Compliant, ELV Compliant HF Halogen Free Family Performance Curves ... Cont’dFigure FF1-FF6 0.1 1011 00 Clear-Time (s) 0.1 0.01 0.001 Current (A) 1206SFF AverageTime Current Curves A B CD E F G HIJ K L M A = 0.5A B = 0.7A C = 1.0A D = 1.5A E = 1.7A F = 2.0A G = 2.5A H = 3.0A I = 4.0A J = 5.0A K = 6.0A L = 7.0A M = 8.0A I²t (A²s) 10000 1000 100 0.1 0.01 0.001 Time (s) 1206SFF I²t vs. t Curves 0.001 0.01 0.1 1 10 A B C D E F G H IJ KL M A = 0.5A B = 0.75A C = 1.0A D = 1.5A E = 1.75A F = 2.0A G = 2.5A H = 3.0A I = 4.0A J = 5.0A K = 6.0A L = 7.5A M = 8.0A Figure FF6Figure FF5 Operating temperature -55°C to +125°C Mechanical vibration Withstands 5-3000 Hz at 30 Gs when evaluated per Method 204 of MIL-STD-202 Mechanical shock Withstands 1500 Gs, 0.5 millisecond half-sine pulses when evaluated per Method 213 of MIL-STD-202 Thermal shock Withstands 100 cycles from -65°C to +125°C when evaluated per Method 107 of MIL-STD-202 Resistance to soldering heat Withstands 60 seconds at +260°C when evaluated per Method 210 of MIL-STD-202 Solderability Meets 95% minimum coverage requirement when evaluated per Method 208 of MIL-STD-202 Moisture resistance Withstands 10 cycles when evaluated per Method 106 of MIL-STD-202 Salt spray Withstands 48-hour exposure when evaluated per Method 101 of MIL-STD-202 Construction body material Ceramic Termination material Silver, Nickel, Tin Fuse element Silver % De-rating 105 100 Maximum Operating Temperature (˚C) -55 -35 -15 5 25 45 65 85 105 125 1 45 Temperature Effect on Current Rating Environmental Specifications for Fast-Acting Chip FusesTable FF3 Material Specifications for Fast-Acting Chip FusesTable FF4 Thermal Derating Current for Fast-Acting Chip FusesFigure FF7 Note:Curves are nominal

RoHS Compliant, ELV Compliant HF Halogen Free Insulation resistance after opening20,000Ω minimum @ rated voltage. Fuse clearing under low voltage conditions may result in lower - post-clearing insulation values. Under normal fault conditions values. Under normal fault conditions Raychem fuses provide sufficient insulation resistance for circuit protection. Current carrying capacity Withstands 100% rated current at +25°C ambient for 4 hours when evaluated per MIL-PRF-23419. 0402 (1005) 10,000 178mm white plastic 9.0 ± 0.5mm 8.00 ± 0.10mm Paper 55 0603 (1608) 4,000 178mm white plastic 9.0 ± 0.5mm 8.00 ± 0.10mm Plastic 55 1206 (3216) 3,000 178mm white plastic 9.0 ± 0.5mm 8.00 ± 0.10mm Plastic 55 Packaging Information for Fast-Acting Chip FusesTable FF6 Range Performance T esting Method Min. Max. MVR ASTM D1238 3.60 4.40 Vicat softening temperature ASTM D1525 97.8 - Elasticity at break ASTM D638 50.0 - Tape and Reel Material Characteristics for Fast-Acting Chip FusesTable FF7 Tape and Reel Specifications for Fast-Acting Chip FusesTable FF8 Size Reel Quantity (pcs) Reel Diameter Reel Width Carrier T ape Size T apeT ype Reels per Outside Shipment Box Outside Shipment Boxes per Overpack Dimension in inches (mm) Mark 0402 (1005) 0603 (1608) 1206 (3216) Tolerance X ± 1mm; 0.X ± 0.5mm; 0.XX ± 0.2mm Recommended conditions for hand soldering: 1. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended, do not directly contact the chip termination with the tip of soldering iron. 2. Preheating: 150°C, 60s (min). Appropriate temperature (max) of soldering iron tip/soldering time (max): 280°C /10s or 350°C / 3s. Maximum temperature of soldering iron tip/soldering time: 350°C /9s or 400°C / 8s. Te mperature (˚C) Time (s) Soldering 10s Max. Natural Cooling 260 230 150-180 Preheat 60 - 120s Min. 40s Max. Recommended Soldering Temperature Profile for Fast-Acting Chip FusesFigure FF8

RoHS Compliant, ELV Compliant HF Halogen Free Part Numbering System for Fast-Acting Chip Fuses

1206 SF F 400 F / 24 -2

-2 = Tape and Reel Voltage Rating (V) Special Code F = RoHS Compliant M = Marked Rated Current 050 = 0.50 Amps 400 = 4 Amps Fuse BlowType F = Fast Acting S = Slow Blow H = High Current SF = Surface Mount Fuse Size (1206, 0603, 0402) Warning : All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and test each product selected for their application. Tyco Electronics Corporation makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use. Tyco Electronics’ only obligations are those in the Tyco Electronics’ Standard Terms and Conditions of Sale for this product, and in no case willTyco Electronics be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In addition,Tyco Electronics reserves the right to make changes to materials or processing that do not affect compliance with any applicable specification without notification to Buyer. Taped Component Dimensions for Fast-Acting Chip FusesFigure FF9 F W P2D0 t Reel Dimensions for Fast-Acting Chip FusesFigure FF10 Dimension Description Mark Dimensions (mm) Hub outer diameter B 60 Reel inside width W 1 9 Reel outside width W 2 11.4 Tape width 8 B Agency Approvals for Fast-Acting Chip Fuses UL File # E197536