HCPL-5150 BOARDCOM | Alldatasheet
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Technical content
Features
Performance Guaranteed over Full Military Temperature Range: –55°C to +125°C Manufactured and tested on a MIL-PRF-38534 certified line Hermetically sealed packages Dual marked with device part number and DLA Standard Microciruit Drawing (SMD) QML-38534 HCPL-3150 function compatibility 0.5A minimum peak output current 10 kV/μs minimum common mode rejection (CMR) at V CM =1 0 0 0 V 1.0V maximum low level output voltage (VOL) eliminates need for negative gate drive ICC = 5 mA maximum supply current Undervoltage lock-out protection (UVLO) with hysteresis Wide operating VCC range: 15V to 30V 500-ns maximum propagation delay ±0.35-ms maximum delay between devices
Applications
Industrial and military environments High reliability systems Harsh industrial environments Transportation, medical, and life critical systems Isolated IGBT/MOSFET gate drive AC and brushless DC motor drives Industrial inverters Switch mode power supplies (SMPS) Uninterruptible power supplies (UPS) HCPL-5150 and HCPL-5151, DLA SMD 5962-04205 1 0.5-Amp Output Current IGBT Gate Drive Hermetic Optocoupler Data Sheet
- 2 - HCPL-5150 and HCPL-5151, DLA SMD 5962-04205 Data Sheet Schematic Diagram Truth Table NOTE A 0.1-μF bypass capacitor must be connected between pins 5 and 8. Selection Guide — Lead Configuration Options LED VCC – VEE VCC – VEE VOPositive Going (i.e., Turn-ON) Negative Going (i.e., Turn-OFF) OFF 0V to 30V 0V to 30V LOW ON 0V to 11V 0V to 9.5V LOW ON 11V to 13.5V 9.5V to 12V TRANSITION ON 13.5V to 30V 12V to 30V HIGH SHIELD N/C CATHODE ANODE N/C VCC VO VO VEE Part Number and Options Commercial HCPL-5150 MIL-PRF-38534, Class H HCPL-5151 Standard Lead Finish Gold Plate a a. Gold Plate lead finish: Maximum gold thickness of leads is <100 micro inches. Typical is 60 to 90 micro inches. Solder Dippedb b. Solder lead finish: Sn63/Pb37. Option -200 Butt Cut/Gold Platea Option -100 Gull Wing/Solderedb Option -300 SMD Part Number Prescript for all below 5962- Gold Platea 0420501HPC Solder Dippedb 0420501HPA Butt Cut/Gold Platea 0420501HYC Butt Cut/Solderedb 0420501HYA Gull Wing/Solderedb 0420501HXA Outline Drawing 8-Pin DIP Through Hole 3.81 (0.150) MIN. 4.32 (0.170) MAX. 10.03 (0.395) 10.29 (0.405) 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 1.02 (0.040) 1.52 (0.060) 8.13 (0.320) MAX. 7.36 (0.290) 7.87 (0.310) 0.20 (0.008) 0.33 (0.013) 7.16 (0.282) 7.57 (0.298) NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
- 3 - HCPL-5150 and HCPL-5151, DLA SMD 5962-04205 Data Sheet Device Marking Hermetic Optocoupler Options Option Description 100 Surface-mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on Commercial, Class H product. 200 Lead finish is solder dipped rather than gold plated. This option is available on Commercial, Class H product. DLA Drawing (SMD) part numbers contain provisions for lead finish. 300 Surface-mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on Commercial, Class H product. This option has solder-dipped leads. COMPLIANCE INDICATOR,[1] DATE CODE, SUFFIX (IF NEEDED) A HCPL-515x 5962-04205 01Hxx 50434 COUNTRY OF MFR. Avago CAGE CODE[1] Avago DESIGNATOR DLA SMD[1] PIN ONE/ ESD IDENT Avago P/N DLA SMD[1] [1] QML PARTS ONLY SGP QYYWWZ 1.14 (0.045) 1.40 (0.055) 4.32 (0.170) MAX. 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 7.36 (0.290) 7.87 (0.310) 0.20 (0.008) 0.33 (0.013) NOTE: DIMENSIONS IN MILLIMETERS (INCHES). 0.51 (0.020) MIN. 4.57 (0.180) MAX. 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 1.40 (0.055) 1.65 (0.065) 9.65 (0.380) 9.91 (0.390) 5q MAX. 4.57 (0.180) MAX. 0.20 (0.008) 0.33 (0.013) NOTE: DIMENSIONS IN MILLIMETERS (INCHES). 1.07 (0.042) 1.32 (0.052)
- 4 - HCPL-5150 and HCPL-5151, DLA SMD 5962-04205 Data Sheet Absolute Maximum Ratings ESD Classification Recommended Operating Conditions Parameter Symbol Min Max Unit Notes Storage Temperature T S –65 +150 °C Operating Temperature T A –55 +125 °C Case Temperature T C —+ 1 4 5 ° C Junction Temperature T J —+ 1 5 0 ° C Lead Solder Temperature — 260 for 10s °C Average Input Current I F AVG —2 5 m A a a. No derating required with the typica l case-to-ambient thermal resistance (θCA = 140°C/W). Refer to Figure 35. Peak Transient Input Current (<1-μs pulse width, 300 pps) IF PK —1 . 0A Reverse Input Voltage V R —5V High Peak Output Current I OH (PEAK) —0 . 6A b b. Maximum pulse width = 10 μs, maximum duty cycle = 0.2%. This va lue is intended to allow for component tolerances for designs with IO peak minimum = 0.5A. See Applications Information for additional details on limiting IOH peak. Low Peak Output Current I OL (PEAK) —0 . 6A b Supply Voltage (V CC – VEE)0 3 5 V Output Voltage V O (PEAK) 0V CC V Input Power Dissipation P E —4 5 m W a Output Power Dissipation P O — 250 mW c c. Derate linearly above 102°C free air temp erature at a rate of 6 mW/°C with the typical case-to-ambient thermal resistance (θCA = 140°C/W). Refer to Figure 36. Total Power Dissipation P T — 295 mW d d. Derate linearly above 102°C free air temp erature at a rate of 6 mW/°C with the typical case-to-ambient thermal resistance (θCA = 140°C/W). Refer to Figure 35 and Figure 36. MIL-STD-883, Method 3015 , Class 1 Parameter Symbol Min Max Unit Power Supply Voltage (V CC – VEE)1 5 3 0 V Input Current (ON) I F(ON) 10 18 mA Input Voltage (OFF) V F(OFF) –3.0 0.8 V Operating Temperature T A –55 125 °C
- 5 - HCPL-5150 and HCPL-5151, DLA SMD 5962-04205 Data Sheet Electrical Specifications (DC) Over recommended operating conditions (TA = –55°C to +125°C, IF(ON) = 10 mA to 18 mA, VF(OFF) = –3.0V to 0.8V, VCC = 15V to 30V, VEE = Ground) unless otherwise specified. Parameter Symbol Test Conditions Group A Subgroupsa a. Commercial parts receive 100% testing at 25°C (Subgroups 1 and 9). SMD and Class H parts receive 100% testing at 25°C, 125°C, and –55°C (Subgroups 1 and 9, 2 and 10, 3 and 11, respectively). Limits Unit Fig. Notes Min Typb b. All typical values at T A = 25°C and VCC – VEE = 30V, unless otherwise noted. Max High Level Output Current I OH VO = (VCC – 4V) 1, 2, 3 0.1 0.4 — A 2, 3, 17 c c. Maximum pulse width = 50 μs, maximum duty cycle = 0.5%. VO = (VCC – 15V) 0.5 — — d d. Maximum pulse width = 10 μs, maximum duty cycle = 0.2%. This va lue is intended to allow for component tolerances for designs with IO peak minimum = 0.5A. See Applications Information for additional details on limiting IOH peak. Low Level Output Current I OL VO = (VEE + 2.5V) 1, 2, 3 0.1 0.6 — A 5, 6, 18 c VO = (VEE + 15V) 0.5 — — d High Level Output Voltage V OH IO = –100 mA 1, 2, 3 (V CC – 4) (V CC – 3) — V 1, 3, 19 e, f e. In this test, V OH is measured with a dc load current. When driving capacitive loads, VOH approaches VCC as IOH approaches zero amps. f. Maximum pulse width = 1 ms, maximum duty cycle = 20%. Low Level Output Voltage V OL IO = 100 mA 1, 2, 3 — 0.4 1.0 V 4, 6, 20 High Level Supply Current I CCH Output Open, IF = 10 mA to 18 mA 1, 2, 3 — 2.5 5.0 mA 7, 8 Low Level Supply Current I CCL Output Open, VF = –3.0V to +0.8V 1, 2, 3 — 2.7 5.0 mA Threshold Input Current Low to High IFLH IO = 0 mA, VO > 5V Threshold Input Voltage High to Low VFHL 1, 2, 3 0.8 — — V Input Forward Voltage V F IF = 10 mA 1, 2, 3 1.2 1.5 1.8 V 16 Temperature Coefficient of Forward Voltage ΔVF/ΔTA IF = 10 mA — –1.6 — mV/ °C Input Reverse Breakdown Voltage BV R IR = 10 µA1 , 2 , 3 5 — — V Input Capacitance C IN f = 1 MHz, VF = 0 V —8 0 — p F UVLO Threshold V UVLO+ VO > 5 V, IF = 10 mA 1, 2, 3 11.0 12.3 13.5 V 22, 37 VUVLO– 1, 2, 3 9.5 10.7 12.0 UVLO Hysteresis UVLO HYS —1 . 6 —
- 6 - HCPL-5150 and HCPL-5151, DLA SMD 5962-04205 Data Sheet Switching Specifications (AC) Over recommended operating conditions (TA = –55°C to +125°C, IF(ON) = 10 mA to 18 mA, VF(OFF) = –3.0V to 0.8V, VCC = 15V to 30V, VEE = Ground) unless otherwise specified. Parameter Symbol Test Conditions Group A Subgroupsa a. Commercial parts receive 100% testing at 25°C (Subgroups 1 an d 9). SMD and Class H parts receive 100% testing at 25°C, 125°C, and –55°C (Subgroups 1 and 9, 2 and 10, 3 and 11, respectively). Limits Unit Fig. Notes Min Typb b. All typical values at T A = 25°C and VCC – VEE = 30V, unless otherwise noted. Max Propagation Delay Time to High Output Level tPLH Rg = 47Ω, Cg = 3 nF, f = 10 kHz, Duty Cycle = 50% 9, 10, 11 0.10 0.30 0.50 μs 10, 11, 12, 13, 14, 23 c c. This load condition approximates the gate load of a 1200V/25A IGBT. Propagation Delay Time to Low Output Level tPHL 9, 10, 11 0.10 0.30 0.50 μs Pulse Width Distortion PWD 9, 10, 11 — — 0.3 μs d d. Pulse Width Distortion (PWD) is defined as |tPHL – tPLH| for any given device. Propagation Delay Difference Between Any Two Parts PDD (tPHL – tPLH) 9, 10, 11 –0.35 — 0.35 μs 33, 34 e e. The difference between t PHL and tPLH between any two HCPL-5150 parts under the same test condition. Rise Time t r —0 . 1 — μs 23 Fall Time t f —0 . 1 — μs UVLO Turn On Delay t UVLO ON VO > 5V, IF = 10 mA — 0.8 — μs 22 UVLO Turn Off Delay t UVLO OFF VO < 5V, IF = 10 mA — 0.6 — Output High-Level Common Mode Transient Immunity |CMH|I F = 10 mA, VCC = 30V VCM = 1000V, TA = 25°C 91 0 — — k V / μs 24 f, g, h f. Pins 1 and 4 need to be connected to LED common. g. Common mode transient immunity in the high state is the maximum tolerable |dV CM/dt| of the common mode pulse, VCM, to assure that the output remains in the high state (i.e., VO > 15.0V). h. Parameters are tested as part of device initial characterization and after design and process changes. Parameters are guaranteed to limits specified for all lots not specifically tested. Output Low-Level Common Mode Transient Immunity |CML|V CM = 1000V, VF = 0V, VCC = 30V, TA = 25°C 91 0 — — k V / μs f, i, h i. Common mode transient immunity in a low state is the maximum tolerable |dVCM/dt| of the common mode pulse, VCM, to assure that the output remains in a low state (i.e., VO < 1.0V).
- 7 - HCPL-5150 and HCPL-5151, DLA SMD 5962-04205 Data Sheet Package Characteristics Over recommended operating conditions (TA = –55°C to +125°C) unless otherwise specified. Parameter Symbol Test Conditions Group A Subgroupsa a. Commercial parts receive 100% testing at 25°C (Subgroups 1 and 9). SMD and Class H parts receive 100% testing at 25°C, 125°Cm and –55°C (Subgroups 1 and 9, 2 and 10, 3 and 11, respectively). Limits Unit Fig. Notes Min Typb b. All typical values at T A = 25°C and VCC – VEE = 30V, unless otherwise noted. Max Input-Output Leakage Current I I-O VI-O = 1500 Vdc RH ≤ 65%, t = 5s, TA = 25°C 1— — 1 . 0 μA c, d c. This is a momentary withstand test, not an operating condition. d. Device considered a two-terminal device : pins on input side shorted together and pins on output side shorted together. Resistance (Input-Output) R I-O VI-O = 500 Vdc — 1010 —Ω d Capacitance (Input-Output) C I-O f = 1 MHz — 2.34 — pF d
- 12 - HCPL-5150 and HCPL-5151, DLA SMD 5962-04205 Data Sheet Figure 23 tPLH, tPHL, tr, and tf Test Circuit and Waveforms Figure 24 CMR Test Circuit and Waveforms 0.1 μF V CC = 15 to 30 V 47 : IF = 10 to 18 mA V O
10 KHz
50% DUTY CYCLE 500 : 3 nF IF V OUT tPHLtPLH tftr 10% 50% 90% Tr = Tf < 10 ns_ 0.1 μF V CC = 30 V IF V O A B V CM = 1000 V 5 V V CM 0 V V O SWITCH AT B: IF = 0 mA V O SWITCH AT A: IF = 10 mA V OL V OH V CMdV dt
- 13 - HCPL-5150 and HCPL-5151, DLA SMD 5962-04205 Data Sheet Applications Information Eliminating Negative IGBT Gate Drive To keep the IGBT firmly off, the HCPL-515x has a very low maximum VOL specification of 1.0V. The HCPL-515x realizes this very low VOL by using a DMOS transistor with 4Ω (typical) on resistance in its pull down circuit. When the HCPL-515x is in the low state, the IGBT gate is shorted to the emitter by Rg + 4Ω. Minimizing Rg and the lead inductance from the HCPL-515x to the IGBT gate and emitter (possibly by mounting the HCPL-515x on a small PC board directly above the IGBT) can eliminate the need for negative IGBT gate drive in many applications as shown in Figure 25. Care should be taken with such a PC board design to avoid routing the IGBT collector or emitter traces close to the HCPL-515x input, as this can result in unwanted coupling of transient signals into the HCPL-515x and degrade performance. (If the IGBT drain must be routed near the HCPL-515x input, then the LED should be reverse-biased when in the off state, to prevent the transient signals coupled from the IGBT drain from turning on the HCPL-515x.) Selecting the Gate Resistor (Rg) to Minimize IGBT Switching Losses Step 1: Calculate Rg Minimum from the IOL Peak Specification. The IGBT and Rg in Figure 26 can be analyzed as a simple RC circuit with a voltage supplied by the HCPL-515x. The VOL value of 2V in the previous equation is a conservative value of VOL at the peak current of 0.6A (see Figure 6). At lower Rg values, the voltage supplied by the HCPL-515x is not an ideal voltage step. This results in lower peak currents (more margin) than predicted by this analysis. When negative gate drive is not used, V EE in the previous equation is equal to zero volts. Step 2: Check the HCPL-515x Power Dissipation and Increase Rg if Necessary. The HCPL-515x total power dissipation (PT) is equal to the sum of the emitter power (PE) and the output power. (PO): For the circuit in Figure 26 with IF (worst case) = 18 mA: Rg = 30.5Ω, Max Duty Cycle = 80%, Qg = 250 nC, f = 20 kHz and TA max = 125°C: The value of 4.25 mA for ICC in the previous equation was obtained by derating the ICC max of 5 mA (which occurs at –55°C) to ICC max at 125°C. Since PO for this case is greater than PO(MAX), Rg must be increased to reduce the HCPL-515x power dissipation. For Qg = 250 nC, from Figure 27, a value of ESW = 1.35 μJ gives a Rg = 90Ω. (V CC – V EE – V OL )R g = I OLPEAK (V CC – V EE – 1.7V)= I OLPEAK 0.6A = 30.5 : PT = P E + P O PE = I Fu VF u Duty Cycle PO = P O(BIAS) + P O (SWITCHIN G) = I CC u (V CC – V EE ) SW (Rg, Qg) u f+ E PE = 18 mA u1.8V u0.8 = 26 mW PO = 4.25 mA u 20V + 2.0 PJ u20 kHz = 85 mW + 40 mW = 125 mW > 112 mW (P O(MAX) at 125 C = 250 mW – 23 C u 6 mW/ C) o oo PO(SWITCHING MAX) = P O(MAX) – P O(BIAS) = 112 mW – 85 mW = 27 mW PO(SWITCHING MAX)E SW(MAX) = f 27 mW= = 1.35 PJ 20 kHz
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