54LS169 NSC | Alldatasheet

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Technical content

Features

Y Fully synchronous operation for counting and programming. Y Internal look-ahead for fast counting. Y Carry output for n-bit cascading. Y Fully independent clock circuit Y Alternate Military/Aerospace device (54LS169) is available. Contact a National Semiconductor Sales Office/Distributor for specifications. Connection Diagram Dual-In-Line Package TL/F/6401–1 Order Number 54LS169DMQB, 54LS169FMQB, 54LS169LMQB, DM54LS169AJ, DM54LS169AW, DM74LS169AM or DM74LS169AN See NS Package Number E20A, J16A, M16A, N16E or W16A C1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.

Absolute Maximum Ratings (Note) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage 7V Input Voltage 7V Operating Free Air Temperature Range DM54LS and 54LS b55§Ct o a125§C DM74LS 0 §Ct o a70§C Storage Temperature Range b65§Ct o a150§C Note: The ‘‘Absolute Maximum Ratings’’ are those values beyond which the safety of the device cannot be guaran- teed. The device should not be operated at these limits. The parametric values defined in the ‘‘Electrical Characteristics’’ table are not guaranteed at the absolute maximum ratings. The ‘‘Recommended Operating Conditions’’ table will define the conditions for actual device operation. Recommended Operating Conditions Symbol Parameter DM54LS169A DM74LS169A Units Min Nom Max Min Nom Max VCC Supply Voltage 4.5 5 5.5 4.75 5 5.25 V VIH High Level Input Voltage 2 2 V VIL Low Level Input Voltage 0.7 0.8 V IOH High Level Output Current b0.4 b0.4 mA IOL Low Level Output Current 4 8 mA fCLK Clock Frequency (Note 1) 0 25 0 25 MHz Clock Frequency (Note 2) 0 20 0 20 MHz tW Clock Pulse Width (Note 3) 25 25 ns tSU Setup Time Data 20 20 (Note 3) Enable 20 20T or P ns Load 25 25 U/D 30 30 tH Hold Time (Note 3) 0 0 ns TA Free Air Operating Temperature b55 125 0 70 §C Note 1: CL e 15 pF, R L e 2k X,T A e 25§C and V CC e 5V. Note 2: CL e 50 pF, R L e 2k X,T A e 25§C and V CC e 5V. Note 3: TA e 25§C and V CC e 5V. Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units(Note 4) VI Input Clamp Voltage V CC e Min, I I eb 18 mA b1.5 V VOH High Level Output V CC e Min, I OH e Max DM54 2.5 3.4 VVoltage V IL e Max, V IH e Min DM74 2.7 3.4 VOL Low Level Output V CC e Min, I OL e Max DM54 0.25 0.4 Voltage V IL e Max, V IH e Min DM74 0.35 0.5 V IOL e 4 mA, V CC e Min DM74 0.25 0.4 II Input Current @ Max V CC e Max Enable T 0.2 mAInput Voltage V I e 7V Others 0.1 IIH High Level Input V CC e Max Enable T 40 mACurrent V I e 2.7V Others 20 IIL Low Level Input V CC e Max Enable T b0.8 mACurrent V I e 0.4V Others b0.4 IOS Short Circuit V CC e Max DM54 b20 b100 mAOutput Current (Note 5) DM74 b20 b100 ICC Supply Current V CC e Max (Note 6) 20 34 mA Note 4: All typicals are at V CC e 5V and T A e 25§C. Note 5: Not more than one output should be shorted at a time, and the duration should not exceed one second. Note 6: ICC is measured after a momentary 4.5V, then ground, is applied to the CLOCK with all other inputs grounded and all the outputs open.

Switching Characteristics at V CC e 5V and T A e 25§C (See Section 1 for Test Waveforms and Output Load) From (Input) RL e 2k X Symbol Parameter To (Output) CL e 15 pF C L e 50 pF Units Min Max Min Max fMAX Maximum Clock 25 20 MHzFrequency tPLH Propagation Delay Time Clock to 35 39 nsLow to High Level Output Ripple Carry tPHL Propagation Delay Time Clock to 35 44 nsHigh to Low Level Output Ripple Carry tPLH Propagation Delay Time Clock to 20 24 nsLow to High Level Output Any Q tPHL Propagation Delay Time Clock to 23 32 nsHigh to Low Level Output Any Q tPLH Propagation Delay Time Enable T to 18 24 nsLow to High Level Output Ripple Carry tPHL Propagation Delay Time Enable T to 18 28 nsHigh to Low Level Output Ripple Carry tPLH Propagation Delay Time Up/Down to 25 30 nsLow to High Level Output Ripple Carry (Note 1) tPHL Propagation Delay Time Up/Down to 29 38 nsHigh to Low Level Output Ripple Carry (Note 1) Note 1: The propagation delay from UP/DOWN to RIPPLE CARRY must be measured with the counter at either a minimum or a maximum count. As the logic level of the up/down input is changed, the ripple carry output will follow. If the count is minimum, the ripple carry output transition will be in phase. If the count is maximum, the ripple carry output will be out of phase.

TL/F/6401–2

Typical Load, Count, and Inhibit Sequences TL/F/6401–3

Physical Dimensions inches (millimeters) Ceramic Leadless Chip Carrier Package (E) Order Number 54LS169LMQB 16-Lead Ceramic Dual-In-Line Package (J) Order Number 54LS169DMQB or DM54LS169AJ

Physical Dimensions inches (millimeters) (Continued) 16-Lead Small Outline Molded Package (M) Order Number DM74LS169AM 16-Lead Molded Dual-In-Line Package (N) Order Number DM74LS169AN

54LS169/DM54LS169A/DM74LS169A Synchronous 4-Bit Up/Down Binary Counter Physical Dimensions inches (millimeters) (Continued) 16-Lead Ceramic Flat Package (W) Order Number 54LS169FMQB or DM54LS169AW LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.

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