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High terminal impedances for optimal broadband performance Advanced high performance in- -package Doherty Improved linearized error vector magnitude with next generation signal Able to withstand extremely high output VSWR and broadband operating conditions Document identifier: A3G18D510- -04S Rev. 0 — August 2020 Data Sheet: Technical Data 1805–2200 MHz, 56 W Avg., 48 V AIRFAST RF POWER GaN TRANSISTOR A3G18D510- -04S NI- -780S- -4L Figure 1. Pin Connections
42 RFoutB/VDSB
improvements in the design of its products.
Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Electrical Characteristics(TA =2 5C unless otherwise noted)
- Reliability tests were conducted at 225C. Operations with TCH at 275C will reduce median time to failure.
- RCHC (FEA) must be used for purposes related to reliability and limitations on maximum channel temperature. MTTF may be estimated
by the expression MTTF (hours) = 10[A + B/(T + 273)], whereT is the channel temperature in degrees Celsius,A = –10.3 andB = 8263.
- Each side of device measured separately.
Table 4. Electrical Characteristics(TA =2 5C unless otherwise noted)(continued) Pout = 56 W Avg., f = 1805 MHz, Single- -Carrier W- -CDMA, IQ Magnitude Clipping, Input Signal PAR = 9.9 dB @ 0.01% Probability on CCDF. Table 5. Ordering Information
- Part internally input matched.
- P3dB = Pavg + 7.0 dB where Pavg is the average output power measured using an unclipped W- -CDMA single- -carrier input signal where
output PAR is compressed to 7.0 dB @ 0.01% probability on CCDF.
- Set gate voltage VGSA and VGSB to –5 V.
- Set drain voltage VDSA and VDSB to nominal supply voltage (+48 V).
- Increase VGSA (carrier side) until IDQA current is attained.
- Increase VGSB (peaking side) to target bias voltage.
- Apply RF input power to desired level.
- Adjust drain voltage VDSA and VDSB to 0 V. Allow adequate time
for drain voltage to reduce to 0 V from external drain capacitors.
Figure 2. A3G18D510- -04S Production Test Circuit Component Layout Table 6. A3G18D510- -04S Production Test Circuit Component Designations and Values
Data Sheet: Technical Data 5/8 A3G18D510- -04S Airfast RF Power GaN Transistor, Rev. 0, August 2020
Package Information
Data Sheet: Technical Data 6/8 A3G18D510- -04S Airfast RF Power GaN Transistor, Rev. 0, August 2020
Data Sheet: Technical Data 7/8 A3G18D510- -04S Airfast RF Power GaN Transistor, Rev. 0, August 2020 PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes AN1908: Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages AN1955: Thermal Measurement Methodology of RF Power Amplifiers Software .s2p File Development Tools Printed Circuit Boards
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 0 Aug. 2020 Initial release of data sheet
Data Sheet: Technical Data 8/8 A3G18D510- -04S Airfast RF Power GaN Transistor, Rev. 0, August 2020 Information in this document is provided solely to enablesystem and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, orguarantee regarding the suitability of its products for any particularpurpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, andspecifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address:nxp.com/ SalesTermsandConditions. NXP, the NXP logo and Airfast are trademarks of NXP B.V. All other product or service names are the property of their respective owners. How to Reach Us Home Page: nxp.com Web Support: nxp.com/support E NXP B.V. 2020 All rights reserved. Date of release: August 2020 Document identifier: A3G18D510- -04S