DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
UDFN4 1.0x1.0, 0.65P CASE 517BR−01 ISSUE O DATE 27 OCT 2010SCALE 4:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. ÏÏ ÏÏ A B E D BOTTOM VIEW b e NOTE 3 2X 0.05 C PIN ONE REFERENCE TOP VIEW 2X 0.05 C A (A3) 0.05 C 0.05 C C SEATING PLANESIDE VIEW L3X 1 2 DIM MIN MAX MILLIMETERS A −−− 0.60 A1 0.00 0.05 A3 0.10 REF b 0.20 0.30 D 1.00 BSC D2 0.43 0.53 E 1.00 BSC e 0.65 BSC L 0.20 0.30 L2 0.27 0.37 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MOUNTING FOOTPRINT* DETAIL A 1.30 0.300.53 4X DIMENSIONS: MILLIMETERS 0.522X RECOMMENDED GENERIC MARKING DIAGRAM* XX = Specific Device Code MM = Date Code *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ /C0071”, may or may not be present. XX MM PACKAGE OUTLINE DETAIL A DETAIL B L3 0.02 0.12 DETAIL B NOTE 4 e/2 45 /C0053 AM0.05 B C 4 3 0.65 PITCH typ c 0.18 0.234X0.433X 0.103X MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS http://onsemi.com © Semiconductor Components Industries, LLC, 2002 October, 2002 − Rev. 0 Case Outline Number: XXX DOCUMENT NUMBER: STATUS: NEW STANDARD: DESCRIPTION: 98AON53254E ON SEMICONDUCTOR STANDARD UDFN4, 1.0X1.0, 0.65P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2
DOCUMENT NUMBER: 98AON53254E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY B. LOFTS. 27 OCT 2010 © Semiconductor Components Industries, LLC, 2010 October, 2010 − Rev. 01O Case Outline Number: 517BR ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, in cluding without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney f ees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.