54F157ADM NSC | Alldatasheet

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Y Guaranteed 4000V minimum ESD protection Commercial Military Package Package DescriptionNumber 74F157APC N16E 16-Lead (0.300 × Wide) Molded Dual-In-Line 54F157ADM (Note 2) J16A 16-Lead Ceramic Dual-In-Line 74F157ASC (Note 1) M16A 16-Lead (0.150 × Wide) Molded Small Outline, JEDEC 74F157ASJ (Note 1) M16D 16-Lead (0.300 × Wide) Molded Small Outline, EIAJ 54F157AFM (Note 2) W16A 16-Lead Cerpack 54F157ALM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C Note 1: Devices also available in 13 × reel. Use suffix e SCX and SJX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Logic Symbols TL/F/9483–3 IEEE/IEC TL/F/9483–5 Connection Diagrams Pin Assignment for DIP, SOIC and Flatpak TL/F/9483–1 Pin Assignment for LCC TL/F/9483–2 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.

Pin Names Description U.L. Input I IH/IIL HIGH/LOW Output I OH/IOL I0a –I0d Source 0 Data Inputs 1.0/1.0 20 mA/b0.6 mA I1a –I1d Source 1 Data Inputs 1.0/1.0 20 mA/b0.6 mA E Enable Input (Active LOW) 1.0/1.0 20 mA/b0.6 mA S Select Input 1.0/1.0 20 mA/b0.6 mA Za –Zd Outputs 50/33.3 b1 mA/20 mA Functional Description The ’F157A is a quad 2-input multiplexer. It selects four bits of data from two sources under the control of a common Select input (S). The Enable input (E ) is active LOW. When E is HIGH, all of the outputs (Z) are forced LOW regardless of all other inputs. The ’F157A is the logic implementation of a 4-pole, 2-position switch where the position of the switch is determined by the logic levels supplied to the Select in- put. The logic equations for the outputs are shown below: Z n e E # (I1n S a I0n S) A common use of the ’F157A is the moving of data from two groups of registers to four common output busses. The par- ticular register from which the data comes is determined by the state of the Select input. A less obvious use is as a function generator. The ’F157A can generate any four of the 16 different functions of two variables with one variable common. This is useful for implementing highly irregular logic. Truth Table Inputs Output E SI 0 I1 Z HXXX L LHXL L LHXH H LLLX L LL H X H H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial Logic Diagram TL/F/9483–4 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b65§Ct o a150§C Ambient Temperature under Bias b55§Ct o a125§C Junction Temperature under Bias b55§Ct o a175§C Plastic b55§Ct o a150§C VCC Pin Potential to Ground Pin b0.5V to a7.0V Input Voltage (Note 2) b0.5V to a7.0V Input Current (Note 2) b30 mA to a5.0 mA Voltage Applied to Output in HIGH State (with V CC e 0V) Standard Output b0.5V to V CC TRI-STATEÉ Output b0.5V to a5.5V Current Applied to Output in LOW State (Max) twice the rated I OL (mA) ESD Last Passing Voltage (Min) 4000V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Recommended Operating Conditions Free Air Ambient Temperature Military b55§Ct o a125§C Commercial 0 §Ct o a70§C Supply Voltage Military a4.5V to a5.5V Commercial a4.5V to a5.5V Symbol Parameter 54F/74F Units V CC Conditions Min Typ Max VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal VCD Input Clamp Diode Voltage b1.2 V Min I IN eb 18 mA VOH Output HIGH 54F 10% V CC 2.5 I OH eb 1m A Voltage 74F 10% V CC 2.5 V Min I OH eb 1m A 74F 5% V CC 2.7 I OH eb 1m A VOL Output LOW 54F 10% V CC 0.5 V Min IOL e 20 mA Voltage 74F 10% V CC 0.5 I OL e 20 mA IIH Input HIGH 54F 20.0 mA Max VIN e 2.7V Current 74F 5.0 IBVI Input HIGH Current 54F 100 mA Max VIN e 7.0V Breakdown Test 74F 7.0 ICEX Output HIGH 54F 250 mA Max VOUT e VCC Leakage Current 74F 50 VID Input Leakage 74F 4.75 V 0.0 IID e 1.9 mA Test All Other Pins Grounded IOD Output Leakage 74F 3.75 mA 0.0 VIOD e 150 mV Circuit Current All Other Pins Grounded IIL Input LOW Current b0.6 mA Max V IN e 0.5V IOS Output Short-Circuit Current b60 b150 mA Max V OUT e 0V ICCH Power Supply Current 15 23 mA Max V O e HIGH ICCL Power Supply Current 15 23 mA Max V O e LOW

TA ea 25§C TA,V CC e Mil T A,V CC e ComSymbol Parameter V CC ea 5.0V CL e 50 pF C L e 50 pF Units CL e 50 pF Min Typ Max Min Max Min Max

Ordering Information

The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 157A S C X Temperature Range Family Special Variations 74F e Commercial QB e Military grade device with 54F e Military environmental and burn-in processingDevice Type X e Devices shipped in 13 × reel Package Code Temperature RangeP e Plastic DIP C e Commercial (0 §Ct o a70§C)D e Ceramic DIP M e Military ( b55§Ct o a125§C)F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ

Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) 16-Lead Ceramic Dual In-Line Package (D)

Physical Dimensions inches (millimeters) (Continued) 16-Lead (0.150 × Wide) Molded Small Outline Package, JEDEC (S)

Physical Dimensions inches (millimeters) (Continued) 16-Lead (0.300 × Wide) Molded Small Outline Package, EIAJ (SJ) 16-Lead (0.300 × Wide) Molded Dual In-Line Package (P)

54F/74F157A Quad 2-Input Multiplexer Physical Dimensions inches (millimeters) (Continued) 16-Lead Ceramic Flatpak (F) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor National Semiconductores National Semiconductor Corporation GmbH Japan Ltd. Hong Kong Ltd. Do Brazil Ltda. (Australia) Pty, Ltd. 2900 Semiconductor Drive Livry-Gargan-Str. 10 Sumitomo Chemical 13th Floor, Straight Block, Rue Deputado Lacorda Franco Building 16 P.O. Box 58090 D-82256 F 4urstenfeldbruck Engineering Center Ocean Centre, 5 Canton Rd. 120-3A Business Park Drive Santa Clara, CA 95052-8090 Germany Bldg. 7F Tsimshatsui, Kowloon Sao Paulo-SP Monash Business Park Tel: 1(800) 272-9959 Tel: (81-41) 35-0 1-7-1, Nakase, Mihama-Ku Hong Kong Brazil 05418-000 Nottinghill, Melbourne TWX: (910) 339-9240 Telex: 527649 Chiba-City, Tel: (852) 2737-1600 Tel: (55-11) 212-5066 Victoria 3168 Australia Fax: (81-41) 35-1 Ciba Prefecture 261 Fax: (852) 2736-9960 Telex: 391-1131931 NSBR BR Tel: (3) 558-9999 Tel: (043) 299-2300 Fax: (55-11) 212-1181 Fax: (3) 558-9998 Fax: (043) 299-2500 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.