602AP

OPA602 TI | Alldatasheet

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Technical content

Difet® OPERATIONAL AMPLIFIER

APPLICATIONS

G PRECISION INSTRUMENTATION G OPTOELECTRONICS G SONAR, ULTRASOUND G PROFESSIONAL AUDIO EQUIPMENT G MEDICAL EQUIPMENT G DATA CONVERSION Cascode –In (2) +In (3) +V S (7) Output (6) –VS (4) (1) (5)Difet® Burr-Brown Corp.

FEATURES

G WIDE BANDWIDTH: 6.5MHz G HIGH SLEW RATE: 35V/ µs G LOW OFFSET: ±250µV max G LOW BIAS CURRENT: ±1pA max G FAST SETTLING TIME: 1 µs to 0.01% G UNITY-GAIN STABLE

DESCRIPTION

The OPA602 is a precision, wide bandwidth FET operational amplifier. Monolithic Difet (dielectrically isolated FET) con- struction provides an unusual combination of high-speed and accuracy. Its wide-bandwidth design minimizes dynamic errors. High slew rate and fast settling time allow accurate signal process- ing in pulse and data conversion applications. Wide band- width and low distortion minimize AC errors. All specifications are rated with a 1kΩ resistor in parallel with 500pF load. The OPA602 is unity-gain stable and easily drives capacitive loads up to 1500pF. Laser-trimmed input circuitry provides offset voltage and drift performance normally associated with precision bipolar op amps. Difet construction achieves extremely low input bias currents (1pA max) without compromising input voltage noise. The OPA602 ’s unique input cascode circuitry maintains low input bias current and precise input characteristics over its full input common-mode voltage range. OPA602 SBOS155A – AUGUST 1987 – REVISED OCTOBER 2002 www.ti.com PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1987, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. OPA602 OPA602

SBOS155Awww.ti.com Storage Temperature Range Operating Temperature Range Lead Temperature NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degrada- tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. OFFSET SPECIFIED VOLTAGE MAX PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT ( µV) AT 25°C PACKAGE-LEAD DESIGNATOR (1) RANGE MARKING NUMBER MEDIA, QUANTITY OPA602AP ±2000 DIP-8 P –25°C to +85°C 602AP 602AP Tubes, 50 OPA602BP ±1000 """ 602BP 602BP Tubes, 50 OPA602AU ±3000 SO-8 D –25°C to +85°C 602AU 602AU Tubes, 100 NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com. PACKAGE/ORDERING INFORMATION ABSOLUTE MAXIMUM RATINGS (1) PIN CONFIGURATIONS Top View DIP, SO +VS Output Offset Trim NC DIP-8 –In +In –VS Offset Trim NC S Output Offset Trim Offset Trim –In +In S SO-8 NC = No Connection

SBOS155A www.ti.com

ELECTRICAL CHARACTERISTICS

At VS = ±15VDC and TA = +25°C, unless otherwise noted. ✻ Same specifications as OPA602BP. NOTE: (1) OPA602AP, AU ensured by design with a 99% confidence level. OPA602BP OPA602AP, AU PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS INPUT NOISE Voltage: fO = 10Hz 23 ✻ nV/√Hz fO = 100Hz 19 ✻ nV/√Hz fO = 1kHz 13 ✻ nV/√Hz fO = 10kHz 12 ✻ nV/√Hz fB = 10Hz to 10kHz 1.4 ✻ µVrms fB = 0.1Hz to 10Hz 0.95 ✻ µVp-p Current: fB = 0.1Hz to 10Hz 12 ✻ fAp-p fO = 0.1Hz to 20kHz 0.6 ✻ fA/√Hz OFFSET VOLTAGE Input Offset Voltage: P Package 0.5 1 1 2 mV U Package 13 m V Over Specified Temperature P, U Packages ±0.75 ±1.5 ±1.5 mV Average Drift(1) TA = TMIN to TMAX ±3 ±5 ✻ ±15 µV/°C Supply Rejection ±VS = 12V to 18V 80 100 70 ✻ dB BIAS CURRENT Input Bias Current V CM = 0VDC ±1 ±2 ±2 ±10 pA Over Specified Temperature ±20 ±200 ±20 ±500 pA OFFSET CURRENT Input Offset Current V CM = 0VDC 0.5 2 1 10 pA Over Specified Temperature 20 200 20 500 pA INPUT IMPEDANCE Differential 1013 || 1 ✻ Ω || pF Common-Mode 1014 || 3 ✻ Ω || pF INPUT VOLTAGE RANGE Common-Mode Input Range ±10.2 +13, –11 ✻✻ V Common-Mode Rejection V IN = ±10VDC 88 100 75 ✻ dB OPEN-LOOP GAIN, DC Open-Loop Voltage Gain R L ≥ 1kΩ 88 100 75 ✻ dB FREQUENCY RESPONSE Gain Bandwidth Gain = 100 4 6.5 3.5 ✻ MHz Full-Power Response 20Vp-p, R L = 1kΩ 570 ✻ kHz Slew Rate V O = ±10V, RL = 1kΩ 24 35 20 ✻ V/µs Settling Time: 0.1% Gain = –1, RL = 1kΩ 0.6 ✻ µs 0.01% C L = 500pF, 10V Step 1.0 µs RATED OUTPUT Voltage Output R L = 1kΩ± 11.5 +12.9, ±11 ✻ V –13.8 Current Output V O = ±10VDC ±15 ±20 ✻✻ mA Output Resistance 1MHz, Open Loop 80 ✻ Ω Load Capacitance Stability Gain = +1 1500 ✻ pF Short-Circuit Current ±30 ±50 ±25 ✻ mA POWER SUPPLY Rated Voltage ±15 ✻ VDC Voltage Range, Derated Performance ±5 ±18 ✻✻ VDC Current, Quiescent I O = 0mADC 3 4 ✻✻ mA Over Specified Temperature 3.5 4.5 ✻✻ mA TEMPERATURE RANGE Specification Ambient Temperature –25 +85 ✻✻ °C Operating: P, U Packages –25 +85 ✻✻ °C Storage: P, U Packages –40 +125 ✻✻ °C θJA 200 ✻ °C/W

SBOS155Awww.ti.com TYPICAL CHARACTERISTICS At TA = +25°C and VS = ±15VDC , unless otherwise noted. INPUT CURRENT NOISE SPECTRAL DENSITY 100 0.1 1 10 100 1k 10k 100k 1M Frequency (Hz) Current Noise (fA/√Hz) INPUT VOLTAGE NOISE SPECTRAL DENSITY 100 1 10 100 1k 10k 100k 1M Frequency (Hz) Voltage Noise (nV/√Hz) POWER-SUPPLY REJECTION AND COMMON-MODE REJECTION vs TEMPERATURE 110 –75 Temperature (°C) CMR and PSR (dB) 105 100 –50 –25 0 25 50 75 100 125 CMR PSR EO R S TOTAL INPUT VOLTAGE NOISE SPECTRAL DENSITY AT 1kHz vs SOURCE RESISTANCE 100 100 1k 10k 100k 1M 10M 100M Source Resistance (Ω ) Voltage Noise, EO (nV/√Hz) OPA602 + Resistor Resistor Noise Only COMMON-MODE REJECTION vs INPUT COMMON-MODE VOLTAGE 120 Common-Mode Rejection (dB) Common-Mode Voltage (V) 110 100 OPEN-LOOP FREQUENCY RESPONSE 140 Frequency (Hz) Voltage Gain (dB) 10 100 1k 10k 100k 1M 10M 120 100 –45 –90 –135 –180 Phase Shift (degrees) R L = 1kΩ C L = 100pF AOL φ

SBOS155A www.ti.com TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C and VS = ±15VDC , unless otherwise noted. GAIN BANDWIDTH AND SLEW RATE vs TEMPERATURE –75 Ambient Temperature (°C) Gain Bandwidth (MHz) Slew Rate (V/µs) –50 –25 0 25 50 75 100 125 GBW Slew Rate GAIN BANDWIDTH AND SLEW RATE vs SUPPLY VOLTAGE Supply Voltage (±VCC ) Gain Bandwidth (MHz) Slew Rate (V/µs) 5 1 01 52 0 AV = –1 GBW Slew Rate OPEN-LOOP GAIN vs TEMPERATURE 120 –75 Ambient Temperature (°C) Voltage Gain (dB) 110 100 –50 –25 0 25 50 75 100 125 MAXIMUM OUTPUT VOLTAGE SWING vs FREQUENCY 10k 100k 1M 10M Frequency (Hz) Output Voltage (Vp-p) R L = 1kΩ LARGE-SIGNAL TRANSIENT RESPONSE Output Voltage (V) Time (µs) –10 012345 SMALL-SIGNAL TRANSIENT RESPONSE Output Voltage (mV) Time (µs) 150 100 –50 –100 –150 025

SBOS155Awww.ti.com TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C and VS = ±15VDC , unless otherwise noted. SETTLING TIME vs CLOSED-LOOP GAIN –1 –10 –100 –1k Closed-Loop Gain (V/V) Settling Time (µs) 0.1% R L = 1kΩ C L = 100pF 0.01% SUPPLY CURRENT vs TEMPERATURE 3.5 3.25 3.0 2.75 2.5 –75 Ambient Temperature (°C) Supply Current (mA) –50 –25 0 25 50 75 100 125 OPEN-LOOP GAIN vs SUPPLY VOLTAGE 104 Supply Voltage (±VCC ) Voltage Gain 5 1 01 52 0 100 TOTAL HARMONIC DISTORTION vs FREQUENCY1 0.1 0.01 0.001 0.1 Frequency (Hz) THD + Noise (%rms) 1 10 100 1k 10k 100k AV = +101V/V AV = +1V/V 6.5Vrms 1kΩ 402Ω 40.2kΩ AV = +101V/V BIAS AND OFFSET CURRENT vs TEMPERATURE 10nABias Current (pA) –50 Ambient Temperature (°C) 10nA Offset Current (pA) –25 0 25 50 75 100 125 1nA 100 0.1 1nA 100 0.1 BIAS AND OFFSET CURRENT vs INPUT COMMON MODE VOLTAGE 0.1

0.01 Bias Current (pA)

–15 Common-Mode Voltage (V) 0.1 0.01 Offset Current (pA) –10 –50 51 0 1 5 Bias Current Offset Current

At TA = +25°C and VS = ±15VDC , unless otherwise noted. especially at the inverting input pin. use of additional 1.0µF tantalum bypass capacitors. flow harmlessly to the low-impedance node. by a 30-minute bake at +85°C. Guard top and bottom of board. ® standoff for sensitive input pins. Teflon® E.I. Du Pont de Nemours & Co. FIGURE 1. Connection of Input Guard.

6 Out

6 OutOPA602 OPA602

SBOS155A www.ti.com PACKAGE DRAWINGS P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.015 (0,38) Gage Plane 0.325 (8,26) 0.300 (7,62) 0.010 (0,25) NOM MAX 0.430 (10,92) 4040082/D 05/98 0.200 (5,08) MAX 0.125 (3,18) MIN 0.355 (9,02) 0.020 (0,51) MIN 0.070 (1,78) MAX 0.240 (6,10) 0.260 (6,60) 0.400 (10,60) 0.015 (0,38) 0.021 (0,53) Seating Plane M0.010 (0,25) 0.100 (2,54) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001

SBOS155Awww.ti.com PACKAGE DRAWINGS (Cont) D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

8 PINS SHOWN

0.197 (5,00)A MAX A MIN (4,80) 0.189 0.337 (8,55) (8,75) 0.344 0.386 (9,80) (10,00) 0.394 16DIM PINS ** 4040047/E 09/01 0.069 (1,75) MAX Seating Plane 0.004 (0,10) 0.010 (0,25) 0.010 (0,25) 0.016 (0,40) 0.044 (1,12) 0.244 (6,20) 0.228 (5,80) 0.020 (0,51) 0.014 (0,35) 1 4 8 5 0.150 (3,81) 0.157 (4,00) 0.008 (0,20) NOM 0°– 8° Gage Plane A 0.004 (0,10) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15). D. Falls within JEDEC MS-012

www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) OPA602AU Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-3-260C-168 HR -25 to 85 OPA 602AU OPA602AU.A Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-3-260C-168 HR -25 to 85 OPA 602AU OPA602AU/2K5 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -25 to 85 OPA 602AU OPA602AU/2K5.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -25 to 85 OPA 602AU OPA602AU/2K5E4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -25 to 85 OPA 602AU OPA602AUE4 Active Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-3-260C-168 HR -25 to 85 OPA 602AU OPA602BP Obsolete Production PDIP (P) | 8 - - Call TI Call TI - OPA602BP (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Addendum-Page 1

www.ti.com 23-May-2025 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA602AU/2K5 SOIC D 8 2500 356.0 356.0 35.0 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) OPA602AU D SOIC 8 75 506.6 8 3940 4.32 OPA602AU.A D SOIC 8 75 506.6 8 3940 4.32 OPA602AUE4 D SOIC 8 75 506.6 8 3940 4.32 Pack Materials-Page 3

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