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Technical content

Features

 Low Series Resistance: 1.0 Ω Typical

Applications

This general purpose PIN diode is intended for low power switching applications such as duplexers, antenna switch- ing matrices, digital phase shifters, time multiplex fi lters, TR switches, pulse and amplitude modulators, limiters, leveling circuits, and attenuators. Maximum Ratings Junction Operating and Storage Temperature Range -65°C to +150°C Soldering Temperature +425°C for 1 min. max. Nearest Typical Chip Equivalent Minimum Maximum Typical Reverse Part Packaged Breakdown Junction Series Typical Recovery Number Part No. Voltage Capacitance Resistance Lifetime Time 5082- 5082- V BR (V) C j (pF) R S (ΩΩΩΩΩ) τττττ (ns) t rr (ns) 0012 3001 150 0.12 1.0 400 100 Test V R = VBR VR = 50 V I F = 100 mA I F = 50 mA I F = 20 mA Conditions Measure f = 1 MHz f = 100 MHz I R = 250 mA V R = 10 V IR ≤ 10 mA 90% Recovery D X Y X 0.10 (4) 0.38 (15) 0.23 (9.0) Au. Cathode Au. Anode D ±0.03 (1) X ±0.05 (2) Y ±0.03 (1) Top Contact Bottom Contact Dimensions in millimeters (1/1000 inch) DIMENSIONS Electrical Specifi cations at TA = 25°C Typical Parameters

For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-4778EN AV02-3802EN - September 12, 2012 Assembly and Handling Procedures for PIN Chips 1. Storage Devices should be stored in a dry nitrogen purged des- sicator or equivalent. 2. Cleaning If required, surface contamination may be removed with electronic grade solvents. Typical solvents, such methanol, or their locally approved equivalents, can be used singularly or in combinations. Typical cleaning times per solvent are one to three minutes. DI water and methanol should be used (in that order) in the fi - nal cleans. Final drying can be accomplished by plac- ing the cleaned dice on clean fi lter paper and drying with an infrared lamp for 5-10 minutes. Acids such as hydrofl uoric (HF), nitric (HNO3) and hydrochloric (HCl) should not be used. The eff ects of cleaning methods/solutions should be verifi ed on small samples prior to submitting the entire lot. Following cleaning, dice should be either used in as- sembly (typically within a few hours) or stored in clean containers in a reducing atmosphere or a vacuum chamber. 3. Die Attach a. Eutectic AuSn preform with stage temperature of 310°C for one minute max. AuGe preform with stage tempera- ture of 390°C for one minute max. b. Epoxy For epoxy die-attach, conductive silver-fi lled or goldfi lled epoxies are recommended. This method can be used for all Avago PIN chips. 4. Wire Bonding Either ultrasonic or thermocompression bonding tech- niques can be employed. Suggested wire is pure gold, 0.7 to 1.5 mil diameter.