STSJ60NH3LL STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Datasheet sections

  • 1 Electrical ratings
  • 2 Electrical characteristics
  • 2.1 Electrical characteristics (curves)
  • 3 Test circuit
  • 4 Package mechanical data
  • 5 Revision history

N-channel 30V - 0.004Ω - 15A - PowerSO-8™ STripFET™ Power MOSFET for DC-DC conversion General features ■ Optimal RDS(on) x Qg trade-off @ 4.5 V ■ Conduction losses reduced ■ Improved junction-case thermal resistance ■ Low threshold device

Description

This device utilizes the latest advanced design rules of ST’s proprietary STripFET™ technology. This process coupled to unique metallization techniques realizes the most advanced low voltage Power MOSFET in SO-8 ever produced. The exposed slug reduces the Rthj-c improving the current capability.

Applications

■ Switching application Internal schematic diagram Type V DSS RDS(on) ID STSJ60NH3LL 30V <0.0057 Ω 15A (2) PowerSO-8™ DRAIN CONTACT ALSO ON THE BACKSIDE Order codes Part number Marking Package Packaging STSJ60NH3LL 60H3LL- PowerSO-8™ Tape & reel

1 Electrical ratings

Table 1. Absolute maximum ratings

  1. This value is rated according to Rthj-c
  2. This value is rated according to Rthj-pcb
  3. Pulse width limited by safe operating area

Table 2. Thermal resistance

2 Electrical characteristics

Table 3. On/off states Table 4. Dynamic

Table 5. Switching times Table 6. Source drain diode

  1. Pulsed: pulse duration=300µs, duty cycle 1.5%

2.1 Electrical characteristics (curves)

Figure 1. Safe operating area Figure 2. Thermal impedance Figure 3. Output characterisics Figure 4. Transfer characteristics Figure 5. Normalized B VDSS vs temperature Figure 6. Static drain-source on resistance

3 Test circuit

Figure 12. Switching times test circuit for Figure 13. Gate charge test circuit Figure 14. Test circuit for inductive load Figure 15. Unclamped inductive load test Figure 16. Unclamped inductive waveform Figure 17. Switching time waveform

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

DIM. mm. inch A 1.75 0.068 a1 0.1 0.25 0.003 0.009 a2 1.65 0.064 a3 0.65 0.85 0.025 0.033 b 0.35 0.48 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.25 0.5 0.010 0.019 c1 45° (typ.) D 4.8 5.0 0.188 0.196 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 3.81 0.150 e4 2.79 0.110 F 3.8 4.0 0.14 0.157 L 0.4 1.27 0.015 0.050 M0 . 6 0 . 0 2 3 S8 ° ( m a x . ) PowerSO-8™ MECHANICAL DATA

5 Revision history

Table 7. Revision history