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 Advanced high performance in- -package Doherty  Greater negative gate- -source voltage range for improved Class C operation  Designed for digital predistortion error correction systems Document Number: A3V07H600- -42N Rev. 0, 08/2020 NXP Semiconductors Technical Data 616–870 MHz, 112 W Avg., 48 V AIRFAST RF POWER LDMOS TRANSISTOR A3V07H600- -42N OM- -1230- -6L PLASTIC Figure 1. Pin Connections the source terminal for the transistor.

Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level Table 5. Electrical Characteristics(TA =2 5C unless otherwise noted)

  1. Continuous use at maximum temperature will affect MTTF.
  2. MTTF calculator available athttp://www.
  3. Each side of device measured separately.

Table 5. Electrical Characteristics(TA =2 5C unless otherwise noted)(continued) Pout = 112 W Avg., f = 717 MHz, Single- -Carrier W- -CDMA, IQ Magnitude Clipping, Input Signal PAR = 9.9 dB @ 0.01% Probability on CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @5M H zO f f s e t . Table 6. Ordering Information

  1. Part internally input matched.
  2. P3dB = Pavg + 7.0 dB where Pavg is the average output power measured using an unclipped W- -CDMA single- -carrier input signal where

output PAR is compressed to 7.0 dB @ 0.01% probability on CCDF.

Figure 2. A3V07H600- -42N Production Test Circuit Component Layout Table 7. A3V07H600- -42N Production Test Circuit Component Designations and Values

PACKAGE INFORMATION

PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes  AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages  AN1955: Thermal Measurement Methodology of RF Power Amplifiers Software  Electromigration MTTF Calculator  .s2p File Development Tools  Printed Circuit Boards

REVISION HISTORY

The following table summarizes revisions to this document. Revision Date Description 0 Aug. 2020  Initial release of data sheet

Information in this document is provided solely to enablesystem and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, andspecifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address:nxp.com/ SalesTermsandConditions. NXP, the NXP logo and Airfast are trademarks of NXP B.V. All other product or service names are the property of their respective owners. E 2020 NXP B.V. How to Reach Us: Home Page: nxp.com Web Support: nxp.com/support Document Number: A3V07H600- -42N Rev. 0, 08/2020