56F807E

56F807 FREESCALE | Alldatasheet

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16-bit Digital Signal Controllers freescale.com 56F807 Data Sheet Preliminary Technical Data DSP56F807 Rev. 15

56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 3 56F807 Block Diagram JTAG/ OnCE Port Digital Reg Analog Reg Low Voltage Supervisor Program Controller and Hardware Looping Unit Data ALU 16 x 16 + 36 → 36-Bit MAC Three 16-bit Input Registers Two 36-bit Accumulators Address Generation Unit Bit Manipulation Unit PLL Clock Gen 16-Bit 56800 Core PAB PDB XDB2 CGDB XAB1 XAB2 XTAL EXTAL INTERRUPT CONTROLS IPBB CONTROLS IPBus Bridge (IPBB) MODULE CONTROLS ADDRESS BUS [8:0] DATA BUS [15:0] COP RESET RESET IRQA IRQB Applica- tion-Specific Memory & Peripherals Interrupt Controller Program Memory 61440 x 16 Flash 2048 x 16 SRAM Boot Flash 2048 x 16 Flash Data Memory 8192 x 16 Flash 4096 x 16 SRAM COP/ Watchdog SPI or GPIO SCI0 or GPIO Quad Timer D / Alt Func Quad Timer C A/D1 A/D2 ADCA

6 PWM Outputs

6 28 1 0 * 3

• •
• • EXTBOOTCurrent Sense Inputs3 Quadrature Decoder 0 /Quad Timer CAN 2.0A/B CLKO External Address Bus Switch Bus Control External Data Bus Switch External Bus Interface Unit RD Enable WR Enable DS Select PS Select A[00:05] D[00:15] A[06:15] or GPIO-E2:E3 & GPIO-A0:A7

/Quad Timer B 4 SCI1 or GPIO2 Dedicated GPIO14 VPP RSTO A/D1 A/D2 ADCB VREF2 VREF *includes TCS pin which is reserved for factory use and is tied to VSS 56F807 General Description

• Up to 40 MIPS at 80MHz core frequency
• DSP and MCU functionality in a unified, C-efficient architecture
• Hardware DO and REP loops
• MCU-friendly instruction set supports both DSP and controller functions: MAC, bit manipulation unit, 14 addressing modes
• 60K × 16-bit words (120KB) Program Flash
• 2 K × 16-bit words (4KB) Program RAM
• 8 K × 16-bit words (16KB) Data Flash
• 4 K × 16-bit words (8KB) Data RAM
• 2 K × 16-bit words (4KB) Boot Flash
• Up to 64K × 16- bit words (128KB) each of external Program and Data memory
• Two 6 channel PWM Modules
• Four 4 channel, 12-bit ADCs
• Two Quadrature Decoders
• CAN 2.0 B Module
• Two Serial Communication Interfaces (SCIs)
• Serial Peripheral Interface (SPI)
• Up to four General Purpose Quad Timers
• JTAG/OnCE TM port for debugging
• 14 Dedicated and 18 Shared GPIO lines
• 160-pin LQFP or 160 MAPBGA Packages

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1.1 56F807 Features

1.1.1 Processing Core

• Efficient 16-bit 56800 family controller engine with dual Harvard architecture
• As many as 40 Million Instructions Pe r Second (MIPS) at 80MHz core frequency
• Single-cycle 16 × 16-bit parallel Multiplier-Accumulator (MAC)
• Two 36-bit accumulators including extension bits
• 16-bit bidirectional barrel shifter
• Parallel instruction set with un ique processor addressing modes
• Hardware DO and REP loops
• Three internal address buses and one external address bus
• Four internal data buses and one external data bus
• Instruction set supports both DSP and controller functions
• Controller style addressing modes and instructions for compact code
• Efficient C compiler and local variable support
• Software subroutine and interrupt stac k with depth limited only by memory
• JTAG/OnCE debug programming interface

1.1.2 Memory

• Harvard architecture permits as many as three simultaneous accesses to Program and Data memory
• On-chip memory including a low-cost, high-volume Flash solution —6 0 K × 16-bit words of Program Flash —2 K × 16-bit words of Program RAM —8 K × 16-bit words of Data Flash —4 K × 16-bit words of Data RAM —2 K × 16-bit words of Boot Flash
• Off-chip memory expansion ca pabilities programmable for 0, 4, 8, or 12 wait states — As much as 64K × 16 bits of Data memory — As much as 64K × 16 bits of Program memory

1.1.3 Peripheral Circuits for 56F807

• Two Pulse Width Modulator modules each with six PWM outputs, three Current Sense inputs, and four Fault inputs, fault tolerant design with dead time insertion, supports both center- and edge-aligned modes
• Four 12-bit, Analog-to-Digital Converters (ADCs), which support four simultaneous conversions with quad, 4-pin multiplexed inputs; ADC and PWM modules can be synchronized
• Two Quadrature Decoders each with fo ur inputs or two additional Quad Timers

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• Two dedicated General Purpose Quad Timers totaling six pins: Timer C with two pins and Timer D with four pins
• CAN 2.0 B Module with 2-pin port for transmit and receive
• Two Serial Communication In terfaces each with two pins (or four additional GPIO lines)
• Serial Peripheral Interface (SPI) with configur able 4-pin port (or four additional GPIO lines)
• Computer-Operating Properly (COP) Watchdog timer
• Two dedicated external interrupt pins
• 14 dedicated General Purpose I/O (GPIO) pins, 18 multiplexed GPIO pins
• External reset input pi n for hardware reset
• External reset output pin for system reset
• JTAG/On-Chip Emulation (OnCE™) for unobtrusi ve, processor speed-independent debugging
• Software-programmable, Phase Locked Loop-based frequency synthesizer for the controller core clock

1.1.4 Energy Information

• Fabricated in high-density CMOS with 5V-tolerant, TTL-compatible digital inputs
• Uses a single 3.3V power supply
• On-chip regulators for digital and analog circuitry to lower cost and reduce noise
• Wait and Stop modes available 1.2 56F807 Description The 56F807 is a member of the 56800 core-based family of processors. It combines, on a single chip, the processing power of a DSP and the functionality of a microcontroller with a flexible set of peripherals to create an extremely cost-effective solution. Because of its low cost, configuration flexibility, and compact program code, the 56F807 is well-suited for ma ny applications. The 56F807 includes many peripherals that are especially useful for app lications such as motion control, sm art appliances, st eppers, encoders, tachometers, limit switch es, power supply and contro l, automotive control, engine management, noise suppression, remote utility metering, industrial control for power, lighting, and automation. The 56800 core is based on a Harvard-style architectur e consisting of three execution units operating in parallel, allowing as many as six operations per instruction cycle. The MCU-style programming model and optimized instruction set allow stra ightforward generation of efficien t, compact DSP and control code. The instruction set is also highly efficient for C/C++ Compilers to enable rapid development of optimized control applications. The 56F807 supports program execution from either internal or external memories. Two data operands can be accessed from the on-ch ip Data RAM per instruction cycle. The 56F807 also provides two external dedicated interrupt lines and up to 32 General Purpose Input/Output (GPIO) lines, depending on peripheral configuration. The 56F807 controller includes 60K, 16- bit words of Program Flash and 8K words of Data Flash (each programmable through the JTAG port) with 2K words of Program RAM and 4K words of Data RAM. It also supports program execution from external memory.

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A total of 2K words of Boot Flas h is incorporated for easy custom er-inclusion of field-programmable software routines that can be us ed to program the main Program and Data Flas h memory areas. Both Program and Data Flash memories can be independently bulk erased or erased in page sizes of 256 words. The Boot Flash memory can also be either bulk or page erased. A key application-specific feature of the 56F807 is the inclusion of two Pulse Width Modulator (PWM) modules. These modules each incorporate three complementary, individually programmable PWM signal outputs (each module is also capable of supporting six independent PWM functions, for a total of 12 PWM outputs) to enhance motor control functionality. Complementary operation pe rmits programmable dead time insertion, distortion correction via current sensing by software, and separate top and bottom output polarity control. The up-counter value is progr ammable to support a cont inuously variable PWM frequency. Edge- and center-aligned synchronous pul se width control (0% to 100% modulation) is supported. The device is ca pable of controlling most motor type s: ACIM (AC Induction Motors), both BDC and BLDC (Brush and Brushless DC motors), SRM and VRM (S witched and Variable Reluctance Motors), and stepper motors. The PWMs incorporate fault protection and cycle-by-cycle current limiting with sufficient output drive capabi lity to directly drive standard optoisolators. A “smoke-inhibit”, write-once protection feature for key parameters is also included. A patented PWM waveform distortion correction circuit is also provided. Each PWM is double-buffered and includes interrupt controls to permit integral reload rates to be programmable from 1 to 16. The PWM m odules provide a reference output to synchronize the analog-to-digital converters. The 56F807 incorporates two separate Quadrature Decoders capable of capturing all four transitions on the two-phase inputs, permitti ng generation of a number proport ional to actual position. Speed computation capabilities accommodate both fast- and slow-moving shafts. An integrated watchdog timer in the Quadrature Decoder can be programmed with a time-out value to alar m when no shaft motion is detected. Each input is filtered to ensure only true transitions are recorded. This controller also provides a fu ll set of standard pr ogrammable peripherals th at include two Serial Communications Interfaces (SCI), one Serial Peripheral Inte rface (SPI), and four Quad Timers. Any of these interfaces can be used as General-Purpose Input/Outputs (GPIO) if that function is not required. A Controller Area Network interface (CAN Version 2.0 A/B-compliant), an internal interrupt controller, and 14 dedicated GPIO lines are also included on the 56F807.

1.3 State of the Art Development Environment

• Processor Expert TM (PE) provides a Rapid Application Design (RAD) tool that combines easy-to-use component-based software application creation with an expert knowledge system.
• The Code Warrior Integrated Development Environm ent is a sophisticated tool for code navigation, compiling, and debugging. A complete set of evaluation modules (EVMs) and development system cards will support concurrent engineering. Together, PE, Code Warrior and EVMs create a complete, scalable tools solution for easy, fast, and efficient development.

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1.4 Product Documentation

The four documents listed in Table 1-1 are required for a complete description and proper design with the 56F807. Documentation is available from local Freescal e distributors, Freescale Semiconductor sales offices, Freescale Literature Distribut ion Centers, or online at http://www.freescale.com.

1.5 Data Sheet Conventions

This data sheet uses the following conventions: Table 1-1 56F807 Chip Documentation Topic Description Order Number 56800E Family Manual Detailed description of the 56800 family architecture, and 16-bit core processor and the instruction set 56800EFM DSP56F801/803/805/807 User’s Manual Detailed description of memory, peripherals, and interfaces of the 56F801, 56F803, 56F805, and 56F807 DSP56F801-7UM 56F807 Technical Data Sheet Electrical and timing specifications, pin descriptions, and package descriptions (this document) DSP56F807 56F807 Errata Details any chip issues that might be present 56F807E OVERBAR This is used to indicate a signal that is active when pulled low. For example, the RESET pin is active when low. “asserted” A high true (active high) signal is high or a low true (active low) signal is low. “deasserted” A high true (active high) signal is low or a low true (active low) signal is high. Examples: Signal/Symbol Logic State Signal State Voltage 1. Values for V IL, VOL, VIH, and VOH are defined by individual product specifications. PIN True Asserted V IL/VOL PIN False Deasserted V IH/VOH PIN True Asserted V IH/VOH PIN False Deasserted V IL/VOL

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Part 2 Signal/Connection Descriptions

2.1 Introduction

The input and output signals of the 56F807 are organized into functional groups, as shown in Table 2-1 and as illustrated in Figure 2-1. In Table 2-2 through Table 2-19, each table row describes the signal or signals present on a pin. Table 2-1 Functional Group Pin Allocations Functional Group Number of Pins Detailed

Description

Power (VDD or VDDA)1 1 Table 2-2 Ground (VSS or VSSA)1 3 Table 2-3 Supply Capacitors & VPP 4 Table 2-4 PLL and Clock 3 Table 2-5 Address Bus1 16 Table 2-6 Data Bus 16 Table 2-7 Bus Control 4 Table 2-8 Interrupt and Program Control 5 Table 2-9 Dedicated General Purpose Input/Output 14 Table 2-10 Pulse Width Modulator (PWM) Ports 26 Table 2-11 Serial Peripheral Interface (SPI) Port1 1. Alternately, GPIO pins

4 Table 2-12

1. Alternately, Quad Timer pins

8 Table 2-13

Serial Communications Interface (SCI) Ports1 4 Table 2-15 CAN Port 2 Table 2-16 Analog to Digital Converter (ADC) Ports 20 Table 2-17 Quad Timer Module Ports 6 Table 2-18 JTAG/On-Chip Emulation (OnCE) 6 Table 2-19

56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 9 Figure 2-1 56F807 Signals Identified by Functional Group1 1. Alternate pin functionality is shown in parenthesis. 56F807 Power Port Ground Port Power Port Ground Port PLL and Clock External Address Bus or GPIO External Data Bus External Bus Control Dedicated GPIO SCI0 Port or GPIO SCI1 Port or GPI0 VDD VSS VDDA VSSA VCAPC VPP EXTAL XTAL CLKO A0-A5 A6-7 (GPIOE2-E3) A8-15 (GPIOA0-A7) D0–D15 PS DS RD WR PHASEA0 (TA0) PHASEB0 (TA1) INDEX0 (TA2) HOME0 (TA3) PHASEA1 (TB0) PHASEB1 (TB1) INDEX1 (TB2) HOME1 (TB3) TCK TMS TDI TDO TRST DE Quadrature Decoder or Quad Timer A JTAG/OnCE™ Port GPIOB0–7 GPIOD0–5 PWMA0-5 ISA0-2 FAULTA0-3 PWMB0-5 ISB0-2 FAULTB0-3 SCLK (GPIOE4) MOSI (GPIOE5) MISO (GPIOE6) SS (GPIOE7) TXD0 (GPIOE0) RXD0 (GPIOE1) TXD1 (GPIOD6) RXD1 (GPIOD7) ANA0-7 VREF ANB0-7 MSCAN_RX MSCAN_TX TC0-1 TD0-3 IRQA IRQB RESET RSTO EXTBOOT PWMB Port Quad Timers C & D ADCA Port ADCB Port Other Supply Ports 10* Interrupt/ Program Control Quadrature Decoder1 or Quad Timer B PWMA Port SPI Port or GPIO CAN *includes TCS pin which is reserved for factory use and is tied to VSS

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2.2 Power and Ground Signals

No. of Pins Signal Na me Signal Description

8 VDD Power—These pins provide power to the internal structures of the chip, and should

all be attached to VDD.

3 VDDA Analog Power—These pins is a dedicated power pin for the analog portion of the

chip and should be connected to a low noise 3.3V supply. Table 2-3 Grounds No. of Pins Signal Name Signal Description

9 VSS GND—These pins provide grounding for the inte rnal structures of the chip and should

all be attached to VSS. 3 VSSA Analog Ground—This pin supplies an analog ground.

1 TCS TCS —This Schmitt pin is reserved for factory use and must be tied to V SS for normal

use. In block diagrams, this pin is considered an additional VSS. Table 2-4 Supply Capacitors and VPP No. of Pins Signal Name Signal Type State During Reset Signal Description 2 VCAPC Supply Supply VCAPC—Connect each pin to a 2.2uF or greater bypass capacitor in order to bypass the core logic voltage regulator (required for proper chip operation). For more information, please refer to Section 5.2

2 VPP Input Input VPP—This pin should be left unconnected as an open circuit for normal

functionality.

Clock and Phase Locked Loop Signals 56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 11

2.3 Clock and Phase Locked Loop Signals

2.4 Address, Data, and Bus Control Signals

No. of Pins Signal Name Signal Type State During Reset Signal Description

1 EXTAL Input Input External Crystal Oscillator Input—This input should be connected to

an 8MHz external crystal or ceramic resonator. For more information, please refer to Section 3.4.

1 XTAL Input/

Chip-driven Crystal Oscillator Output—This output should be connected to an 8MHz external crystal or ceramic resonator. For more information, please refer to Section 3.4. This pin can also be connected to an external clock source. For more information, please refer to Section 3.4.2. 1 CLKO Output Chip-driven Clock Output—This pin outputs a buffered clock signal. By programming the CLKOSEL[4:0] bits in the CLKO Select Register (CLKOSR), the user can select between outputting a version of the signal applied to XTAL and a version of the device’s master clock at the output of the PLL. The clock frequency on this pin can also be disabled by programming the CLKOSEL[4:0] bits in CLKOSR. Table 2-6 Address Bus Signals No. of Pins Signal Name Signal Type State During Reset Signal Description

6 A0–A5 Output Tri-stated Address Bus—A0–A5 specify the address for external Program or

Data memory accesses.

2 A6–A7

Address Bus—A6–A7 specify the address for external Program or Data memory accesses. Port E GPIO—These two General Purpose I/O (GPIO) pins can individually be programmed as input or output pins. After reset, the default state is Address Bus.

8 A8–A15

Address Bus—A8–A15 specify the address for external Program or Data memory accesses. Port A GPIO—These eight General Purpos e I/O (GPIO) pins can be individually programmed as input or output pins. After reset, the default state is Address Bus.

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2.5 Interrupt and Program Control Signals

Table 2-7 Data Bus Signals No. of Pins Signal Name Signal Type State During Reset Signal Description

16 D0–D15 Input/O

Tri-stated Data Bus— D0–D15 specify the data for external program or data memory accesses. D0–D15 are tri-stated when the external bus is inactive. Internal pullups may be active. Table 2-8 Bus Control Signals No. of Pins Signal Name Signal Type State During Reset Signal Description

1 PS Output Tri-stated Program Memory Select—PS is asserted low for external program

memory access.

1 DS Output Tri-stated Data Memory Select—DS is asserted low for external data memory

access. 1 WR Output Tri-stated Write Enable—WR is asserted during external memory write cycles. When WR is asserted low, pins D0–D15 become outputs and the device puts data on the bus. When WR is deasserted high, the external data is latched inside the external device. When WR is asserted, it qualifies the A0–A15, PS, and DS pins. WR can be connected directly to the WE pin of a Static RAM. 1 RD Output Tri-stated Read Enable—RD is asserted during external memory read cycles. When RD is asserted low, pins D0–D15 become inputs and an external device is enabled onto the device’s data bus. When RD is deasserted high, the external data is latched inside the device. When RD is asserted, it qualifies the A0–A15, PS, and DS pins. RD can be connected directly to the OE pin of a Static RAM or ROM. Table 2-9 Interrupt and Program Control Signals No. of Pins Signal Name Signal Type State During Reset Signal Description

1 IRQA Input

(Schmitt) Input External Interrupt Request A—The IRQA input is a synchronized external interrupt request that indicates that an external device is requesting service. It can be programmed to be level-sensitive or negative-edge-triggered.

1 IRQB Input

(Schmitt) Input External Interrupt Request B—The IRQB input is an external interrupt request that indicates that an external device is requesting service. It can be programmed to be level-sensitive or negative-edge-triggered.

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2.6 GPIO Signals

1 RSTO Output Output Reset Output—This output reflects the internal reset state of the

chip.

1 RESET Input

(Schmitt) Input Reset—This input is a direct hardware reset on the processor. When RESET is asserted low, the device is initialized and placed in the Reset state. A Schmitt trigger input is used for noise immunity. When the RESET pin is deasserted, the initial chip operating mode is latched from the EXTBOOT pin. The internal reset signal will be deasserted synchronous with the internal clocks, after a fixed number of internal clocks. To ensure complete hardware reset, RESET and TRST should be asserted together. The only exception occurs in a debugging environment when a hardware device reset is required and it is necessary not to reset the OnCE/JTAG module. In this case, assert RESET , but do not assert TRST.

1 EXTBOOT Input

(Schmitt) Input External Boot—This input is tied to V DD to force device to boot from off-chip memory. Otherwise, it is tied to VSS. Table 2-10 Dedicated General Purpose Input/Output (GPIO) Signals No. of Pins Signal Name Signal Type State During Reset Signal Description

8 GPIOB0-

Input Port B GPIO—These eight pins are dedicated General Purpose I/O (GPIO) pins that can individually be programmed as input or output pins. After reset, the default state is GPIO input.

6 GPIOD0-

Input Port D GPIO—These six pins are dedicated GPIO pins that can individually be programmed as an input or output pins. After reset, the default state is GPIO input. Table 2-9 Interrupt and Program Control Signals (Continued) No. of Pins Signal Name Signal Type State During Reset Signal Description

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2.7 Pulse Width Modulator (PWM) Signals

Table 2-11 Pulse Width Modulator (PWMA and PWMB) Signals No. of Pins Signal Name Signal Type State During Reset Signal Description 6 PWMA0-5 Output Tri- stated PWMA0-5— Six PWMA output pins.

3 ISA0-2 Input

(Schmitt) Input ISA0-2— These three input current status pins are used for top/bottom pulse width correction in complementary channel operation for PWMA.

4 FAULTA0-3 Input

(Schmitt) Input FAULTA0-3— These Fault input pins are used for disabling selected PWMA outputs in cases where fault conditions originate off-chip. 6 PWMB0-5 Output Tri- stated PWMB0-5— Six PWMB output pins.

3 ISB0-2 Input

(Schmitt) Input ISB0-2— These three input current status pins are used for top/bottom pulse width correction in complementary channel operation for PWMB.

4 FAULTB0-3 Input

(Schmitt) Input FAULTB0-3— These four Fault input pins are used for disabling selected PWMB outputs in cases where fault conditions originate off-chip.

Serial Peripheral Interface (SPI) Signals 56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 15

2.8 Serial Peripheral Interface (SPI) Signals

Table 2-12 Serial Peripheral Interface (SPI) Signals No. of Pins Signal Name Signal Type State During Reset Signal Description

1 MISO

SPI Master In/Slave Out (MISO)—This serial data pin is an input to a master device and an output from a slave device. The MISO line of a slave device is placed in the high-impedance state if the slave device is not selected. Port E GPIO—This pin is a General Purpos e I/O (GPIO) pin that can individually be programmed as input or output pin. After reset, the default state is MISO.

1 MOSI

SPI Master Out/Slave In (MOSI)—This serial data pin is an output from a master device and an input to a slave device. The master device places data on the MOSI line a half-cycle before the clock edge that the slave device uses to latch the data. Port E GPIO—This pin is a General Purpos e I/O (GPIO) pin that can individually be programmed as input or output pin. After reset, the default state is MOSI.

1 SCLK

SPI Serial Clock—In master mode, this pi n serves as an output, clocking slaved listeners. In slave mode, this pin serves as the data clock input. Port E GPIO—This pin is a General Purpos e I/O (GPIO) pin that can individually be programmed as input or output pin. After reset, the default state is SCLK. 1 SS GPIOE7 Input Input/Outp ut Input Input SPI Slave Select—In master mode, this pin is used to arbitrate multiple masters. In slave mode, this pin is used to select the slave. Port E GPIO—This pin is a General Purpos e I/O (GPIO) pin that can individually be programmed as input or output pin. After reset, the default state is SS.

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2.9 Quadrature Decoder Signals

Table 2-13 Quadrature Decoder (Quad Dec0 and Quad Dec1) Signals No. of Pins Signal Name Signal Type State During Reset Signal Description

1 PHASEA0

Phase A—Quadrature Decode r #0 PHASEA input TA0—Timer A Channel 0

1 PHASEB0

Phase B—Quadrature Decode r #0 PHASEB input TA1—Timer A Channel 1

1 INDEX0

Index—Quadrature Decode r #0 INDEX input TA2—Timer A Channel 2

1 HOME0

Home—Quadrature Decoder #0 HOME input TA3—Timer A Channel 3

1 PHASEA1

Phase A—Quadrature Decode r #1 PHASEA input TB0—Timer B Channel 0

1 PHASEB1

Phase B—Quadrature Decode r #1 PHASEB input TB1—Timer B Channel 1

1 INDEX1

Index—Quadrature Decode r #1 INDEX input TB2—Timer B Channel 2

1 HOME1

Home—Quadrature Decoder #1 HOME input TB3—Timer B Channel 3

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2.10 Serial Communications Interface (SCI) Signals

Table 2-14 Serial Peripheral Interface (SPI) Signals No. of Pins Signal Name Signal Type State During Reset Signal Description SPI Master In/Slave Out (MISO)—This serial data pin is an input to a master device and an output from a slave device. The MISO line of a slave device is placed in the high-impedance state if the slave device is not selected. Port E GPIO—This pin is a General Purpos e I/O (GPIO) pin that can individually be programmed as input or output pin. After reset, the default state is MISO. SPI Master Out/Slave In (MOSI)—This serial data pin is an output from a master device and an input to a slave device. The master device places data on the MOSI line a half-cycle before the clock edge that the slave device uses to latch the data. Port E GPIO—This pin is a General Purpos e I/O (GPIO) pin that can individually be programmed as input or output pin. After reset, the default state is MOSI. SPI Serial Clock—In master mode, this pi n serves as an output, clocking slaved listeners. In slave mode, this pin serves as the data clock input. Port E GPIO—This pin is a General Purpos e I/O (GPIO) pin that can individually be programmed as input or output pin. After reset, the default state is SCLK. 1 SS GPIOE7 Input Input/Outp ut Input Input SPI Slave Select—In master mode, this pin is used to arbitrate multiple masters. In slave mode, this pin is used to select the slave. Port E GPIO—This pin is a General Purpos e I/O (GPIO) pin that can individually be programmed as input or output pin. After reset, the default state is SS.

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2.11 CAN Signals

Table 2-15 Serial Communications Interface (SCI0 and SCI1) Signals No. of Pins Signal Name Signal Type State During Reset Signal Description

1 TXD0

Transmit Data (TXD0)—transmit data output Port E GPIO—This pin is a General Purpose I/O (GPIO) pin that can individually be programmed as input or output pin. After reset, the default state is SCI output.

1 RXD0

Receive Data (RXD0)— receive data input Port E GPIO—This pin is a General Purpose I/O (GPIO) pin that can individually be programmed as input or output pin. After reset, the default state is SCI input.

1 TXD1

Transmit Data (TXD1)—transmit data output Port D GPIO—This pin is a General Purpose I/O (GPIO) pin that can individually be programmed as input or output pin. After reset, the default state is SCI output.

1 RXD1

Receive Data (RXD1)— receive data input Port D GPIO—This pin is a General Purpose I/O (GPIO) pin that can individually be programmed as input or output pin. After reset, the default state is SCI input. Table 2-16 CAN Module Signals No. of Pins Signal Name Signal Type State During Reset Signal Description

1 MSCAN_ RX Input

(Schmitt) Input MSCAN Receive Data—MSCAN input. This pin has an internal pull-up resistor. 1 MSCAN_ TX Output Output MSCAN Transmit Data—MSCAN output. CAN output is open-drain output and pull-up resistor is needed.

Analog-to-Digital Converter (ADC) Signals 56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 19

2.12 Analog-to-Digital Converter (ADC) Signals

2.13 Quad Timer Module Signals

Table 2-17 Analog to Digital Converter Signals No. of Pins Signal Name Signal Type State During Reset Signal Description

4 ANA0-3 Input Input ANA0-3—Analog inputs to ADCA channel 1

4 ANA4-7 Input Input ANA4-7—Analog inputs to ADCA channel 2

2 VREF Input Input VREF—Analog reference voltage for ADC. Must be set to VDDA-0.3V for optimal performance.

4 ANB0-3 Input Input ANB0-3—Analog inputs to ADCB, channel 1

4 ANB4-7 Input Input ANB4-7—Analog inputs to ADCB, channel 2

Table 2-18 Quad Timer Module Signals No. of Pins Signal Name Signal Type State During Reset Signal Description

2 TC0-1 Input/Output Input TC0-1—Timer C Channels 0 and 1

4 TD0-3 Input/Output Input TD0-3—Timer D Channels 0, 1, 2, and 3

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2.14 JTAG/OnCE

3.1 General Characteristics

The 56F807 is fabricated in high-density CMOS with 5V-tolerant TTL-compatible digital inputs. The term “5V-tolerant” refers to the capabi lity of an I/O pin, bui lt on a 3.3V compatible process technology, to withstand a voltage up to 5.5V without damaging the device. Many systems have a mixture of devices designed for 3.3V and 5V power supplies. In such systems, a bus may carry both 3.3V and 5V-compatible I/O voltage levels (a standard 3.3V I/O is designed to receive a maximum voltage of 3.3V ± 10% during normal operation without causing damage). This 5V-tolerant capability therefore offers the power savings of 3.3V I/O levels while being able to receive 5V levels without being damaged. Absolute maximum ratings given in Table 3-1 are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond these ratings may affect device reliability or cause permanent Table 2-19 JTAG/On-Chip Emulation (OnCE) Signals No. of Pins Signal Name Signal Type State During Reset Signal Description

1 TCK Input

(Schmitt) Input, pulled low internally Test Clock Input—This input pin provides a gated clock to synchronize the test logic and shift serial data to the JTAG/OnCE port. The pin is connected internally to a pull-down resistor.

1 TMS Input

(Schmitt) Input, pulled high internally Test Mode Select Input—This input pin is used to sequence the JTAG TAP controller’s state machine. It is sampled on the rising edge of TCK and has an on-chip pull-up resistor. Note: Always tie the TMS pin to VDD through a 2.2K resistor.

1 TDI Input

(Schmitt) Input, pulled high internally Test Data Input—This input pin provides a serial input data stream to the JTAG/OnCE port. It is sampled on the rising edge of TCK and has an on-chip pull-up resistor.

1 TDO Output Tri-stated Test Data Output—This tri-statable output pi n provides a serial output

data stream from the JTAG/OnCE port. It is driven in the Shift-IR and Shift-DR controller states, and changes on the falling edge of TCK.

1 TRST

(Schmitt) Input, pulled high internally Test Reset—As an input, a low signal on this pin provides a reset signal to the JTAG TAP controller. To ensure complete hardware reset, TRST should be asserted at power-up and whenever RESET is asserted. The only exception occurs in a debugging environment when a hardware device reset is required and it is necessary not to reset the OnCE/JTAG module. In this case, assert RESET, but do not assert TRST. Note: For normal operation, connect TRST directly to VSS. If the design is to be used in a debugging environment, TRST may be tied to VSS through a 1K resistor. 1 DE Output Output Debug Event—DE provides a low pulse on recognized debug events.

56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 21 damage to the device. The 56F807 DC/AC electrical specifi cations are preliminary and are from design simulations. These specifications may not be fully tested or guaranteed at this early stage of the product life cycle. Finalized specifications will be published af ter complete characterization a nd device qualificat ions have been completed. CAUTION This device contains protective circuitry to guard against damage due to high static voltage or electrical fields. However, normal precautions are advised to avoid application of any voltages higher than maximum rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate voltage level. Table 3-1 Absolute Maximum Ratings Characteristic Symbol Min Max Unit Supply voltage V DD VSS – 0.3 V SS + 4.0 V All other input voltages, excluding Analog inputs V IN VSS – 0.3 V SS + 5.5V V Voltage difference VDD to VDDA ΔVDD - 0.3 0.3 V Voltage difference VSS to VSSA ΔVSS - 0.3 0.3 V Analog inputs, ANA0-7 and VREF V IN VSSA– 0.3 V DDA+ 0.3 V Analog inputs EXTAL and XTAL V IN VSSA– 0.3 V SSA+ 3.0 V Current drain per pin excluding VDD, VSS, PWM outputs, TCS, VPP, VDDA, VSSA I— 1 0 m A Table 3-2 Recommended Operating Conditions Characteristic Symbol Min Typ Max Unit Supply voltage, digital V DD 3.0 3.3 3.6 V Supply Voltage, analog V DDA 3.0 3.3 3.6 V Voltage difference VDD to VDDA ΔVDD -0.1 - 0.1 V

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22 Freescale Semiconductor

Notes: 1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p thermal test board. 2. Junction to ambient therma l resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes (2s2p where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA. 3. Junction to case therma l resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured values using the cold plate technique with the cold plate temperature used as the “case” temperature. The basic cold plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package is being used with a heat sink. Voltage difference VSS to VSSA ΔVSS -0.1 - 0.1 V ADC reference voltage VREF 2.7 – V DDA V Ambient operating temperature T A –40 – 85 °C Table 3-3 Thermal Characteristics6 Characteristic Comments Symbol Value Unit Notes160-pin LQFP 160 MBGA Junction to ambient Natural convection RθJA 38.5 63.4 °C/W 2 Junction to ambient (@1m/sec) R θJMA 35.4 60.3 °C/W 2 Junction to ambient Natural convection Four layer board (2s2p) RθJMA (2s2p) 33 49.9 °C/W 1,2 Junction to ambient (@1m/sec) Four layer board (2s2p) RθJMA 31.5 46.8 °C/W 1,2 Junction to case R θJC 8.6 8.1 °C/W 3 Junction to center of case ΨJT 0.8 0.6 °C/W 4, 5 I/O pin power dissipation P I/O User Determined W Power dissipation P D P D = (IDD x VDD + P I/O)W Junction to center of case P DMAX (TJ - TA) /RθJA W7 Table 3-2 Recommended Operating Conditions Characteristic Symbol Min Typ Max Unit

56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 23 4. Thermal Characterization Parameter, Psi-JT ( ΨJT ), is the “resistance” from junction to reference point thermocouple on top center of case as defined in JESD51-2. ΨJT is a useful value to use to estimate junction temperature in steady state customer environments. 5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 6. See Section 5.1 from more details on thermal design considerations. 7. TJ = Junction Temperature TA = Ambient Temperature

3.2 DC Electrical Characteristics

Table 3-4 DC Electrical Characteristics Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fop = 80MHz Characteristic Symbol Min Typ Max Unit Input high voltage (XTAL/EXTAL) V IHC 2.25 — 2.75 V Input low voltage (XTAL/EXTAL) V ILC 0— 0 . 5 V Input high voltage (Schmitt trigger inputs)1 VIHS 2.2 — 5.5 V Input low voltage (Schmitt trigger inputs)1 VILS -0.3 — 0.8 V Input high voltage (all other digital inputs) V IH 2.0 — 5.5 V Input low voltage (all other digital inputs) V IL -0.3 — 0.8 V Input current high (pullup/pulldown resistors disabled, VIN=VDD)I IH -1 — 1 μA Input current low (pullup/pulldown resistors disabled, VIN=VSS)I IL -1 — 1 μA Input current high (with pullup resistor, VIN=VDD)I IHPU -1 — 1 μA Input current low (with pullup resistor, VIN=VSS)I ILPU -210 — -50 μA Input current high (with pulldown resistor, VIN=VDD)I IHPD 20 — 180 μA Input current low (with pulldown resistor, VIN=VSS)I ILPD -1 — 1 μA Nominal pullup or pulldown resistor value R PU, RPD 30 K Ω Output tri-state current low I OZL -10 — 10 μA Output tri-state current high I OZH -10 — 10 μA Input current high (analog inputs, VIN=VDDA)2 IIHA -15 — 15 μA Input current low (analog inputs, VIN=VSSA)3 IILA -15 — 15 μA Output High Voltage (at IOH) V OH VDD – 0.7 — — V

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Output Low Voltage (at IOL) V OL —— 0 . 4 V Output source current I OH 4— — m A Output source current I OL 4— — m A PWM pin output source current3 IOHP 10 — — mA PWM pin output sink current4 IOLP 16 — — mA Input capacitance C IN —8 — p F Output capacitance C OUT —1 2 — p F VDD supply current IDDT Run 6 —1 9 5 2 2 0 m A Wait7 —1 7 0 2 0 0 m A Stop —1 1 5 1 4 5 m A Low Voltage Interrupt, external power supply8 VEIO 2.4 2.7 3.0 V Low Voltage Interrupt, internal power supply9 VEIC 2.0 2.2 2.4 V Power on Reset10 VPOR —1 . 7 2 . 0 V 1. Schmitt Trigger inputs are: EXTBOOT, IRQA , IRQB, RESET, TCS, ISA0-2, FAULTA0-3, ISB0-2, FAULTB0-3, TCK, TRST, TMS, TDI, and MSCAN_RX 2. Analog inputs are: ANA[0:7], XTAL and EXTAL . Specification assumes ADC is not sampling. 3. PWM pin output source current measured with 50% duty cycle. 4. PWM pin output sink current measured with 50% duty cycle. 5. I DDT = IDD + IDDA (Total supply current for VDD + VDDA) 6. Run (operating) I DD measured using 8MHz clock source. All inputs 0.2V from rail; outputs unloaded. All ports configured as inputs; measured with all modules enabled. 7. Wait I DD measured using external square wave clock source (f osc = 8MHz) into XTAL; all inputs 0.2V from rail; no DC loads; less than 50pF on all outputs. CL = 20pF on EXTAL; all ports configured as inputs; EXTAL capacitance linearly affects wait IDD; measured with PLL enabled. 8. This low voltage interrupt monitors the V DDA external power supply. VDDA is generally connected to the same potential as VDD via separate traces. If VDDA drops below VEIO, an interrupt is generated. Functionality of the device is guaranteed under transient condi- tions when VDDA>VEIO (between the minimum specified VDD and the point when the VEIO interrupt is generated). 9. This low voltage interrupt monitors the internally regulated core power supply. If the output from the internal voltage is re gulator drops below VEIC, an interrupt is generated. Since the core logic supply is internally regulated, this interrupt will not be generated unless the external power supply drops below the minimum specified value (3.0V). 10. Power –on reset occurs whenever the internally regulated 2.5V digital supply drops below 1.5V typical. While power is ramping up, this signal remains active as long as the in ternal 2.5V is below 1.5V typical, no matter how long the ramp-up rate is. The inte rnally regulated voltage is typically 100mV less than VDD during ramp-up until 2.5V is reached, at which time it self-regulates. Table 3-4 DC Electrical Characteristics (Continued) Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fop = 80MHz Characteristic Symbol Min Typ Max Unit

56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 25 Figure 3-1 Maximum Run IDD vs. Frequency (see Note 6. in Table 3-14)

3.3 AC Electrical Characteristics

Timing waveforms in Section 3.3 are tested using the VIL and VIH levels specified in the DC Characteristics table. In Figure 3-2 the levels of VIH and VIL for an input signal are shown. Figure 3-2 Input Signal Measurement References Figure 3-3 shows the definitions of the following signal states:

• Active state, when a bus or signal is driven, and enters a low impedance state
• Tri-stated, when a bus or signal is placed in a high impedance state
• Data Valid state, when a signal level has reached V OL or VOH
• Data Invalid state, when a signal level is in transition between VOL and VOH 100 200 250 10 20 30 40 50 60 70 80 Freq. (MHz) IDD (mA) 150 IDD Digital IDD Analog IDD Total VIH VILFall Time Input Signal Note: The midpoint is VIL + (VIH – VIL)/2. Midpoint1 Low High 90% 50% 10% Rise Time

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Table 3-5 Flash Memory Truth Table Mode XE1 1. X address enable, all rows are disabled when XE=0 YE2 2. Y address enable, YMUX is disabled when YE=0 SE3 3. Sense amplifier enable OE4 4. Output enable, tri-state Flash data out bus when OE=0 PROG5 5. Defines program cycle ERASE6 6. Defines erase cycle MAS17 7. Defines mass erase cyc le, erase whole block NVSTR8 8. Defines non-volatile store cycle Standby L L L L L L L L R e a d H HHH L L L L Word Program H H L L H L L H Page Erase H L L L L H L H Mass Erase H L L L L H H H Table 3-6 IFREN Truth Table Mode IFREN=1 IFREN=0 Read Read information block Read main memory block Word program Program information block Program main memory block Page erase Erase information block Erase main memory block Mass erase Erase both block E rase main memory block Data Invalid State Data1 Data2 Valid Data Tri-stated Data3 Valid Data2 Data3 Data1 Valid Data Active Data Active

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Figure 3-4 Flash Program Cycle Figure 3-5 Flash Erase Cycle XADR YADR YE DIN PROG NVSTR Tnvs Tpgs Tadh Tprog Tads Tpgh Tnvh Trcv Thv IFREN XE XADR YE=SE=OE=MAS1=0 ERASE NVSTR Tnvs Tnvh TrcvTerase IFREN XE

56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 29 Figure 3-6 Flash Mass Erase Cycle

3.4 External Clock Operation

The 56F807 system clock can be deri ved from an external crystal or an external system clock signal. To generate a reference frequency using the internal oscillator, a reference crystal must be connected between the EXTAL and XTAL pins.

3.4.1 Crystal Oscillator

The internal oscillator is also designed to interfac e with a parallel-resonant crystal resonator in the frequency range specified fo r the external crystal in Table 3-9. In Figure 3-7 a recommended crystal oscillator circuit is shown. Follow the crystal supplier’s recommendations when selecting a crystal, since crystal parameters determine the component values required to provide maximu m stability and reliable start-up. The crystal and associated components should be mounted as close as possible to the EXTAL and XTAL pins to minimize output distortion and start-up stabili zation time. The internal 56F80x oscillator circuitry is designed to have no external load capacitors present. As shown in Figure 3-8 no external load capacitors should be used. The 56F80x components internally are modeled as a pa rallel resonant oscillator circuit to provide a capacitive load on each of the oscillator pins (XTAL and EXTAL) of 10pF to 13pF over temperature and process variations. Using a typical value of internal capacitance on these pins of 12pF and a value of 3pF XADR YE=SE=OE=0 ERASE NVSTR Tnvs Tnvh1 TrcvTme MAS1 IFREN XE

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as a typical circuit board trace capacitance the parallel load capacitance presented to the crystal is 9pF as determined by the following equation: This is the value load capacitance that should be used when selecting a crystal and determining the actual frequency of operation of the crystal oscillator circuit. Figure 3-7 Connecting to a Crystal Oscillator

3.4.2 Ceramic Resonator

It is also possible to drive the in ternal oscillator with a ceramic re sonator, assuming the overall system design can tolerate the re duced signal integrity. In Figure 3-8, a typical ceramic resonator circuit is shown. Refer to supplier’s recomm endations when selecting a ce ramic resonator and associated components. The resonator and com ponents should be mounted as clos e as possible to the EXTAL and XTAL pins. The internal 56F80x os cillator circuitry is designed to have no external load capacitors present. As shown in Figure 3-7 no external load capacitors should be used. Figure 3-8 Connecting a Ceramic Resonator Note: Freescale recommends only two terminal ceram ic resonators vs. three terminal resonators (which contain an internal bypass capacitor to ground). CL = CL1 * CL2 CL1 + CL2 + Cs = + 3 = 6 + 3 = 9pF 12 * 12 12 + 12 Recommended External Crystal Parameters: R z = 1 to 3 MΩ fc = 8MHz (optimized for 8MHz) EXTAL XTAL Rz fc Recommended Ceramic Resonator Parameters: Rz = 1 to 3 MΩ fc = 8MHz (optimized for 8MHz) EXTAL XTAL Rz fc

56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 31

3.4.3 External Clock Source

The recommended method of connecting an external clock is given in Figure 3-9. The external clock source is connected to XTAL and the EXTAL pin is grounded. Figure 3-9 Connecting an External Clock Signal Figure 3-10 External Clock Timing Table 3-8 External Clock Operation Timing Requirements5 Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C Characteristic Symbol Min Typ Max Unit Frequency of operation (external clock driver)1 1. See Figure 3-9 for details on using the recommended connection of an external clock driver. fosc 0— 8 0 M H z Clock Pulse Width2, 3 2. The high or low pulse width must be no smaller than 6.25ns or the chip will not function. 3. Parameters listed are guaranteed by design. tPW 6.25 — — ns 56F807 XTAL EXTAL External VSS Clock External Clock VIH VIL Note: The midpoint is VIL + (VIH – VIL)/2. 90% 50% 10% 90% 50% 10% tPW tPW

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3.4.4 Phase Locked Loop Timing

Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C Characteristic Symbol Min Typ Max Unit External reference crystal frequency for the PLL1 1. An externally supplied reference cl ock should be as free as possible from any phase jitter for the PLL to work correctly. The PLL is optimized for 8MHz input crystal.2. fosc 48 1 0 M H z PLL output frequency2 2. ZCLK may not exceed 80MHz. For additional information on ZCLK and f out/2, please refer to the OCCS chapter in the User Manual. ZCLK = fop fout/2 40 — 110 MHz PLL stabilization time3 0o to +85oC 3. This is the minimum time required after the P LL set-up is changed to ensure reliable operation. tplls —11 0 m s PLL stabilization time3 -40o to 0oC tplls — 100 200 ms

External Bus Asynchronous Timing 56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 33

3.5 External Bus Asynchronous Timing

Table 3-10 External Bus Asynchronous Timing 1,2 Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fop = 80MHz Characteristic Symbol Min Max Unit Address Valid to WR Asserted t AWR 6.5 — ns WR Width Asserted Wait states = 0 Wait states > 0 tWR 7.5 (T*WS)+7.5 ns ns WR Asserted to D0–D15 Out Valid t WRD —T + 4 . 2 n s Data Out Hold Time from WR Deasserted t DOH 4.8 — ns Data Out Set Up Time to WR Deasserted Wait states = 0 Wait states > 0 t DOS 2.2 (T*WS)+6.4 ns ns RD Deasserted to Address Not Valid t RDA 0— n s Address Valid to RD Deasserted Wait states = 0 Wait states > 0 tARDD 18.7 (T*WS) + 18.7 ns ns Input Data Hold to RD Deasserted t DRD 0— n s RD Assertion Width Wait states = 0 Wait states > 0 tRD (T*WS)+19 ns ns Address Valid to Input Data Valid Wait states = 0 Wait states > 0 tAD (T*WS)+1 ns ns Address Valid to RD Asserted t ARDA -4.4 — ns RD Asserted to Input Data Valid Wait states = 0 Wait states > 0 tRDD 2.4 (T*WS) + 2.4 ns ns WR Deasserted to RD Asserted t WRRD 6.8 — ns RD Deasserted to RD Asserted t RDRD 0— n s WR Deasserted to WR Asserted t WRWR 14.1 — ns RD Deasserted to WR Asserted t RDWR 12.8 — ns

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Figure 3-11 External Bus Asynchronous Timing 1. Timing is both wait state and frequency dependent. In the formulas listed, WS = the number of wait states and T = Clock Period. For 80MHz operation, T = 12.5ns. 2. Parameters listed are guaranteed by design. To calculate the required access time for an external memory for any frequency < 80MHz, use this formula: Top = Clock period @ desired operating frequency WS = Number of wait states Memory Access Time = (Top*WS) + (Top- 11.5) A0–A15, PS, DS (See Note) WR D0–D15 RD Note: During read-modify-write instructions and internal instructions, the address lines do not change state. Data InData Out tAWR tARDA tARDD tRDA tRD tRDRD tRDWRtWRWR tWR tDOS tWRD tWRRD tAD tDOH tDRD tRDD

Reset, Stop, Wait, Mode Select, and Interrupt Timing 56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 35

3.6 Reset, Stop, Wait, Mode Select, and Interrupt Timing

Table 3-11 Reset, Stop, Wait, Mode Select, and Interrupt Timing1,5 Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF 1. In the formulas, T = clock cycle. For an operating frequency of 80MHz, T = 12.5ns. Characteristic Symbol Min Max Unit See Figure RESET Assertion to Address, Data and Control Signals High Impedance tRAZ —2 1 n s 3-12 Minimum RESET Assertion Duration2 OMR Bit 6 = 0 OMR Bit 6 = 1 2. Circuit stabilization delay is requir ed during reset when using an external clock or crystal oscillator in two cases:

• After power-on reset
• When recovering from Stop state tRA 275,000T 128T ns ns 3-12 RESET Deassertion to First External Address Output t RDA 33T 34T ns 3-12 Edge-sensitive Interrupt Request Width t IRW 1.5T — ns 3-13 IRQA, IRQB Assertion to External Data Memory Access Out Valid, caused by first instruction execution in the interrupt service routine t IDM 15T — ns 3-14 IRQA, IRQB Assertion to General Purpose Output Valid, caused by first instruction execution in the interrupt service routine tIG 16T — ns 3-14 IRQA Low to First Valid Interrupt Vector Address Out recovery from Wait State3 3. The minimum is specified for the duration of an edge-sensitive IR QA interrupt required to recover from the Stop state. This i s not the minimum required so that the IRQA interrupt is accepted. tIRI 13T — ns 3-15 IRQA Width Assertion to Recover from Stop State4 4. The interrupt instruction fetch is visible on the pins only in Mode 3. 5. Parameters listed are guaranteed by design. tIW 2T — ns 3-16 Delay from IRQA Assertion to Fetch of first instruction (exiting Stop) OMR Bit 6 = 0 OMR Bit 6 = 1 t IF 275,000T 12T ns ns 3-16 Duration for Level Sensitive IRQA Assertion to Cause the Fetch of First IRQA Interrupt Instruction (exiting Stop) OMR Bit 6 = 0 OMR Bit 6 = 1 t IRQ 275,000T 12T ns ns 3-17 Delay from Level Sensitive IRQA Assertion to First Interrupt Vector Address Out Valid (exiting Stop) OMR Bit 6 = 0 OMR Bit 6 = 1 t II 275,000T 12T ns ns 3-17

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Figure 3-12 Asynchronous Reset Timing Figure 3-13 External Interrupt Timing (Negative-Edge-Sensitive) Figure 3-14 External Level-Sensitive Interrupt Timing First Fetch tRAtRAZ tRDA A0–A15, D0–D15 PS, DS, RD, WR RESET First Fetch IRQA, IRQB tIRW tIDM A0–A15, PS, DS, RD, WR IRQA, IRQB First Interrupt Instruction Execution a) First Interrupt Instruction Execution tIG General Purpose I/O Pin IRQA, IRQB b) General Purpose I/O

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3.7 Serial Peripheral Interface (SPI) Timing

Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fOP = 80MHz 1. Parameters listed are guaranteed by design. Characteristic Symbol Min Max Unit See Figure Cycle time Master Slave t C ns ns 3-19-3-22 Enable lead time Master Slave t ELD ns ns 3-22 Enable lag time Master Slave t ELG 100 ns ns 3-22 Clock (SCK) high time Master Slave t CH 17.6 12.5 ns ns 3-19, 3-20, 3-21, 3-22 Clock (SCK) low time Master Slave t CL 24.1 ns ns 3-22 Data set-up time required for inputs Master Slave t DS ns ns 3-19, 3-20, 3-21, 3-22 Data hold time required for inputs Master Slave t DH ns ns 3-19, 3-20, 3-21, 3-22 Access time (time to data active from high-impedance state) Slave t A 4.8 15 ns 3-22 Disable time (hold time to high-impedance state) Slave tD 3.7 15.2 ns 3-22 Data Valid for outputs Master Slave (after enable edge) tDV 4.5 20.4 ns ns 3-19, 3-20, 3-21, 3-22 Data invalid Master Slave tDI ns ns 3-19, 3-20, 3-21, 3-22 Rise time Master Slave tR 11.5 10.0 ns ns 3-19, 3-20, 3-21, 3-22 Fall time Master Slave tF 9.7 9.0 ns ns 3-19, 3-20, 3-21, 3-22

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Figure 3-21 SPI Slave Timing (CPHA = 0) Figure 3-22 SPI Slave Timing (CPHA = 1) SCLK (CPOL = 0) (Input) SCLK (CPOL = 1) (Input) MISO (Output) MOSI (Input) Slave MSB out Bits 14–1 tC tCL tCL tF tCH tDI MSB in Bits 14–1 LSB in SS (Input) tCH tDH tR tELG tELD tF Slave LSB out tDtA tDS tDV tDI tR SCLK (CPOL = 0) (Input) SCLK (CPOL = 1) (Input) MISO (Output) MOSI (Input) Slave MSB out Bits 14–1 tC tCL tCL tCH tDI MSB in Bits 14–1 LSB in SS (Input) tCH tDH tF tR Slave LSB out tD tA tELD tDV tF tR tELG tDV tDS

56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 41

3.8 Quad Timer Timing

Table 3-13 Timer Timing1, 2 Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fOP = 80MHz 1. In the formulas listed, T = the clock cycle. For 80MHz operation, T = 12.5ns. 2. Parameters listed are guaranteed by design. Characteristic Symbol Min Max Unit Timer input period P IN 4T + 6 — ns Timer input high/low period P INHL 2T + 3 — ns Timer output period P OUT 2T — ns Timer output high/low period P OUTHL 1T — ns POUT POUTHL POUTHL PIN PINHL PINHL Timer Inputs Timer Outputs

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3.9 Quadrature Decoder Timing

Figure 3-24 Quadrature Decoder Timing Table 3-14 Quadrature Decoder Timing 1, 2 Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fOP = 80MHz TA = –40° to +85°C, CL ≤ 50pF. 2. Parameters listed are guaranteed by design. Characteristic Symbol Min Max Unit Quadrature input period P IN 8T + 12 — ns Quadrature input high/low period P HL 4T + 6 — ns Quadrature phase period P PH 2T + 3 — ns Phase B (Input) PIN PHL PHL Phase A (Input) PIN PHL PHL PPH PPH PPH PPH

Serial Communication Interface (SCI) Timing 56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 43

3.10 Serial Communication Interface (SCI) Timing

Figure 3-25 RXD Pulse Width Figure 3-26 TXD Pulse Width Table 3-15 SCI Timing4 Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fOP = 80MHz Characteristic Symbol Min Max Unit Baud Rate1 1. f MAX is the frequency of operation of the system clock in MHz. BR — (fMAX*2.5)/(80) Mbps RXD2 Pulse Width 2. The RXD pin in SCI0 is named RXD0 and the RXD pin in SCI1 is named RXD1. RXDPW 0.965/BR 1.04/BR ns TXD3 Pulse Width 3. The TXD pin in SCI0 is named TXD0 and the TXD pin in SCI1 is named TXD1. 4. Parameters listed are guaranteed by design. TXDPW 0.965/BR 1.04/BR ns RXDPW RXD SCI receive data pin (Input) TXDPW TXD SCI receive data pin (Input)

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3.11 Analog-to-Digital Converter (ADC) Characteristics

Table 3-16 ADC Characteristics Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, VREF = VDD-0.3V, ADCDIV = 4, 9, or 14, (for optimal performance), ADC clock = 4MHz, 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fOP = 80MHz Characteristic Symbol Min Typ Max Unit ADC input voltages V ADCIN 01 1. For optimum ADC performance, keep the minimum V ADCIN value > 25mV. Inputs less than 25mV may convert to a digital output code of 0. — VREF 2. V REF must be equal to or less than V DDA and must be greater than 2.7V. For optimal ADC performance, set V REF to VDDA-0.3V. V Resolution R ES 12 — 12 Bits Integral Non-Linearity3 3. Measured in 10-90% range. INL — +/- 2.5 +/- 4 LSB4 4. LSB = Least Significant Bit. Differential Non-Linearity DNL — +/- 0.9 +/- 1 LSB4 Monotonicity GUARANTEED ADC internal clock5 5. Guaranteed by characterization. fADIC 0.5 — 5 MHz Conversion range R AD VSSA —V DDA V Conversion time t ADC —6— tAIC cycles6 6. t AIC = 1/fADIC Sample time t ADS —1— tAIC cycles6 Input capacitance C ADI —5— pF6 Gain Error (transfer gain)5 EGAIN 0.93 1.00 1.08 — Total Harmonic Distortion5 THD 60 64 — Offset Voltage5 VOFFSET -90 -25 +10 mV Signal-to-Noise plus Distortion5 SINAD 55 60 — — Effective Number of Bits5 ENOB 9 10 — bit Spurious Free Dynamic Range5 SFDR 65 70 — dB Bandwidth BW — 100 — KHz ADC Quiescent Current (each dual ADC) I ADC —5 0— m A VREF Quiescent Current (each dual ADC) I VREF —1 2 1 6 . 5m A

Controller Area Network (CAN) Timing 56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 45 1. Parasitic capacitance due to package, pin to pin, and pin to package base coupling. (1.8pf) 2. Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing. (2.04pf) 3. Equivalent resistance for the ESD isolation resistor and the channel select mux. (500 ohms) 4. Sampling capacitor at the sample and hold circuit. Capacitor 4 is normally disconnected from the input and is only connected to it at sampling time. (1pf) Figure 3-27 Equivalent Analog Input Circuit

3.12 Controller Area Network (CAN) Timing

Figure 3-28 Bus Wakeup Detection Table 3-17 CAN Timing2 Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL < 50pF, MSCAN Clock = 30MHz Characteristic Symbol Min Max Unit Baud Rate BR CAN — 1M b p s Bus Wakeup detection 1 1. If Wakeup glitch filter is enabled during the design initializat ion and also CAN is put into SLEEP mode then, any bus event (on MSCAN_RX pin) whose duration is less than 5 microseconds is filtered away. However, a valid CAN bus wakeup detection takes place for a wakeup pulse equal to or greater than 5 microseconds. The number 5 microseconds originates from the fact that the CAN wakeup message consists of 5 dominant bits at the highest possible baud rate of 1Mbps. 2. Parameters listed are guaranteed by design T WAKEUP 5 — μs 1 2 ADC analog input T WAKEUP MSCAN_RX CAN receive data pin (Input)

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3.13 JTAG Timing

Figure 3-29 Test Clock Input Timing Diagram Table 3-18 JTAG Timing1, 3 Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fOP = 80MHz 1. Timing is both wait state and frequency dependent. For the va lues listed, T = clock cycle. For 80MHz operation, T = 12.5ns. Characteristic Symbol Min Max Unit TCK frequency of operation2 2. TCK frequency of operation must be less than 1/8 the processor rate. 3. Parameters listed are guaranteed by design. fOP DC 10 MHz TCK cycle time t CY 100 — ns TCK clock pulse width t PW 50 — ns TMS, TDI data set-up time t DS 0.4 — ns TMS, TDI data hold time t DH 1.2 — ns TCK low to TDO data valid t DV — 26.6 ns TCK low to TDO tri-state t TS — 23.5 ns TRST assertion time t TRST 50 — ns DE assertion time t DE 4T — ns TCK (Input) VM VIL VM = VIL + (VIH – VIL)/2 tPW tCY tPW VM VIH

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4.1 Package and Pin-Out Information 56F807

This section contains package and pin-out inform ation for the 56F807. This de vice comes in two case types: low-profile quad flat p ack (LQFP) or mold array proces s ball grid assembly (MAPBGA). Figure 4-1 shows the package outli ne for the LQFP case, Figure 4-2 shows the mechanical parameters for the LQFP case, and Table 4-1 lists the pinout for the LQFP case. Figure 4-3 shows the mechanical parameters for the MAPBGA case, and Table 4-2 lists the pinout for the MAPBGA package. Figure 4-1 Top View, 56F807 160-pin LQFP Package VDD A10 A11 A12 A13 A14 A15 VSS PS DS WR RD D10 VDD D11 D12 Pin 1 Orientation Mark 121 D13 D14 D15 GPIOB0 RXD0 TXD0 CLKO VSS VPP HOME1 INDEX1 VDD PHB1 PHA1 HOME0 INDEX0 PHB0 PHA0 MOSI0 MISO0 SCLK SS MSCAN_RX VSS VDD MSCAN_TX VCAPC2 TDO TDI TMS TCK TCS TRST TC1 TC0 TD3 TD2 TD1 TD0 ISA2 ISA1 ISA0 VSS DE GPIOB1 GPIOB2 GPIOB3 GPIOB4 GPIOB5 GPIOB6 GPIOB7 VSS GPIOD0 GPIOD1 GPIOD2 GPIOD3 GPIOD4 GPIOD5 TXD1 RXD1 PWMB0 PWMB1 PWMB2 PWMB3 PWMB4 PWMB5 VDD ISB0 VCAPC1 ISB1 ISB2 VPP2 IRQA IRQB FAULTB0 FAULTB1 FAULTB2 FAULTB3 PWMA0 VSS PWMA1 PWMA2 PWMA3 PWMA4 ANB7 ANB6 ANB5 ANB4 ANB3 ANB2 ANB1 ANB0 VSSA VDDA VREF2 ANA7 ANA6 ANA5 ANA4 ANA3 ANA2 ANA1 ANA0 VSSA VDDA VREF RESET RSTO VDD VSS VDD EXTAL XTAL VSS VSS VDD VDDA VSSA EXTBOOT FAULTA3 FAULTA2 FAULTA1 FAULTA0 PWMA5

Package and Pin-Out Information 56F807 56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 49 Figure 4-2 160-pin LQFP Mechanical Information Please see www.freescale.com for the most current case outline. CASE 1259-01 ISSUE O DIM MIN MAX MILLIMETERS A --- 1.60 A1 0.05 0.15 A2 1.35 1.45 b 0.17 0.27 b1 0.17 0.23 c 0.09 0.20 c1 0.09 0.16 D 26.00 BSC D1 24.00 BSC e 0.50 BSC E 26.00 BSC E1 24.00 BSC L 0.45 0.75 L1 1.00 REF R1 0.08 --- R2 0.08 0.20 S 0.20 --- θ 0 7 1 0 --- 2 11 13 3 11 13 0.25 θ θ θ °° NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DATUMS A, B, AND D TO BE DETERMINED WHERE THE LEADS EXIT THE PLASTIC BODY AT DATUM PLANE H. 4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25mm PER SIDE. DIMENSIONS D1 AND E1 ARE MAXIMUM PLASTIC BODY SIZE DIMENSIONS INCLUDING MOLD MISMATCH. 5. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED THE MAXIMUM b DIMENSION BY MORE THAN 0.08mm. DAMBAR CAN NOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN A PROTRUSION AND AN ADJACENT LEAD IS 0.07mm. 6. EXACT SHAPE OF CORNERS MAY V ARY . D B A D GGD E E A-B0.20 DH A-BM0.08 D C A-B0.20 DC 160X 0.08 C C SEATING PLANE 156X e 4X e/2 160X e DETAIL F θ A A2A1 S L (L1) H GAGE PLANE DETAIL F c (b) b SECTION G-G

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Table 4-1 56F807 LQFP Package Pin Identification by Pin Number Pin No. Signal Name Pin No. Signal Name Pin No. Signal Name Pin No. Signal Name

1 A 0 4 1G P I O B 18 1 P W M A 5 1 2 1 D E

2 A 1 4 2G P I O B 28 2 F A U L T A 01 2 2 V SS

3 A2 43 GPIOB3 83 FAULTA1 123 ISA0

4 A3 44 GPIOB4 84 FAULTA2 124 ISA1

5 A4 45 GPIOB5 85 FAULTA3 125 ISA2

6 A5 46 GPIOB6 86 EXTBOOT 126 TD0

7 A 6 4 7G P I O B 78 7 V

8A 7 4 8 V SS 88 V DDA 128 TD2 9V DD 49 GPIOD0 89 V DD 129 TD3

10 A8 50 GPIOD1 90 V SS 130 TC0

11 A9 51 GPIOD2 91 V SS 131 TC1

1 2 A 1 0 5 2G P I O D 39 2 X T A L 1 3 2 T R S T

13 A11 53 GPIOD4 93 EXTAL 133 TCS

1 4 A 1 2 5 4G P I O D 59 4 V DD 134 TCK

15 A13 55 TXD1 95 V SS 135 TMS

1 6 A 1 4 5 6R X D 19 6 V DD 136 TDI

17 A15 57 PWMB0 97 RSTO 137 TDO

18 V SS 58 PWMB1 98 RESET 138 VCAPC2

19 PS 59 PWMB2 99 VREF 139 MSCAN_TX

20 DS 60 PWMB3 100 V DDA 140 V DD

21 WR 61 PWMB4 101 V SSA 141 V SS

22 RD 62 PWMB5 102 ANA0 142 MSCAN_RX

23 D0 63 V DD 103 ANA1 143 SS

24 D1 64 ISB0 104 ANA2 144 SCLK

25 D2 65 VCAPC1 105 ANA3 145 MISO

26 D3 66 ISB1 106 ANA4 146 MOSI

27 D4 67 ISB2 107 ANA5 147 PHA0

28 D5 68 VPP2 108 ANA6 148 PHB0

29 D6 69 IRQA

109 ANA7 149 INDEX0

30 D7 70 IRQB 110 VREF2 150 HOME0

Package and Pin-Out Information 56F807 56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 51

31 D8 71 FAULTB0 111 V DDA 151 PHA1

32 D9 72 FAULTB1 112 V SSA 152 PHB1

33 D10 73 FAULTB2 113 ANB0 153 V DD

34 V DD 74 FAULTB3 114 ANB1 154 INDEX1

35 D11 75 PWMA0 115 ANB2 155 HOME1

36 D12 76 V SS 116 ANB3 156 VPP

37 D13 77 PWMA1 117 ANB4 157 V SS

38 D14 78 PWMA2 118 ANB5 158 CLKO

39 D15 79 PWMA3 119 ANB6 159 TXD0

40 GPIOB0 80 PWMA4 120 ANB7 160 RXD0

Table 4-1 56F807 LQFP Package Pin Identification by Pin Number (Continued) Pin No. Signal Name Pin No. Signal Name Pin No. Signal Name Pin No. Signal Name

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Figure 4-3 160 MAPBGA Mechanical Information Please see www.freescale.com for the most current case outline. NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO DATUM PLANE Z. 4. DATUM Z (SEATING PLANE) IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5. PARALLELISM MEASUREMENT SHALL EXCLUDE ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE. CASE 1268-01 ISSUE O X 0.20 LASER MARK FOR PIN 1 IDENTIFICATION IN THIS AREA e13X D E M S A2A 0.15 Z 0.30 Z Z ROTATED 90 CLOCKWISE DETAIL K VIEW M-M e13X S X0.30 YZ 0.10 Z b160X METALIZED MARK FOR PIN 1 IDENTIFICATION IN THIS AREA 14 13 12 11 10 9 6 5 4 3 2 1 A B C D E F G H J K L M N P 160X DIM MIN MAX MILLIMETERS A 1.32 1.75 A1 0.27 0.47 A2 1.18 REF b 0.35 0.65 D 15.00 BSC E 15.00 BSC e 1.00 BSC S 0.50 BSC Y K

Package and Pin-Out Information 56F807 56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 53 Table 4-2 160 MAPBGA Package Pin Identification by Pin Number Solder Ball Signal Name Solder Ball Signal Name Solder Ball Signal Name Solder Ball Signal Name C3 A0 N4 GPIOB5 K12 VSSA E10 TC1 B2 A1 P4 GPIOB6 K13 VDDA D9 TRST D3 A2 M4 GPIOB7 L14 VDD B9 TCS C2 A3 L5 VSS K11 VSS E9 TCK B1 A4 N5 GPIOD0 K14 VSS A9 TMS D2 A5 P5 GPIOD1 J13 XTAL D8 TDI C1 A6 K5 GPIOD2 J12 EXTAL B8 TDO D1 A7 N6 GPIOD3 J14 VDD A8 VCAPC2 E3 VDD L6 GPIOD4 J11 VSS E8 MSCAN_TX E2 A8 K6 GPIOD5 H13 V DD D7 VDD E1 A9 P6 TXD1 H12 RSTO E7 VSS F3 A10 N7 RXD1 H14 RESET D6 MSCAN_RX F2 A11 L7 PWMB0 H11 VREF H1 D1 F1 A12 P7 PWMB1 G12 VDDA H2 D2 G3 A13 K7 PWMB2 G11 VSSA J3 D3 G2 A14 L8 PWMB3 G14 ANA0 J1 D4 G1 A15 K8 PWMB4 B13 DE J2 D5 F4 VSS P8 PWMB5 A14 VSS K3 D6 G4 PS L9 VDD B12 ISA0 K1 D7 H4 DS N8 ISB0 A13 ISA1 L1 D8 J4 WR P14 PWMA5 A12 ISA2 K2 D9 K4 RD M13 FAULTA0 B11 TD0 L3 D10

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P1 GPIOB1 L12 FAULTA1 A11 TD1 M1 VDD N3 GPIOB2 N14 FAULTA2 D10 TD2 L2 D11 P2 GPIOB3 L13 FAULTA3 B10 TD3 N1 D12 P3 GPIOB4 M14 EXTBOOT A10 TC0 M2 D13 N2 D14 N11 VSS D14 VSSA D5 PHB0 M3 D15 P13 PWMA1 D11 ANA8 B6 INDEX0 L4 GPIOB0 N12 PWMA2 D12 ANA9 A5 HOME0 K10 VCAPC1 N13 PWMA3 D13 ANA10 E4 PHA1 K9 ISB1 M12 PWMA4 C14 ANA11 B5 PHB1 P9 ISB2 F11 ANA1 C13 ANA12 A4 VDD L10 VPP2 G13 ANA2 C11 ANA13 D4 INDEX1 N9 IRQA F12 ANA3 B14 ANA14 C4 HOME1 P10 IRQB F14 ANA4 C12 ANA15 B4 VPP P11 FAULTB0 E11 ANA5 A7 SS A2 CLKO N10 FAULTB1 F13 ANA6 E5 SCLK B3 TXD0 L11 FAULTB2 E12 ANA7 B7 MISO A1 RXD0 M11 FAULTB3 E14 VREF2 A6 MOSI A3 VSS P12 PWMA0 E13 VDDA E6 PHA0 H3 D0 Table 4-2 160 MAPBGA Package Pin Identification by Pin Number (Continued) Solder Ball Signal Name Solder Ball Signal Name Solder Ball Signal Name Solder Ball Signal Name

Thermal Design Considerations 56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 55 Part 5 Design Considerations

5.1 Thermal Design Considerations

An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation: Equation 1: Where: TA = ambient temperature °C RθJA = package junction-to-ambient thermal resistance °C/W PD = power dissipation in package Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-to-ambient thermal resistance: Equation 2: Where: RθJA = package junction-to-ambient thermal resistance °C/W RθJC = package junction-to-case thermal resistance °C/W RθCA = package case-to-ambient thermal resistance °C/W RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around the device, add a heat sink, change the mounting ar rangement on the Printed Circuit Board (PCB), or otherwise change the thermal dissipation capability of the area su rrounding the device on the PCB. This model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through the case to the heat sink and out to the ambient environment. For cera mic packages, in situations where the heat flow is split between a path to the case a nd an alternate path through the PCB, analysis of the device thermal performance may need the additional modeli ng capability of a sy stem level thermal simulation tool. The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the package is mounted. Again, if the estimations obtained from RθJA do not satisfactorily answer whether the thermal performance is adequate, a system level model may be appropriate. Definitions: A complicating factor is the existe nce of three common definitions fo r determining the junction-to-case thermal resistance in plastic packages:

• Measure the thermal resistance from the junction to th e outside surface of the package (case) closest to the chip mounting area when that surface has a proper heat sink. This is done to minimize temperature variation across the surface. TJ TA PD RθJA×()+= RθJA RθJC RθCA+=

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• Measure the thermal resistance from the junction to where the leads are attached to the case. This definition is approximately equal to a junction to board thermal resistance.
• Use the value obtained by the equation (T J – TT)/PD where TT is the temperature of the package case determined by a thermocouple. The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T thermocouple epoxied to the top ce nter of the package case. The th ermocouple should be positioned so that the thermocouple junction re sts on the package. A small amount of epoxy is placed over the thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire. When heat sink is used, the junction temperature is determined from a ther mocouple inserted at the interface between the case of the package and the interface material. A clearance slot or hole is normally required in the heat sink. Minimizing the size of the clearan ce is important to mi nimize the change in thermal performance caused by removing part of the thermal interface to the heat sink. Because of the experimental difficulties with this technique, many engineers measure the heat sink temperature and then back-calculate the case temperatur e using a separate measurement of the thermal resistance of the interface. From this case temperat ure, the junction temperature is de termined from th e junction-to-case thermal resistance.

5.2 Electrical Design Considerations

Use the following list of considerations to assure correct operation:

• Provide a low-impedance path from the board power supply to each V DD pin on the controller, and from the board ground to each VSS pin.
• The minimum bypass requirement is to place 0.1 μF capacitors positioned as close as possible to the package supply pins. The recommended bypass configuration is to place one bypass capacitor on each of the VDD/VSS pairs, including VDDA/VSSA. Ceramic and tantalum capacitors tend to provide better performance tolerances. CAUTION This device contains protective circuitry to guard against damage due to high static voltage or electrical fields. However, normal precautions are advised to avoid application of any voltages higher than maximum rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate voltage level.

Electrical Design Considerations 56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 57

• Ensure that capacitor leads and associated prin ted circuit traces that connect to the chip VDD and VSS pins are less than 0.5 inch per capacitor lead.
• Bypass the V DD and VSS layers of the PCB with approximately 100 μF, preferably with a high-grade capacitor such as a tantalum capacitor.
• Because the controller’s output signals have fast rise and fall times, PCB trace lengths should be minimal.
• Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance. This is especially critical in systems with higher capacitive loads that could create higher transient currents in the VDD and VSS circuits.
• Take special care to minimize noise levels on the VREF, V DDA and VSSA pins.
• Designs that utilize the TRST pin for JTAG port or OnCE module functionality (such as development or debugging systems) should allow a means to assert TRST whenever RESET is asserted, as well as a means to assert TRST independently of RESET. TRST must be asserted at power up for proper operation. Designs that do not require debugging functionality, such as consumer products, TRST should be tied low.
• Because the Flash memory is programmed through the JTAG/OnCE port, designers should provide an interface to this port to allow in-circuit Flash programming.

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Part 6 Ordering Information Table 6-1 lists the pertinent information needed to pl ace an order. Consult a Freescale Semiconductor sales office or authorized distributor to determine availability and to order parts. *This package is RoHS compliant. Table 6-1 56F807 Ordering Information Part Supply Voltage Package Type Pin Count Ambient Frequency (MHz) Order Number 56F807 3.0–3.6 V Low-Profile Quad Flat Pack (LQFP) 160 80 DSP56F807PY80 56F807 3.0–3.6 V Mold Array Process Ball Grid Array (MAPBGA) 160 80 DSP56F807VF80 56F807 3.0–3.6 V Low-Profile Quad Flat Pack (LQFP) 160 80 DSP56F807PY80E* 56F807 3.0–3.6 V Mold Array Process Ball Grid Array (MAPBGA) 160 80 DSP56F807VF80E*

Electrical Design Considerations 56F807 Technical Data Technical Data, Rev. 15 Freescale Semiconductor 59

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Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. This product incorporates SuperFlash® technology licensed from SST. © Freescale Semiconductor, Inc. 2005. All rights reserved. DSP56F807 Rev. 15 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale’s Environmental Products program, go to http://www.freescale.com/epp.