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High terminal impedances for optimal broadband performance Advanced high performance in- -package Doherty Able to withstand extremely high output VSWR and broadband operating conditions Document Number: A3G26H200W17S Rev. 0, 03/2020 NXP Semiconductors Technical Data 2496–2690 MHz, 34 W Avg., 48 V AIRFAST RF POWER GaN TRANSISTOR A3G26H200W17S NI- -780S- -4S2S Figure 1. Pin Connections
Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Electrical Characteristics(TA =2 5C unless otherwise noted)
- Reliability tests were conducted at 225C. Operations with TCH at 275C will reduce median time to failure.
- RCHC (FEA) must be used for purposes related to reliability and limitations on maximum channel temperature. MTTF may be estimated
by the expression MTTF (hours) = 10[A + B/(T + 273)], whereT is the channel temperature in degrees Celsius,A = –11.1 andB = 8366.
- Each side of device measured separately.
Table 4. Electrical Characteristics(TA =2 5C unless otherwise noted)(continued) Pout = 34 W Avg., f = 2690 MHz, Single- -Carrier W- -CDMA, IQ Magnitude Clipping, Input Signal PAR = 9.9 dB @ 0.01% Probability on CCDF. Table 5. Ordering Information
- Part internally matched both on input and output.
- P3dB = Pavg + 7.0 dB where Pavg is the average output power measured using an unclipped W- -CDMA single- -carrier input signal where
output PAR is compressed to 7.0 dB @ 0.01% probability on CCDF.
- Turn on VDS to nominal supply voltage (48 V)
- Increase VGS until IDS current is attained
- Apply RF input power to desired level
- Reduce VDS down to 0 V (Adequate time must be allowed
Figure 2. A3G26H200W17S Production Test Circuit Component Layout Table 6. A3G26H200W17S Production Test Circuit Component Designations and Values
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes AN1908: Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages AN1955: Thermal Measurement Methodology of RF Power Amplifiers Software .s2p File Development Tools Printed Circuit Boards
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 0 Mar. 2020 Initial release of data sheet
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