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Document overview
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Technical content
Features
Integrated Doherty splitter and combiner On- -chip matching (50 ohm input, DC blocked) Integrated quiescent current temperature compensation with enable/disable function(1) 1. Refer to AN1977,Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family, and to AN1987,Quiescent Current Control for the RF Integrated Circuit Device Family.Go tohttp://www.nxp.com/RF and search for AN1977 or AN1987. Document Number: A3I25X050N Rev. 0, 12/2019 NXP Semiconductors Technical Data 2300–2700 MHz, 5.6 W AVG., 28 V AIRFAST RF LDMOS INTEGRATED POWER AMPLIFIERS A3I25X050N A3I25X050GN O M -- 4 0 0 -- 8 PLASTIC A3I25X050N OM- -400G- -8 PLASTIC A3I25X050GN 2019 NXP B.V.
Figure 1. Functional Block Diagram Figure 2. Pin Connections the source terminal for the transistor. Pin 7 and decouple on Pin 1. Maximum current allowed between Pin 1 and Pin 7 inside the device is 1.8 A. Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level
- Continuous use at maximum temperature will affect MTTF.
- MTTF calculator available athttp://www.nxp.com.
Table 5. Electrical Characteristics(TA =2 5C unless otherwise noted)
Table 5. Electrical Characteristics(TA =2 5C unless otherwise noted)(continued) CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @5M H zO f f s e t . Table 6. Ordering Information
- Part internally input and output matched.
- Measurements made with device in straight leadconfiguration before any lead forming operation is applied. Lead forming is used for gull
- P3dB = Pavg + 7.0 dB where Pavg is the average output power measured using anunclipped W- -CDMA single- -carrier input signal
where output PAR is compressed to 7.0 dB @ 0.01% probability on CCDF.
- Refer to AN1977,Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family, and to AN1987,Quiescent Current Control
for the RF Integrated Circuit Device Family.Go tohttp://www.nxp.com/RF and search for AN1977 or AN1987.
Figure 3. A3I25X050N Production Test Circuit Component Layout Table 7. A3I25X050N Production Test Circuit Component Designations and Values
Figure 4. A3I25X050N Characterization Test Circuit ComponentLayout — 2496–2690 MHz Table 8. A3I25X050N Characterization Test Circuit Component Designations and Values — 2496–2690 MHz
Figure 5. A3I25X050N Test Circuit Component Layout — 2300–2400 MHz Table 9. A3I25X050N Test Circuit Component Designations and Values — 2300–2400 MHz
PACKAGE INFORMATION
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family Software Electromigration MTTF Calculator RF High Power Model .s2p File Development Tools Printed Circuit Boards
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 0 Dec. 2019 Initial release of data sheet
Information in this document is provided solely to enablesystem and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, andspecifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address:nxp.com/ SalesTermsandConditions. NXP, the NXP logo and Airfast are trademarks of NXP B.V. All other product or service names are the property of their respective owners. E 2019 NXP B.V. How to Reach Us: Home Page: nxp.com Web Support: nxp.com/support Document Number: A3I25X050N Rev. 0, 12/2019