5078D501200E

CEM501_V01 AXIOMTEK | Alldatasheet

Document overview

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• PDF pages: 2

Technical content

• All specifications and photos are subject to change without notice. Standard CEM501PG-CEL-3955U (P/N : E38D501100) COM Express Type 6 compact module Intel® Celeron® 3955U (2.0 GHz), DDI/LVDS, GbE LAN, USB 3.0 and TPM CEM501PG-i7-6600U (P/N: E38D501102) COM Express Type 6 compact module with Intel® Core™ i7-6600U (2.6 GHz), DDI/LVDS, GbE LAN, USB 3.0 and TPM CEM501PG-i5-6300U (P/N: E38D501103) COM Express Type 6 compact module with Intel® Core™ i5-6300U (2.4 GHz), DDI/LVDS, GbE LAN, USB 3.0 and TPM CEM501PG-i3-6100U (P/N: E38D501101) COM Express Type 6 compact module with Intel® Core™ i3-6100U (2.3 GHz), DDI/LVDS, GbE LAN, USB 3.0 and TPM Optional CEB94011 (P/N: E394011100) CEB94011 COM Express Type 6 evaluation board TS007-CEM501 (P/N: E39J007100) CEM501 heat sink with fan 5078D501200E CEM501 heat spreader CPU 6th gen Intel® Core™ processor: i7-6600U 2.6 GHz, i5-6300U 2.4 GHz, i3-6100U 2.3 GHz, Celeron®-3955U

2.0 GHz (Skylake-U) onboard

System Memory 2 x 260-pin DDR4-2133 SO-DIMM, up to 32GB Chipset SoC integrated BIOS AMI uEFI (Legacy free) SSD N/A Watchdog Timer 65536 levels, 0 ~ 65535 sec. Expansion Interface 6 lanes of PCI Express Gen. 3.0 Battery Lithium N/A Power Input ATX: +12V, +5VSB AT: +12V Size 95 x 95 mm Board Thickness 2.0 mm Temperature -40°C ~ +85°C (-40°F ~ +185°F), operation Operation Humidity 10% ~ 95% relative humidity, non-condensing Vibration 3.5 Grms MIO 1 x LPC interface 1 x SPI interface 2 x Serial TX/RX 1 x I C interface SATA 3 x SATA-600 Hardware Monitoring Yes Ethernet 1 port as 10/100/1000 Mbps supports Wake-on-LAN, PXE Boot ROM with Intel® i219LM Audio HD link interface to baseboard for Codec USB 4 x USB 3.0 and 8 x USB 2.0 TPM TPM 1.2 SMBus Yes Digital I/O 4 channels IN & 4 channels OUT (SDIO optional) Battery Support Yes Chipset Intel® Gen 9 Graphics Engine support Gfx - DX12.0, OCL2.0, OGL4.3 Display Interface 2 x DDI (DP/HDMI/DVI). The 2nd DDI could be configured to VGA (optional) 1 x LVDS; 18/24-bit dual channel (eDP optional) CEM501 COM Express Type 6 Compact Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® Processor I/O Packing List Core System Quick installation guide Display

Ordering Information

USB 3.0 USBUSB TripleView Full Solid Cap Design Low Power AiRD Rear view COM Express interface connector 6th gen Intel® Core™ processor 2 x DDR4 SO-DIMMFeatures

• 6th gen Intel® Core™ i7/i5/i3 and Celeron® processors (Skylake-U)
• 2 DDR4-2133 SO-DIMM, up to 32GB
• Max. up to 6 lanes of PCI Express
• 3 SATA-600
• 4 USB 3.0 and 8 USB 2.0
• AXView 2.0 intelligent remote management software
• TPM 1.2 supported AXView Updated May. 29, 2018.

6 Module

Intel® CPU Skylake-U CEM501 Jumper DP to VGA DDR4 SO-DIMM-A/B Jumper eDP to LVDS EC SPI ROM TPM LAN I219 COM Express Type 6 connector ROW C-D COM Express Type 6 connector ROW A-B 2 x DDI 2 (Lower) 2 x DDI 2 (Upper) 4 x DDI 1 4 x USB 3.0 3 x SATA III HDA 8 x USB 2.0 SPI GPIO 2 x RS-232 LPC SMBUS 6 x PCIe 1 x PCIe MDI x4 VGA 2 x eDP 2 x eDP LVDS CH.B LVDS CH.A SDIO Jumper Updated May. 29, 2018.