54F243 NSC | Alldatasheet
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Y 2-Way asynchronous data bus communication Y Input clamp diodes limit high-speed termination effects Y Guaranteed 4000V minimum ESD protection Commercial Military Package Package DescriptionNumber 54F243DM (Note 2) J14A 14-Lead Ceramic Dual-In-Line 74F243SC (Note 1) M14A 14-Lead (0.150 × Wide) Molded Small Outline, JEDEC 54F243FM (Note 2) W14B 14-Lead Cerpack 54F243LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C Note 1: Devices also available in 13 × reel. Use Suffix e SCX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Logic Symbol IEEE/IEC TL/F/9502–3 Connection Diagrams Pin Assignment for DIP, SOIC and Flatpak TL/F/9502–1 Pin Assignment for LCC TL/F/9502–2 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.
Pin Names Description U.L. Input I IH/IIL HIGH/LOW Output I OH/IOL E1 Enable Input (Active LOW) 1.0/1.67 20 mA/b1m A E2 Enable Input (Active HIGH) 1.0/1.67 20 mA/b1m A An,B n Inputs 3.5/2.67 70 mA/b1.6 mA Outputs 600/106.6(80) b12 mA/64 mA(48 mA) Truth Table Inputs Inputs/Outputs E1 E2 An Bn H e HIGH Voltage Level L e LOW Voltage Level L L Input B e A Z e High Impedance N/A e Not AllowedL H N/A N/A HL Z Z HH A e B Input
Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b65§Ct o a150§C Ambient Temperature under Bias b55§Ct o a125§C Junction Temperature under Bias b55§Ct o a175§C Plastic b55§Ct o a150§C VCC Pin Potential to Ground Pin b0.5V to a7.0V Input Voltage (Note 2) b0.5V to a7.0V Input Current (Note 2) b30 mA to a5.0 mA Voltage Applied to Output in HIGH State (with V CC e 0V) Standard Output b0.5V to V CC TRI-STATE Output b0.5V to a5.5V Current Applied to Output in LOW State (Max) twice the rated I OL (mA) ESD Last Passing Voltage (Min) 4000V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Recommended Operating Conditions Free Air Ambient Temperature Military b55§Ct o a125§C Commercial 0 §Ct o a70§C Supply Voltage Military a4.5V to a5.5V Commercial a4.5V to a5.5V Symbol Parameter 54F/74F Units V CC Conditions Min Typ Max VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal VCD Input Clamp Diode Voltage b1.2 V Min I IN eb 18 mA VOH Output HIGH 54F 10% V CC 2.4 I OH eb 3m A( A n,B n) Voltage 54F 10% V CC 2.0 I OH eb 12 mA (A n,B n) 74F 10% V CC 2.4 V Min I OH eb 3m A( A n,B n) 74F 10% V CC 2.0 I OH eb 15 mA (A n,B n) 74F 5% V CC 2.7 I OH eb 3m A( A n,B n) VOL Output LOW 54F 10% V CC 0.55 V Min IOL e 48 mA (A n,B n) Voltage 74F 10% V CC 0.55 I OL e 64 mA (A n,B n) IIH Input HIGH 54F 20.0 mA Max VIN e 2.7V Current 74F 5.0 IBVI Input HIGH Current 54F 100 mA Max VIN e 7.0V (E 1,E 2) Breakdown Test 74F 7.0 IBVIT Input HIGH Current 54F 1.0 mA Max VIN e 5.5V (A n,B n) Breakdown (I/O) 74F 0.5 ICEX Output HIGH 54F 250 mA Max VOUT e VCC Leakage Current 74F 50 VID Input Leakage 74F 4.75 V 0.0 IID e 1.9 mA Test All Other Pins Grounded IOD Output Leakage 74F 3.75 mA 0.0 VIOD e 150 mV Circuit Current All Other Pins Grounded IIL Input LOW Current b1.0 mA Max V IN e 0.5V (E 1,E 2) IIH a IOZH Output Leakage Current 70 mA Max V OUT e 2.7V (A n,B n) IIL a IOZL Output Leakage Current b1.6 mA Max V OUT e 0.5V (A n,B n) IOS Output Short-Circuit Current b100 b225 mA Max V OUT e 0V (A n,B n) ICCH Power Supply Current 64 80 mA Max V O e HIGH ICCL Power Supply Current 64 90 mA Max V O e LOW ICCZ Power Supply Current 71 90 mA Max V O e HIGH Z
TA ea 25§C TA,V CC e Mil T A,V CC e ComSymbol Parameter V CC ea 5.0V CL e 50 pF C L e 50 pF Units CL e 50 pF Min Typ Max Min Max Min Max
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 243 S C X Temperature Range Family Special Variations 74F e Commercial QB e Military grade device with 54F e Military environmental and burn-in processingDevice Type X e Devices shipped in 13 × reel Package Code Temperature RangeD e Ceramic DIP C e Commercial (0 §Ct o a70§C)F e Flatpak M e Military ( b55§Ct o a125§C)L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L)
Physical Dimensions inches (millimeters) (Continued) 14-Lead Ceramic Dual-In-Line Package (D) 14-Lead (0.150 × Wide) Molded Small Outline Package, JEDEC (S)
54F/74F243 Quad Bus Transceiver with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) 14-Lead Ceramic Flatpak (F) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.
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