TLV2460_16 TI1 | Alldatasheet
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Technical content
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 1WWW.TI.COM /C0068Rail-to-Rail Output Swing /C0068Gain Bandwidth Product. . . 6.4 MHz /C0068±80 mA Output Drive Capability /C0068Supply Current . . . 500 µA/channel /C0068Input Offset Voltage. . . 100 µV /C0068Input Noise Voltage...1 1 n V /√Hz /C0068Slew Rate. . . 1.6 V/µs /C0068Micropower Shutdown Mode (TLV2460/3/5). . . 0.3 µA/Channel /C0068Universal Operational Amplifier EVM /C0068Available in Q-Temp Automotive HighRel Automotive Applications Configuration Control/Print Support Qualification to Automotive Standards
description
The TLV246x is a family of low-power rail-to-rail input/output operational amplifiers specifically designed for portable applications. The input common-mode voltage range extends beyond the supply rails for maximum dynamic range in low-voltage systems. The amplifier output has rail-to-rail performance with high-output-drive capability, solving one of the limitations of older rail-to-rail input/output operational amplifiers. This rail-to-rail dynamic range and high output drive make the TLV246x ideal for buffering analog-to-digital converters. The operational amplifier has 6.4 MHz of bandwidth and 1.6 V/µs of slew rate with only 500 µA of supply current, providing good ac performance with low power consumption. Three members of the family offer a shutdown terminal, which places the amplifier in an ultralow supply current mode (I DD = 0.3 µA/ch). While in shutdown, the operational-amplifier output is placed in a high-impedance state. DC applications are also well served with an input noise voltage of 11 nV/√Hz and input offset voltage of 100 µV. This family is available in the low-profile SOT23, MSOP, and TSSOP packages. The TLV2460 is the first rail-to-rail input/output operational amplifier with shutdown available in the 6-pin SOT23, making it perfect for high-density circuits. The family is specified over an expanded temperature range (T A = −40°C to 125°C) for use in industrial control and automotive systems, and over the military temperature range A = −55°C to 125°C) for use in military systems. SELECTION GUIDE DEVICE VDD [V] VIO [µV] IDD /ch [µA] IIB [pA] GBW [MHz] SLEW RATE [V/µs] Vn, 1 kHz [nV/√Hz] IO [mA] SHUTDOWN RAIL-RAIL TLV246x(A) 2.7−6 150 550 1300 6.4 1.6 11 25 Y I/O TLV277x(A) 2.5−5.5 360 1000 2 5.1 10.5 17 6 Y O TLV247x(A) 2.7−6 250 600 2.5 2.8 1.5 15 20 Y I/O TLV245x(A) 2.7−6 20 23 500 0.22 0.11 52 10 Y I/O TLV225x(A) 2.7−8 200 35 1 0.2 0.12 19 3 — — TLV226x(A) 2.7−8 300 200 1 0.71 0.55 12 3 — — Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. /C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 Copyright 1998−2004, Texas Instruments Incorporated (TOP VIEW) 1OUT GND IN+ VDD+ IN− TLV2460 DBV PACKAGE
5 SHDN
/C0079/C0110 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0109/C0112/C0108/C0105/C0097/C0110/C0116 /C0116/C0111 /C0077/C0073/C0076/C0262/C0080/C0082/C0070/C0262/C0051/C0056/C0053/C0051/C0053/C0044 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115 /C0097/C0114/C0101 /C0116/C0101/C0115/C0116/C0101/C0100 /C0117/C0110/C0108/C0101/C0115/C0115 /C0111/C0116/C0104/C0101/C0114/C0119/C0105/C0115/C0101 /C0110/C0111/C0116/C0101/C0100/C0046 /C0079/C0110 /C0097/C0108/C0108 /C0111/C0116/C0104/C0101/C0114 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0115/C0044 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 Device TLV2465A is Obsolete
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 2 WWW.TI.COM TLV2460C/I/AI and TLV2461C/I/AI AVAILABLE OPTIONS VIOmax PACKAGED DEVICES TA VIOmax AT 25°C SMALL OUTLINE (D) SOT-23† (DBV) SYMBOL PLASTIC DIP (P) 0°C to 70°C 2000 µV TLV2460CD TLV2461CD TLV2460CDBV TLV2461CDBV VAOC VAPC TLV2460CP TLV2461CP −40°C to 125°C 2000 µV TLV2460ID TLV2461ID TLV2460IDBV TLV2461IDBV VAOI VAPI TLV2460IP TLV2461IP −40°C to 125°C 1500 µV TLV2460AID TLV2461AID TLV2460AIP TLV2461AIP † This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460CD R). ‡ Chip forms are tested at TA = 25°C only. TLV2460M/AM/Q/AQ and TLV2461M/AM/Q/AQ AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25°C SMALL OUTLINE † (D) SMALL OUTLINE † (PW) CERAMIC DIP (JG) CERAMIC FLATPACK (U) CHIP CARRIER (FK) −40°C to 125°C 2000 µV TLV2460QD TLV2461QD TLV2460QPW TLV2461QPW −40°C to 125°C 1500 µV TLV2460AQD TLV2461AQD TLV2460AQPW TLV2461AQPW −55°C to 125°C 2000 µV — TLV2460MJG TLV2461MJG TLV2460MU TLV2461MU TLV2460MFK TLV2461MFK −55°C to 125°C 1500 µV — TLV2460AMJG TLV2461AMJG TLV2460AMU TLV2461AMU TLV2460AMFK TLV2461AMFK † This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460QDR). TLV2462C/I/AI and TLV2463C/I/AI AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25°C SMALL OUTLINE † (D) MSOP (DGK) SYMBOL MSOP † (DGS) SYMBOL PLASTIC DIP (N) PLASTIC DIP (P) 0°C to 70°C 2000 µV TLV2462CD TLV2463CD TLV2462CDGK xxTIAAI — TLV2463CDGS xxTIAAK TLV2463CN TLV2462CP −40°C to 2000 µV TLV2462ID TLV2463ID TLV2462IDGK xxTIAAJ — TLV2463IDGS xxTIAAL TLV2463IN TLV2462IP —−40 C to 125°C 1500 µV TLV2462AID TLV2463AID TLV2463AIN TLV2462AIP † This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462CDR). ‡ Chip forms are tested at TA = 25°C only. Device TLV2465A is Obsolete
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 3WWW.TI.COM TLV2462M/AM/Q/AQ and TLV2463M/AM/Q/AQ AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25°C SMALL OUTLINE † (D) SMALL OUTLINE † (PW) CERAMIC DIP (JG) CERAMIC DIP (J) CERAMIC FLATPACK (U) CHIP CAR- RIER (FK) −40°C to 125°C 2000 µV TLV2462QD TLV2463QD TLV2462QPW TLV2463QPW −40°C to 125°C 1500 µV TLV2462AQD TLV2463AQD TLV2462AQPW TLV2463AQPW −55°C to 125°C 2000 µV — TLV2462MJG TLV2463MJ TLV2462MU TLV2462MFK TLV2463MFK −55°C to 125°C 1500 µV — TLV2462AMJG TLV2463AMJ TLV2462AMU TLV2462AMFK TLV2463AMFK † This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462QDR). TLV2464C/I/AI and TLV2465C/I/AI AVAILABLE OPTIONS VIOmax PACKAGED DEVICES TA VIOmax AT 25°C SMALL OUTLINE (D) PLASTIC DIP (N) TSSOP (PW) 0°C to 70°C 2000 µV TLV2464CD TLV2465CD TLV2464CN TLV2465CN TLV2464CPW TLV2465CPW −40°C to 125°C 2000 µV TLV2464ID TLV2465ID TLV2464IN TLV2465IN TLV2464IPW TLV2465IPW −40°C to 125°C 1500 µV TLV2464AID TLV2465AID TLV2464AIN TLV2465AIN TLV2464AIPW TLV2465AIPW † This package is available taped and reeled. To order this packaging option, add an R suffix to the part number(e.g., TLV2464CDR). ‡ Chip forms are tested at TA = 25°C only. TLV2464M/AM/Q/AQ and TLV2465M/AM/Q/AQ AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25°C SMALL OUTLINE † (D) SMALL OUTLINE † (PW) CERAMIC DIP (J) CHIP CARRIER (FK) -40°C to 125°C 2000 µV TLV2464QD TLV2465QD TLV2464QPW TLV2465QPW -40°C to 125°C 1500 µV TLV2464AQD TLV2465AQD TLV2464AQPW TLV2465AQPW −55°C to 125°C 2000 µV — TLV2464MJ TLV2465MJ TLV2464MFK TLV2465MFK −55°C to 125°C 1500 µV — TLV2464AMJ TLV2465AMJ TLV2464AMFK TLV2465AMFK † This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2464QDR). Device TLV2465A is Obsolete
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 4 WWW.TI.COM TLV246x PACKAGE PINOUTS (1) 1OUT 1IN− 1IN+ GND 1SHDN VDD + 2OUT 2IN− 2IN+ 2SHDN (TOP VIEW) 1OUT GND IN+ VDD+ IN− TLV2461 DBV PACKAGE (TOP VIEW) 1OUT GND IN+ VDD+ IN− TLV2460 DBV PACKAGE (TOP VIEW) NC − No internal connection (1) SOT−23 may or may not be indicated 1OUT 1IN− 1IN+ GND NC 1SHDN NC VDD + 2OUT 2IN− 2IN+ NC 2SHDN NC (TOP VIEW) TLV2463 D, N, J, OR PW PACKAGE 1OUT 1IN− 1IN+ VDD + 2IN+ 2IN− 2OUT 4OUT 4IN− 4IN+ GND 3IN+ 3IN− 3OUT (TOP VIEW) TLV2464 D, N, PWP, J, OR PW PACKAGE 1OUT 1IN− 1IN+ VDD + 2IN+ 2IN− 2OUT 1/2SHDN 4OUT 4IN− 4IN+ GND 3IN+ 3IN− 3OUT 3/4SHDN (TOP VIEW) TLV2465 D, N, PWP, J, OR PW PACKAGE 1OUT 1IN− 1IN+ GND VDD + 2OUT 2IN− 2IN+ TLV2462 D, DGK, P, JG, OR PW PACKAGE (TOP VIEW) NC IN− IN+ GND SHDN VDD + OUT NC TLV2460 D, P, JG, OR PW PACKAGE (TOP VIEW) NC IN− IN+ GND NC VDD + OUT NC TLV2461 D, P, JG, OR PW PACKAGE (TOP VIEW) TYPICAL PIN 1 INDICATORS Printed or Molded Dot Bevel Edges Pin 1 Molded ”U” Shape Pin 1 Stripe Pin 1 Pin 1 Device TLV2465A is Obsolete
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 5WWW.TI.COM TLV246x PACKAGE PINOUTS (continued) (1) NC NC IN− IN+ GND NC SHDN VDD OUTPUT NC TLV2460 U PACKAGE (TOP VIEW) NC 1OUT 1IN− 1IN+ GND NC VDD+ 2OUT 2IN− 2IN+ TLV2462 U PACKAGE (TOP VIEW) NC NC IN− IN+ GND NC NC V DD OUTPUT NC TLV2461 U PACKAGE (TOP VIEW) 19 20 132 1312119 10 NC VDD NC OUT NC NC IN− NC IN+ NC NC NC NC SHDN NC GND NC NC NC NC TLV2460 FK PACKAGE (TOP VIEW) 19 20 132 1312119 10 NC VDD NC OUT NC NC IN− NC IN+ NC NC NC NC NC NC GND NC NC NC NC TLV2461 FK PACKAGE (TOP VIEW) 19 20 132 1312119 10 2IN− NC 2IN+ NC NC 1IN+ NC GND NC NC 1IN− 1OUT NC V 2OUT NC NC NC NC NC TLV2462 FK PACKAGE (TOP VIEW) DD 19 20 132 1312119 10 2IN− NC 2IN+ NC NC 1IN+ NC GND NC NC 1IN− 1OUT NC V 2OUT NC NC NC 2SHDN 1SHDN TLV2463 FK PACKAGE (TOP VIEW) DD TLV2464 FK PACKAGE (TOP VIEW) 19 20 132 1312119 10 4IN+ NC GND NC 3IN+ 1IN+ NC V DD+ NC 2IN+ 1IN− 1OUT NC 4OUT 4IN− 2OUT NC 3OUT 3IN− 2IN− 19 20 132 1312119 10 4IN+ GND NC 3IN+ 3IN− 1IN+ V DD+ NC 2IN+ 2IN− 1IN− 1OUT NC 4OUT 4IN− 1/2SHDN NC 3/4SHDN 3OUT 2OUT TLV2465 FK PACKAGE (TOP VIEW) NC − No internal connection (1) SOT−23 may or may not be indicated Device TLV2465A is Obsolete
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 6 WWW.TI.COM absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltage values, except differential voltages, are with respect to GND. DISSIPATION RATING TABLE FOR C and I SUFFIX PACKAGE θJC θJA TA ≤ 25°C TA < 125°CPACKAGE θJC (°C/W) θJA (°C/W) TA ≤ 25C POWER RATING TA < 125C POWER RATING D (8) 38.3 176 710 mW 142 mW D (14) 26.9 122.6 1022 mW 204.4 mW D (16) 25.7 114.7 1090 mW 218 mW DBV (5) 55 324.1 385 mW 77.1 mW DBV (6) 55 294.3 425 mW 84.9 mW DGK 54.2 259.9 481 mW 96.2 mW DGS 54.1 257.7 485 mW 97 mW N (14, 16) 32 78 1600 mW 320.5 mW P (8) 41 104 1200 mW 240.4 mW PW (14) 29.3 173.6 720 mW 144 mW PW (16) 28.7 161.4 774 mW 154.9 mW NOTE: Thermal resistances are not production tested and are for informational purposes only. DISSIPATION RATING TABLE FOR Q and M SUFFIX PACKAGE TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C TA = 125°CPACKAGE TA ≤ 25C POWER RATING DERATING FACTOR ABOVE T A = 25°C ‡ TA = 70C POWER RATING TA = 85C POWER RATING TA = 125C POWER RATING FK 1375 mW 11.0 mW/°C 880 mW 715 mW 275 mW JG 1050 mW 8.4 mW/°C 672 mW 546 mW 210 mW U 675 mW 5.4 mW/°C 432 mW 350 mW 135 mW ‡ This is the inverse of the traditional junction-to-ambient thermal resistance (RΘJA). Thermal resistances are not production tested and are for informational purposes only. Device TLV2465A is Obsolete
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 7WWW.TI.COM recommended operating conditions MIN MAX UNIT Supply voltage, VDD Single supply 2.7 6 VSupply voltage, VDD Split supply ±1.35 ±3 V Common-mode input voltage range, VICR 0 VDD V C-suffix 0 70 Operating free-air temperature, TA I-suffix and Q-suffix −40 125 °COperating free-air temperature, TA M-suffix −55 125 C Shutdown on/off voltage level‡ VIH 2 VShutdown on/off voltage level‡ VIL 0.7 V ‡ Relative to voltage on the GND terminal of the device. electrical characteristics at specified free-air temperature, VDD = 3 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA † MIN TYP MAX UNIT V = 3 V, 25°C 500 2000 VIO Input offset voltage VDD = 3 V, VIC = 1.5 V, Full range 2200 VVIO Input offset voltage DD VIC = 1.5 V, VO = 1.5 V, TLV246xA 25°C 500 1500 µV VO = 1.5 V, R S = 50 Ω TLV246xA Full range 1700 αVIO Temperature coefficient of input offset voltage R S = 50 Ω 2 µV/°C 25°C 2.8 7 IIO Input offset current VDD = 3 V, TLV246xC Full range 20 nAIIO Input offset current VDD = 3 V, VIC = 1.5 V, TLV246xI/Q/M Full range 75 nA VIC = 1.5 V, VO = 1.5 V, R = 50 25°C 4.4 14 IIB Input bias current VO = 1.5 V, R S = 50 Ω TLV246xC Full range 25 nAIIB Input bias current TLV246xI/Q/M Full range 75 nA IOH = −2.5 mA 25°C 2.9 VOH High-level output voltage IOH = −2.5 mA Full range 2.8 VVOH High-level output voltage IOH = −10 mA 25°C 2.7 V IOH = −10 mA Full range 2.5 VIC = 1.5 V, IOL = 2.5 mA 25°C 0.1 VOL Low-level output voltage VIC = 1.5 V, IOL = 2.5 mA Full range 0.2 VVOL Low-level output voltage VIC = 1.5 V, IOL = 10 mA 25°C 0.3 V VIC = 1.5 V, IOL = 10 mA Full range 0.5 Sourcing 25°C 50 IOS Short-circuit output current Sourcing Full range 20 mAIOS Short-circuit output current Sinking 25°C 40 mA Sinking Full range 20 IO Output current Measured 1 V from rail 25°C ±40 mA AVD Large-signal differential voltage R L = 10 kΩ VO(PP) = 1 V 25°C 90 105 dBAVD Large-signal differential voltage amplification R L = 10 kΩ, VO(PP) = 1 V Full range 89 dB ri(d) Differential input resistance 25°C 109 Ω † Full range is 0°C to 70°C for the C suffix, −40°C to 125°C for the I and Q suffixes, and −55°C to 125°C for the M suffix. Device TLV2465A is Obsolete
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 8 WWW.TI.COM electrical characteristics at specified free-air temperature, VDD = 3 V (unless otherwise noted) (continued) PARAMETER TEST CONDITIONS TA † MIN TYP MAX UNIT ci(c) Common-mode input capacitance f = 10 kHz 25°C 7 pF zo Closed-loop output impedance f = 100 kHz, AV = 10 25°C 33 Ω VICR = 0 to 3 V, 25°C 66 80 CMRR Common-mode rejection ratio VICR = 0 to 3 V, R S = 50Ω TLV246xC Full range 64 dBCMRR Common-mode rejection ratio R S = 50Ω TLV246xI/Q/M Full range 60 dB VDD = 2.7 V to 6 V, VIC = VDD /2, 25°C 80 85 kSVR Supply voltage rejection ratio VDD = 2.7 V to 6 V, No load VIC = VDD /2, Full range 75 dBkSVR Supply voltage rejection ratio (∆VDD /∆VIO) VDD = 3 V to 5 V, VIC = VDD /2, 25°C 85 95 dB( VDD /VIO) VDD = 3 V to 5 V, No load VIC = VDD /2, Full range 80 IDD Supply current (per channels) VO = 1.5 V, No load 25°C 0.5 0.575 mAIDD Supply current (per channels) VO = 1.5 V, No load Full range 0.9 mA IDD(SHDN) Supply current in shutdown SHDN < 0.7 V, 25°C 0.3 AIDD(SHDN ) Supply current in shutdown (TLV2460, TLV2463, TLV2465) SHDN < 0.7 V, Per channel in shutdown Full range 2.5 µA † Full range is 0°C to 70°C for the C suffix, −40°C to 125°C for the I and Q suffixes, and −55°C to 125°C for the M suffix. operating characteristics at specified free-air temperature, VDD = 3 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA † MIN TYP MAX UNIT VO(PP) = 0.8 V, C L = 160 pF, 25°C 0.9 1.6 SR Slew rate at unity gain VO(PP) = 0.8 V, R L = 10 kΩ C L = 160 pF, Full range 0.8 V/µs Vn Equivalent input noise voltage f = 100 Hz 25°C 16 nV/√HzVn Equivalent input noise voltagef = 1 kHz 25°C 11 nV/√Hz In Equivalent input noise currentf = 1 kHz 25°C 0.13 pA/√Hz Total harmonic distortion plusVO(PP) = 2 V, AV = 1 0.006% THD + N Total harmonic distortion plus noise VO(PP) = 2 V, R L = 10 kΩ, f = 1 kHz AV = 10 25°C 0.02%THD + N noise R L = 10 kΩ, f = 1 kHz AV = 100 25 C 0.08% Both channels 7.6 t(on) Amplifier turnon time AV = 1, RL = 10 kΩ Channel 1 only, Channel 2 on 25°C 7.65 µs Both channels 333 t(off) Amplifier turnoff time AV = 1, RL = 10 kΩ Channel 1 only, Channel 2 on 25°C 328 nst(off) Amplifier turnoff time AV = 1, RL = 10 kΩ Channel 2 only, Channel 1 on 25 C 329 ns Gain-bandwidth product f = 10 kHz, CL = 160 pF R L = 10 kΩ, 25°C 5.2 MHz V(STEP)PP = 2 V, AV = −1, CL = 10 pF, 0.1% 1.47 ts Settling time (STEP)PP AV = −1, CL = 10 pF, R L = 10 kΩ 0.01% 25°C 1.78 sts Settling time V(STEP)PP = 2 V, AV = −1, CL = 56 pF, 0.1% 25°C 1.77 µs (STEP)PP AV = −1, CL = 56 pF, R L = 10 kΩ 0.01% 1.98 φm Phase margin at unity gain R L = 10 kΩ, C L = 160 pF 25°C 44° Gain margin R L = 10 kΩ, C L = 160 pF 25°C 7 dB † Full range is 0°C to 70°C for the C suffix, −40°C to 125°C for the I and Q suffixes, and −55°C to 125°C for the M suffix. Device TLV2465A is Obsolete
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 9WWW.TI.COM electrical characteristics at specified free-air temperature, VDD = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA † MIN TYP MAX UNIT 25°C 500 2000 VIO Input offset voltage VDD = 5 V, Full range 2200 VVIO Input offset voltage VDD = 5 V, VIC = 2.5, TLV246xA 25°C 500 1500 µVVIC = 2.5, VO = 2.5 V, R S = 50 Ω TLV246xA Full range 1700 VIO Temperature coefficient of input off- O R S = 50 Ω 25°C 2 V/°CαVIO Temperature coefficient of input off- set voltage 25°C 2 µV/°C 25°C 0.3 7 IIO Input offset current VDD = 5 V, TLV246xC Full range 15 nAIIO Input offset current VDD = 5 V, VIC = 2.5 V, TLV246xI/Q/M Full range 60 nA VIC = 2.5 V, VO = 2.5 V, R = 50 25°C 1.3 14 IIB Input bias current VO = 2.5 V, R S = 50 Ω TLV246xC Full range 30 nAIIB Input bias current TLV246xI/Q/M Full range 60 nA IOH = −2.5 mA 25°C 4.9 VOH High-level output voltage IOH = −2.5 mA Full range 4.8 VVOH High-level output voltage IOH = −10 mA 25°C 4.8 V IOH = −10 mA Full range 4.7 VIC = 2.5 V, IOL = 2.5 mA 25°C 0.1 VOL Low-level output voltage VIC = 2.5 V, IOL = 2.5 mA Full range 0.2 VVOL Low-level output voltage VIC = 2.5 V, IOL = 10 mA 25°C 0.2 V VIC = 2.5 V, IOL = 10 mA Full range 0.3 Sourcing 25°C 145 IOS Short-circuit output current Sourcing Full range 60 mAIOS Short-circuit output current Sinking 25°C 100 mA Sinking Full range 60 IO Output current Measured at 1 V from rail 25°C ±80 mA AVD Large-signal differential voltage VIC = 2.5 V, R L = 10 kΩ, 25°C 92 109 dBAVD Large-signal differential voltage amplification VIC = 2.5 V, VO = 1 V to 4 V R L = 10 kΩ, Full range 90 dB ri(d) Differential input resistance 25°C 109 Ω ci(c) Common-mode input capacitance f = 10 kHz 25°C 7 pF zo Closed-loop output impedance f = 100 kHz, AV = 10 25°C 29 Ω VICR = 0 V to 5 V, 25°C 71 85 CMRR Common-mode rejection ratio VICR = 0 V to 5 V, R S = 50Ω TLV246xC Full range 69 dBCMRR Common-mode rejection ratio R S = 50Ω TLV246xI/Q/M Full range 60 dB VDD = 2.7 V to 6 V, VIC = VDD /2, 25°C 80 85 dB kSVR Supply voltage rejection ratio VDD = 2.7 V to 6 V, No load VIC = VDD /2, Full range 75 dB kSVR Supply voltage rejection ratio (∆VDD /∆VIO) VDD = 3 V to 5 V, VIC = VDD /2, 25°C 85 95 dB ( VDD /VIO) VDD = 3 V to 5 V, No load VIC = VDD /2, Full range 80 dB IDD Supply current (per channel) VO = 2.5 V, No load, 25°C 0.55 0.65 mAIDD Supply current (per channel) V O = 2.5 V, No load, Full range 1 mA IDD(SHDN) Supply current in shutdown SHDN < 0.7 V, Per channels in 25°C 1 AIDD(SHDN ) Supply current in shutdown (TLV2460, TLV2463, TLV2465) SHDN < 0.7 V, Per channels in shutdown Full range 3 µA † Full range is 0°C to 70°C for the C suffix, −40°C to 125°C for the I and Q suffixes, and −55°C to 125°C for the M suffix. Device TLV2465A is Obsolete
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 10 WWW.TI.COM operating characteristics at specified free-air temperature, VDD = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA † MIN TYP MAX UNIT VO(PP) = 2 V, C L = 160 pF, 25°C 0.9 1.6 SR Slew rate at unity gain VO(PP) = 2 V, R L = 10 kΩ C L = 160 pF, Full range 0.8 V/µs Vn Equivalent input noise voltage f = 100 Hz 25°C 14 nV/√HzVn Equivalent input noise voltage f = 1 kHz 25°C 11 nV/√Hz In Equivalent input noise current f = 100 Hz 25°C 0.13 pA/√Hz VO(PP) = 4 V, AV = 1 0.004% THD + N Total harmonic distortion plus noise VO(PP) = 4 V, R L = 10 kΩ, f = 10 kHz AV = 10 25°C 0.01%THD + N Total harmonic distortion plus noiseR L = 10 kΩ, f = 10 kHz AV = 100 25 C 0.04% Both channels 7.6 t(on) Amplifier turnon time AV = 1, RL = 10 kΩ Channel 1 only, Channel 2 on 25°C 7.65 µst(on) Amplifier turnon time AV = 1, RL = 10 kΩ Channel 2 only, Channel 1 on 25 C 7.25 µs Both channels 333 t(off) Amplifier turnoff time AV = 1, RL = 10 kΩ Channel 1 only, Channel 2 on 25°C 328 nst(off) Amplifier turnoff time AV = 1, RL = 10 kΩ Channel 2 only, Channel 1 on 25 C 329 ns Gain-bandwidth product f = 10 kHz, C L = 160 pF R L = 10 kΩ, 25°C 6.4 MHz V(STEP)PP = 2 V, AV = −1, 0.1% 1.53 ts Settling time AV = −1, C L = 10 pF, R L = 10 kΩ 0.01% 25°C 1.83 sts Settling time V(STEP)PP = 2 V, AV = −1, 0.1% 25°C 3.13 µs AV = −1, C L = 56 pF, R L = 10 kΩ 0.01% 3.33 φm Phase margin at unity gain R L = 10 kΩ, C L = 160 pF 25°C 45° Gain margin R L = 10 kΩ, C L = 160 pF 25°C 7 dB † Full range is 0°C to 70°C for the C suffix, −40°C to 125°C for the I and Q suffixes, and −55°C to 125°C for the M suffix. Device TLV2465A is Obsolete
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 11WWW.TI.COM TYPICAL CHARACTERISTICS Table of Graphs FIGURE VIO Input offset voltage vs Common-mode input voltage 1, 2 IIB Input bias current vs Free-air temperature 3, 4 IIO Input offset current vs Free-air temperature 3, 4 VOH High-level output voltage vs High-level output current 5, 6 VOL Low-level output voltage vs Low-level output current 7, 8 VO(PP) Peak-to-peak output voltage vs Frequency 9, 10 Open-loop gain vs Frequency 11, 12 Phase vs Frequency 11, 12 AVD Differential voltage amplification vs Load resistance 13 Capacitive load vs Load resistance 14 Zo Output impedance vs Frequency 15, 16 CMRR Common-mode rejection ratio vs Frequency 17 kSVR Supply-voltage rejection ratio vs Frequency 18, 19 IDD Supply current vs Supply voltage 20 IDD Supply current vs Free-air temperature 21 Amplifier turnon characteristics 22 Amplifier turnoff characteristics 23 Supply current turnon 24 Supply current turnoff 25 Shutdown supply current vs Free-air temperature 26 SR Slew rate vs Supply voltage 27 Vn Equivalent input noise voltage vs Frequency 28, 29 Vn Equivalent input noise voltage vs Common-mode input voltage 30, 31 THD Total harmonic distortion vs Frequency 32, 33 THD+N Total harmonic distortion plus noise vs Peak-to-peak signal amplitude 34, 35 vs Frequency 11, 12 φm Phase margin vs Load capacitance 36φm Phase margin vs Free-air temperature 37 Gain bandwidth product vs Supply voltage 38 Gain bandwidth product vs Free-air temperature 39 Large signal follower 40, 41 Small signal follower 42, 43 Inverting large signal 44, 45 Inverting small signal 46, 47 Device TLV2465A is Obsolete
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 24 WWW.TI.COM TYPICAL CHARACTERISTICS Figure 44 VO − Voltage − V VDD = 3 V VI(PP) = 1 V VI = 1.5 V R L = 10 kΩ C L = 160 pF AV = −1 TA = 25°C 1.1 0.5 0.9 0.7 −0.2 0 0.2 0.4 1 t − Time − µs 0.8 0.6 1.2 1.4 INVERTING LARGE SIGNAL 1.9 1.5 1.7 1.3 1.6 1.8 2.3
2.1 Input
VDD = 5 V VI(PP) = 2 V VI = 2.5 V R L = 10 kΩ C L = 160 pF AV = −1 TA = 25°C 2.5 1.5 −0.2 0 0.2 0.4 1 t − Time − µs 0.8 0.6 1.2 1.4 INVERTING LARGE SIGNAL 3.5 1.6 1.8 Input Output VO − Voltage − V Figure 46 VO − Voltage − V 1.5 1.4 1.45 −0.2 0 0.2 0.4 1 t − Time − µs 0.8 0.6 1.2 1.4 INVERTING SMALL SIGNAL 1.6 1.55 Input Output 1.6 1.8 VDD = 3 V VI(PP) = 100 mV VI = 1.5 V R L = 10 kΩ C L = 160 pF AV = −1 TA = 25°C Figure 47 VO − Voltage − V 2.5 2.4 2.45 −0.2 0 0.2 0.4 1 t − Time − µs 0.8 0.6 1.2 1.4 INVERTING SMALL SIGNAL 2.6 2.55 Input Output 1.6 1.8 VDD = 5 V VI(PP) = 100 mV VI = 2.5 V R L = 10 kΩ C L = 160 pF AV = −1 TA = 25°C Device TLV2465A is Obsolete
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 27WWW.TI.COM
APPLICATION INFORMATION
Three members of the TLV246x family (TLV2460/3/5) have a shutdown terminal for conserving battery life in portable applications. When the shutdown terminal is tied low, the supply current is reduced to 0.3 µA/channel, the amplifier is disabled, and the outputs are placed in a high impedance mode. To enable the amplifier, the shutdown terminal can either be left floating or pulled high. When the shutdown terminal is left floating, care should be taken to ensure that parasitic leakage current at the shutdown terminal does not inadvertently place the operational amplifier into shutdown. The shutdown terminal threshold is always referenced to V DD /2. Therefore, when operating the device with split supply voltages (e.g. ±2.5 V), the shutdown terminal needs to be pulled to VDD − (not GND) to disable the operational amplifier. The amplifier’s output with a shutdown pulse is shown in Figures 22, 23, 24, and 25. The amplifier is powered with a single 5-V supply and configured as a noninverting configuration with a gain of 5. The amplifier turnon and turnoff times are measured from the 50% point of the shutdown pulse to the 50% point of the output waveform. The times for the single, dual, and quad are listed in the data tables. circuit layout considerations To achieve the levels of high performance of the TLV246x, follow proper printed-circuit board design techniques. A general set of guidelines is given in the following. /C0068Ground planes − It is highly recommended that a ground plane be used on the board to provide all components with a low inductive ground connection. However, in the areas of the amplifier inputs and output, the ground plane can be removed to minimize the stray capacitance. /C0068Proper power supply decoupling − Use a 6.8-µF tantalum capacitor in parallel with a 0.1-µF ceramic capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers depending on the application, but a 0.1-µF ceramic capacitor should always be used on the supply terminal of every amplifier. In addition, the 0.1-µF capacitor should be placed as close as possible to the supply terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less effective. The designer should strive for distances of less than 0.1 inches between the device power terminals and the ceramic capacitors. /C0068Sockets − Sockets can be used but are not recommended. The additional lead inductance in the socket pins will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board is the best implementation. /C0068Short trace runs/compact part placements − Optimum high performance is achieved when stray series inductance has been minimized. To realize this, the circuit layout should be made as compact as possible, thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of the amplifier. Its length should be kept as short as possible. This will help to minimize stray capacitance at the input of the amplifier. /C0068Surface-mount passive components − Using surface-mount passive components is recommended for high performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be kept as short as possible. Device TLV2465A is Obsolete
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 28 WWW.TI.COM general power dissipation considerations For a given θJA, the maximum power dissipation is shown in Figure 53 and is calculated by the following formula: P D /C0043/C0466 TMAX –TA /C0113JA /C0467 Where: PD = Maximum power dissipation of THS246x IC (watts) TMAX = Absolute maximum junction temperature (150°C) TA = Free-ambient air temperature (°C) θJA = θJC + θCA θJC = Thermal coefficient from junction to case θCA = Thermal coefficient from case to ambient air (°C/W) 0.75 0.5 −55−40 −25 −10 5 Maximum Power Dissipation − W 1.25 1.5 MAXIMUM POWER DISSIPATION vs FREE-AIR TEMPERATURE 1.75 20 35 50 0.25 TA − Free-Air Temperature − °C 65 80 95 110 125 Low-K Test PCB θJA = 260°C/W TJ = 150°CPDIP Package Low-K Test PCB θJA = 104°C/W Low-K Test PCB θJA = 176°C/W Low-K Test PCB θJA = 324°C/W NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB. Figure 53. Maximum Power Dissipation vs Free-Air Temperature
/C0084/C0076/C0086/C0050/C0052/C0054/C0048/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0049/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0050/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0051/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0052/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0053/C0044 /C0084/C0076/C0086/C0050/C0052/C0054/C0120/C0065 /C0070/C0065/C0077/C0073/C0076/C0089 /C0079/C0070 /C0076/C0079/C0087/C0262/C0080/C0079/C0087/C0069/C0082 /C0082/C0065/C0073/C0076/C0262/C0084/C0079/C0262/C0082/C0065/C0073/C0076 /C0073/C0078/C0080/C0085/C0084/C0047/C0079/C0085/C0084/C0080/C0085/C0084 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0083/C0072/C0085/C0084/C0068/C0079/C0087/C0078 SLOS220J − JULY 1998 − REVISED FEBRUARY 2004 29WWW.TI.COM Macromodel information provided was derived using MicrosimParts Release 8, the model generation software used with Microsim PSpice. The Boyle macromodel (see Note 2) and subcircuit in Figure 54 are generated using the TLV246x typical electrical and operating characteristics at TA = 25°C. Using this information, output simulations of the following key parameters can be generated to a tolerance of 20% (in most cases): /C0068Maximum positive output voltage swing /C0068Maximum negative output voltage swing /C0068Slew rate /C0068Quiescent power dissipation /C0068Input bias current /C0068Open-loop voltage amplification /C0068Unity-gain frequency /C0068Common-mode rejection ratio /C0068Phase margin /C0068DC output resistance /C0068AC output resistance /C0068Short-circuit output current limit Journal of Solid-State Circuits, SC-9, 353 (1974). − + .SUBCKT TLV246X 1 2 3 4 5 C1 11 12 2.46034E−12 C2 6 7 10.0000E−12 CSS 10 99 443.21E−15 DC 5 53 DY DE 54 5 DY DLP 90 91 DX DLN 92 90 DX D P 43D X FB 7 99 POLY (5) VB VC VE VLP + VLN 0 21.600E6 −1E3 1E3 22E6 −22E6 GA 6 0 11 12 345.26E−6 GCM 0 6 10 99 15.4226E−9 ISS 10 4 DC 18.850E−6 HLIM 90 0 VLIM 1K J1 11 2 10 JX1 J2 12 1 10 JX2 R2 6 9 100.00E3 RD1 3 11 2.8964E3 RD2 3 12 2.8964E3 R01 8 5 5.6000 R02 7 99 6.2000 RP 3 4 8.9127 RSS 10 99 10.610E6 VB 9 0 DC 0 VC 3 53 DC .7836 VE 54 4 DC .7436 VLIM 7 8 DC 0 VLP 91 0 DC 117 VLN 0 92 DC 117 .MODEL DX D (IS=800.00E−18) .MODEL DY D (IS=800.00E−18 Rs = 1m Cjo=10p) .MODEL JX1 NJF (IS=1.0000E−12 BETA=6.3239E−3 + VTO=−1) .MODEL JX2 NJF (IS=1.0000E−12 BETA=6.3239E−3 + VTO=−1) .ENDS VDD+ RP IN − IN+ GND RD1 J1 J2 RSSISS RD2 DP VD DC EGND FB HLIM DLP DLN VLNVLP CSS VE DE OUT R2 6 VB GA VLIM RO1 RO2 GCM Figure 54. Boyle Macromodels and Subcircuit PSpice and Parts are trademarks of MicroSim Corporation.
Figure 54. Boyle Macromodels and Subcircuit (Continued)
www.ti.com 17-Dec-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples 5962-0051201QHA ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 0051201QHA TLV2460M 5962-0051203QHA ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 0051203QHA TLV2461M 5962-0051205QHA ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 0051205QHA TLV2462M 5962-0051206Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 0051206Q2A TLV2462A MFKB 5962-0051206QHA ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 0051206QHA TLV2462AM 5962-0051206QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 0051206QPA TLV2462AM TLV2460AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2460AI TLV2460AIP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLV2460AI TLV2460AQD OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 TLV2460AQDR OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 TLV2460AQPW OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125 TLV2460AQPWR OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125 TLV2460CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2460C TLV2460CDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 VAOC TLV2460CDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 VAOC TLV2460CDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 VAOC TLV2460CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2460C TLV2460CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2460C
www.ti.com 17-Dec-2015 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLV2460CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2460C TLV2460CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TLV2460C TLV2460ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2460I TLV2460IDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 VAOI TLV2460IDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 VAOI TLV2460IDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 VAOI TLV2460IDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 VAOI TLV2460IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2460I TLV2460IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2460I TLV2460IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLV2460I TLV2460MUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 0051201QHA TLV2460M TLV2460QD OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 TLV2460QDR OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 TLV2460QPW OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125 TLV2460QPWR OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125 TLV2461AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2461AI TLV2461AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2461AI TLV2461AIP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLV2461AI TLV2461AIPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLV2461AI TLV2461AQD OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125
www.ti.com 17-Dec-2015 Addendum-Page 3 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLV2461AQDR OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 TLV2461AQPWR OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125 TLV2461CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2461C TLV2461CDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 VAPC TLV2461CDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 VAPC TLV2461CDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 VAPC TLV2461CDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 VAPC TLV2461CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2461C TLV2461CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2461C TLV2461CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2461C TLV2461CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TLV2461C TLV2461CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TLV2461C TLV2461ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2461I TLV2461IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 VAPI TLV2461IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 VAPI TLV2461IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 VAPI TLV2461IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 VAPI TLV2461IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2461I TLV2461IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2461I
www.ti.com 17-Dec-2015 Addendum-Page 4 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLV2461IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2461I TLV2461IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLV2461I TLV2461MUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 0051203QHA TLV2461M TLV2461QD OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 TLV2461QDR OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 TLV2461QPWR OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125 TLV2462AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462AI TLV2462AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462AI TLV2462AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462AI TLV2462AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462AI TLV2462AIP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLV2462AI TLV2462AMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 0051206Q2A TLV2462A MFKB TLV2462AMJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 TLV2462AMJG TLV2462AMJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 0051206QPA TLV2462AM TLV2462AMUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 0051206QHA TLV2462AM TLV2462AQD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 V2462A TLV2462AQDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V2462A TLV2462AQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V2462A
www.ti.com 17-Dec-2015 Addendum-Page 5 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLV2462AQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 V2462A TLV2462AQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V2462A TLV2462CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2462C TLV2462CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2462C TLV2462CDGK ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 AAI TLV2462CDGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AAI TLV2462CDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 AAI TLV2462CDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AAI TLV2462CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2462C TLV2462CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2462C TLV2462CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TLV2462CP TLV2462CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TLV2462CP TLV2462ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462I TLV2462IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462I TLV2462IDGK ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 AAJ TLV2462IDGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 AAJ TLV2462IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 AAJ TLV2462IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 AAJ
www.ti.com 17-Dec-2015 Addendum-Page 6 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLV2462IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462I TLV2462IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462I TLV2462IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLV2462IP TLV2462IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLV2462IP TLV2462MUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 0051205QHA TLV2462M TLV2462QDR OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 TLV2462QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 V2462Q TLV2462QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V2462Q TLV2463AIDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLV2463AI TLV2463AMJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 TLV2463AMJ TLV2463AQD OBSOLETE SOIC D 14 TBD Call TI Call TI -40 to 125 TLV2463AQDR OBSOLETE SOIC D 14 TBD Call TI Call TI -40 to 125 TLV2463AQPWR OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 125 TLV2463CD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TLV2463C TLV2463CDGS ACTIVE VSSOP DGS 10 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AAK TLV2463CDGSG4 ACTIVE VSSOP DGS 10 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AAK TLV2463CDGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AAK TLV2463CDGSRG4 ACTIVE VSSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AAK TLV2463CDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TLV2463C TLV2463CN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TLV2463CN
www.ti.com 17-Dec-2015 Addendum-Page 7 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLV2463ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLV2463I TLV2463IDGS ACTIVE VSSOP DGS 10 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 AAL TLV2463IDGSG4 ACTIVE VSSOP DGS 10 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 AAL TLV2463IDGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 AAL TLV2463IDGSRG4 ACTIVE VSSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 AAL TLV2463IN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLV2463IN TLV2463QD OBSOLETE SOIC D 14 TBD Call TI Call TI -40 to 125 TLV2463QDR OBSOLETE SOIC D 14 TBD Call TI Call TI -40 to 125 TLV2463QPWR OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 125 TLV2464AID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2464AI TLV2464AIDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2464AI TLV2464AIDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2464AI TLV2464AIDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2464AI TLV2464AIN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLV2464AIN TLV2464AIPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY2464A TLV2464AIPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY2464A TLV2464AIPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY2464A TLV2464CD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TLV2464C TLV2464CDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TLV2464C
www.ti.com 17-Dec-2015 Addendum-Page 8 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLV2464CDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TLV2464C TLV2464CDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TLV2464C TLV2464CN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TLV2464CN TLV2464CNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TLV2464CN TLV2464CPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TV2464 TLV2464CPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TV2464 TLV2464CPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TV2464 TLV2464ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLV2464I TLV2464IDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLV2464I TLV2464IDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLV2464I TLV2464IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLV2464I TLV2464IN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLV2464IN TLV2464IPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY2464 TLV2464IPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY2464 TLV2464IPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY2464 TLV2464IPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY2464 TLV2465CD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TLV2465C TLV2465CDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TLV2465C
www.ti.com 17-Dec-2015 Addendum-Page 9 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLV2465CPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 2465C TLV2465ID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLV2465I TLV2465IDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLV2465I TLV2465IDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLV2465I TLV2465IN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 TLV2465IN TLV2465IPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2465I TLV2465IPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2465I TLV2465IPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2465I (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
www.ti.com 17-Dec-2015 Addendum-Page 10 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLV2460, TLV2460A, TLV2460AM, TLV2460M, TLV2461, TLV2461A, TLV2461AM, TLV2461M, TLV2462, TLV2462A, TLV2462AM, TLV2462M, TLV2463, TLV2463A, TLV2463AM, TLV2463M, TLV2464A :
- Catalog: TLV2460A , TLV2460 , TLV2461A , TLV2461 , TLV2462A , TLV2462 , TLV2463A , TLV2463
- Automotive: TLV2460-Q1 , TLV2460A-Q1 , TLV2460A-Q1 , TLV2460-Q1 , TLV2461-Q1 , TLV2461A-Q1 , TLV2461A-Q1 , TLV2461-Q1 , TLV2462-Q1 , TLV2462A-Q1 , TLV2462A-Q1 , TLV2462-Q1 , TLV2463-Q1 , TLV2463A-Q1 , TLV2463A-Q1 , TLV2463-Q1 , TLV2464A-Q1
- Enhanced Product: TLV2462A-EP , TLV2462A-EP , TLV2464A-EP
- Military: TLV2460M , TLV2460AM , TLV2461M , TLV2461AM , TLV2462M , TLV2462AM , TLV2463M , TLV2463AM NOTE: Qualified Version Definitions:
- Catalog - TI's standard catalog product
- Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
- Enhanced Product - Supports Defense, Aerospace and Medical Applications
- Military - QML certified for Military and Defense Applications
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 21-Apr-2016 Pack Materials-Page 1
(mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 21-Apr-2016 Pack Materials-Page 2
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV2460AIDR SOIC D 8 2500 367.0 367.0 38.0 TLV2460AIDR SOIC D 8 2500 340.5 338.1 20.6 TLV2460CDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 TLV2460CDBVT SOT-23 DBV 6 250 180.0 180.0 18.0 TLV2460CDR SOIC D 8 2500 340.5 338.1 20.6 TLV2460IDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 TLV2460IDBVT SOT-23 DBV 6 250 180.0 180.0 18.0 TLV2460IDR SOIC D 8 2500 367.0 367.0 38.0 TLV2460IDR SOIC D 8 2500 340.5 338.1 20.6 TLV2461AIDR SOIC D 8 2500 340.5 338.1 20.6 TLV2461AIDR SOIC D 8 2500 367.0 367.0 38.0 TLV2461CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV2461CDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV2461CDR SOIC D 8 2500 340.5 338.1 20.6 TLV2461IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV2461IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV2461IDR SOIC D 8 2500 340.5 338.1 20.6 TLV2461IDR SOIC D 8 2500 367.0 367.0 38.0 TLV2462AIDR SOIC D 8 2500 340.5 338.1 20.6 TLV2462AQPWR TSSOP PW 8 2000 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 21-Apr-2016 Pack Materials-Page 3
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV2462AQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0 TLV2462CDGKR VSSOP DGK 8 2500 358.0 335.0 35.0 TLV2462CDGKR VSSOP DGK 8 2500 364.0 364.0 27.0 TLV2462CDR SOIC D 8 2500 340.5 338.1 20.6 TLV2462IDGKR VSSOP DGK 8 2500 364.0 364.0 27.0 TLV2462IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0 TLV2462IDR SOIC D 8 2500 340.5 338.1 20.6 TLV2462QPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLV2462QPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0 TLV2463AIDR SOIC D 14 2500 367.0 367.0 38.0 TLV2463CDGSR VSSOP DGS 10 2500 358.0 335.0 35.0 TLV2463CDR SOIC D 14 2500 367.0 367.0 38.0 TLV2463IDGSR VSSOP DGS 10 2500 358.0 335.0 35.0 TLV2464AIDR SOIC D 14 2500 333.2 345.9 28.6 TLV2464AIPWR TSSOP PW 14 2000 367.0 367.0 35.0 TLV2464CDR SOIC D 14 2500 333.2 345.9 28.6 TLV2464CPWR TSSOP PW 14 2000 367.0 367.0 35.0 TLV2464IDR SOIC D 14 2500 333.2 345.9 28.6 TLV2464IPWR TSSOP PW 14 2000 367.0 367.0 35.0 TLV2465CDR SOIC D 16 2500 367.0 367.0 38.0 TLV2465IDR SOIC D 16 2500 367.0 367.0 38.0 PACKAGE MATERIALS INFORMATION www.ti.com 21-Apr-2016 Pack Materials-Page 4
MCER001A – JANUARY 1995 – REVISED JANUARY 1997 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.310 (7,87) 0.290 (7,37) 0.014 (0,36) 0.008 (0,20) Seating Plane 4040107/C 08/96 0.065 (1,65) 0.045 (1,14) 0.020 (0,51) MIN 0.400 (10,16) 0.355 (9,00) 0.015 (0,38) 0.023 (0,58) 0.063 (1,60) 0.015 (0,38) 0.200 (5,08) MAX 0.130 (3,30) MIN 0.245 (6,22) 0.280 (7,11) 0.100 (2,54) 0°–15° NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a ceramic lid using glass frit. D. Index point is provided on cap for terminal identification. E. Falls within MIL STD 1835 GDIP1-T8
www.ti.com PACKAGE OUTLINE C TYP6.6 6.2
1.2 MAX
6X 0.65 8X 0.30 0.19 1.95 0.15 0.05 (0.15) TYP 0 - 8 0.25 GAGE PLANE 0.75 0.50 A NOTE 3 3.1 2.9 B NOTE 4 4.5 4.3 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. 1 8
0.1 C A B
0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800
www.ti.com EXAMPLE BOARD LAYOUT (5.8)
0.05 MAX
0.05 MIN
8X (1.5) 8X (0.45) 6X (0.65) (R ) TYP 0.05 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE SYMM SYMM LAND PATTERN EXAMPLE SCALE:10X 4 5 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED
www.ti.com EXAMPLE STENCIL DESIGN (5.8) 6X (0.65) 8X (0.45) 8X (1.5) (R ) TYP0.05 4221848/A 02/2015 TSSOP - 1.2 mm max heightPW0008A SMALL OUTLINE PACKAGE NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SYMM SYMM 4 5 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X
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