A5G26S008N_V01 NXP | Alldatasheet

Document overview

  • Manufacturer or author: NXP Semiconductors
  • PDF pages: 13

Technical content

Features

  • High terminal impedances for optimal broadband performance
  • Designed for low complexity linearization systems
  • Universal broadband driver
  • Optimized for massive MIMO active antenna systems for 5G base stations Data Sheet: Technical Data A5G26S008N Airfast RF Power GaN Transistor Rev. 1 — November 2022 2496–2690 MHz, 27 dBm Avg., 48 V AIRFAST RF POWER GaN TRANSISTOR A5G26S008N DFN 4.5 /C0121 4 PLASTIC Note: Exposed backside of the package is the source terminal for the transistor. (Top View)

Figure 1. Pin Connections improvements in the design of its products.

Table 1. Maximum Ratings Table 2. Recommended Operating Conditions Table 3. Thermal Characteristics Table 4. ESD Protection Characteristics Table 5. Moisture Sensitivity Level Table 6. Electrical Characteristics (TA = 25°C unless otherwise noted)

  1. R θCHC (FEA) must be used for purposes related to reliability and limitations on maximum channel temperature. MTTF may be estimated

by the expression MTTF (hours) = 10[A + B/(T + 273)], where T is the channel temperature in degrees Celsius, A = –11.6 and B = 9129.

Table 6. Electrical Characteristics (TA = 25°C unless otherwise noted) (continued) Table 7. Ordering Information

  1. Part internally input matched.
  2. All data measured in reference circuit with device soldered to printed circuit board.
  3. Set V GS to the pinch−off voltage, typically –5 V.
  4. Turn on VDS to nominal supply voltage (+48 V).
  5. Increase V GS until IDS current is attained.
  6. Apply RF input power to desired level.

GS down to the pinch−off voltage, typically –5 V.

  1. Adjust drain voltage VDS to 0 V. Allow adequate time for drain voltage

to reduce to 0 V from external drain capacitors.

Figure 2. A5G26S 008N Reference Circuit Component Layout Note: All data measured in reference circuit with device soldered to printed circuit board. Note: All data measured in reference circuit with device soldered to printed circuit board. Table 8. A5G26S008N Reference Circuit Component Designations and Values

Figure 3. Product Marking

6 / 13Data Sheet: Technical Data A5G26S008N Airfast RF Power GaN Transistor, Rev. 1, November 2022

Package Information

7 / 13Data Sheet: Technical Data A5G26S008N Airfast RF Power GaN Transistor, Rev. 1, November 2022

8 / 13Data Sheet: Technical Data A5G26S008N Airfast RF Power GaN Transistor, Rev. 1, November 2022

9 / 13Data Sheet: Technical Data A5G26S008N Airfast RF Power GaN Transistor, Rev. 1, November 2022

10 / 13Data Sheet: Technical Data A5G26S008N Airfast RF Power GaN Transistor, Rev. 1, November 2022

11 / 13Data Sheet: Technical Data A5G26S008N Airfast RF Power GaN Transistor, Rev. 1, November 2022

12 / 13Data Sheet: Technical Data A5G26S008N Airfast RF Power GaN Transistor, Rev. 1, November 2022 Product Documentation and Software Refer to the following resources to aid your design process. Application Notes

  • AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
  • AN1955: Thermal Measurement Methodology of RF Power Amplifiers Software
  • .s2p File Development Tools
  • Printed Circuit Boards

Revision History

The following table summarizes revisions to this document. Revision Date Description 0 Oct. 2021 • Initial release of data sheet 1 Nov. 2022 • Table 1, Maximum Ratings: Gate−Source Voltage: updated –8, 0 to –16, 0 Vdc, p. 2

  • Table 4, ESD Protection Characteristics, Human Body Model: updated to reflect test data, p. 2
  • General updates made to align data sheet to current standard

13 / 13Data Sheet: Technical Data A5G26S008N Airfast RF Power GaN Transistor, Rev. 1, November 2022 Information in this document is provided solely to enable system and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions o f sale, which can be found at the following address: nxp.com/SalesTermsandConditions. NXP , the NXP logo, Freescale, the Freescale logo and Airfast are trademarks of NXP B.V. All other product or service names are the property of their respective owners. /C0069 NXP B.V. 2021–2022 All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: November 2022 Document identifier: A5G26S008N How to Reach Us Home Page: nxp.com Web Support: nxp.com/support