54F182DM NSC | Alldatasheet

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Y Provides lookahead carries across a group of four ALUs Y Multi-level lookahead high-speed arithmetic operation over long word lengths Y Guaranteed 4000V minimum ESD protection Commercial Military Package Package DescriptionNumber 74F182PC N16E 16-Lead (0.300 × Wide) Molded Dual-In-Line 54F182DM (Note 2) J16A 16-Lead Ceramic Dual-In-Line 74F182SJ (Note 1) M16D 16-Lead (0.300 × Wide) Molded Small Outline, EIAJ 54F182FM (Note 2) W16A 16-Lead Cerpack 54F182LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C Note 1: Devices also available in 13 × reel. Use suffix e SCX and SJX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB Logic Symbols Connection Diagrams IEEE/IEC TL/F/9492–6 TL/F/9492–3 Pin Assignment for DIP, SOIC and Flatpak TL/F/9492–1 Pin Assignment for LCC TL/F/9492–2 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.

FIGURE 1. 32-Bit ALU with Rippled Carry between 16-Bit Lookahead ALUs

Cn G0 P0 G1 P1 G2 P2 G3 P3 Cnax Cnay Cnaz G P XHH L LHX L XLX H HXL H XXXH H L XHHHX L LHXHX L XXXLX H XLXXL H HXLXL H XXXXXHH L X XXHHHX L XHHHXHX L LHXHXHX L XXXXXLX H XXXLXXL H XLXXLXL H HXLXLXL H X XXXXHH H XX X H H H X H X HHHXHX H H HXHXHX H X XXXXLX L X XXLXXL L XL X X L X L L L XLXLXL L HXXX H XHXX H XXHX H XXXH H LLLL L H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial Logic Diagram TL/F/9492–4 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b65§Ct o a150§C Ambient Temperature under Bias b55§Ct o a125§C Junction Temperature under Bias b55§Ct o a175§C Plastic b55§Ct o a150§C VCC Pin Potential to Ground Pin b0.5V to a7.0V Input Voltage (Note 2) b0.5V to a7.0V Input Current (Note 2) b30 mA to a5.0 mA Voltage Applied to Output in HIGH State (with V CC e 0V) Standard Output b0.5V to V CC TRI-STATEÉ Output b0.5V to a5.5V Current Applied to Output in LOW State (Max) twice the rated I OL (mA) ESD Last Passing Voltage (Min) 4000V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Recommended Operating Conditions Free Air Ambient Temperature Military b55§Ct o a125§C Commercial 0 §Ct o a70§C Supply Voltage Military a4.5V to a5.5V Commercial a4.5V to a5.5V Symbol Parameter 54F/74F Units V CC Conditions Min Typ Max VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal VCD Input Clamp Diode Voltage b1.2 V Min I IN eb 18 mA VOH Output HIGH 54F 10% V CC 2.5 I OH eb 1m A Voltage 74F 10% V CC 2.5 V Min I OH eb 1m A 74F 5% V CC 2.7 I OH eb 1m A VOL Output LOW 54F 10% V CC 0.5 V Min IOL e 20 mA Voltage 74F 10% V CC 0.5 I OL e 20 mA IIH Input HIGH 54F 20.0 mA Max VIN e 2.7V Current 74F 5.0 IBVI Input HIGH Current 54F 100 mA Max VIN e 7.0V Breakdown Test 74F 7.0 ICEX Output HIGH 54F 250 mA Max VOUT e VCC Leakage Current 74F 50 VID Input Leakage 74F 4.75 V 0.0 IID e 1.9 mA Test All Other Pins Grounded IOD Output Leakage 74F 3.75 mA 0.0 VIOD e 150 mV Circuit Current All Other Pins Grounded IIL Input LOW b1.2 V IN e 0.5V (C n) Current b2.4 V IN e 0.5V (P 3) b3.6 mA Max VIN e 0.5V (P 2) b4.8 V IN e 0.5V (G 3,P 0,P 1) b8.4 V IN e 0.5V (G 0,G 2) b9.6 V IN e 0.5V (G 1) IOS Output Short-Circuit Current b60 b150 mA Max V OUT e 0V ICCH Power Supply Current 18.4 28.0 mA Max V O e HIGH ICCL Power Supply Current 23.5 36.0 mA Max V O e LOW

TA ea 25§C TA,V CC e Mil T A,V CC e ComSymbol Parameter V CC ea 5.0V CL e 50 pF C L e 50 pF Units CL e 50 pF Min Typ Max Min Max Min Max Cnax,C nay,o rC naz Cnax,C nay,o rC naz

Ordering Information

The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 182 P C QB Temperature Range Family Special Variations 74F e Commercial QB e Military grade with 54F e Military environmental and burn-in processing shipped in tubesDevice Type Temperature RangePackage Code C e Commercial (0 §Ct o a70§C)P e Plastic DIP M e Military ( b55§Ct o a125§C)D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) SJ e Small Outline SOIC EIAJ

Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) 16-Lead Ceramic Dual-In-Line Package (D)

Physical Dimensions inches (millimeters) (Continued) 16-Lead (0.300 × Wide) Molded Small Outline Package, EIAJ (SJ) 16-Lead (0.300 × Wide) Molded Dual-In-Line Package (P)

54F/74F182 Carry Lookahead Generator Physical Dimensions inches (millimeters) (Continued) 16-Lead Ceramic Flatpak (F) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.

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